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US4801995A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device

Assignee: Toshiba Corp
•
Filing: 1985-12-20
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Granted: 1989-01-31
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Expires: 2005-12-20
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Abstract

Abstract A semiconductor device includes a metal film, not in ohmic contact with a guard ring region (a second region). The metal film is formed on that surface portion of an insulating film under which the guard ring region is formed to surround a base region (a first region) of a planar transistor. In this arrangement, a planar semiconductor device with a high withstand voltage, which is free of short-circuiting between electrodes upon the measurement of the withstand voltage and involves no degeneration of the withstand voltage resulting from an atmospheric humidity, can be obtained. The metal film, which is not in contact with the guard ring region, is "electrically floated", i.e., is not in contact with any area inclusive of the guard ring region.

Inventors

  • 👤 Masaaki Iwanishi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 23:25
CPC Classifications
H; H10; H10D; H10D10/00; H10D10/40; H10D10/421; H10D30/00; H10D30/60; H10D30/64; H10D30/66; H10D30/668; H10D62/00; H10D62/10; H10D62/102; H10D62/103; H10D62/105; H10D62/106; H10D62/113; H10D64/00; H10D64/111; H10D64/118

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 124 words
A semiconductor device comprising: a first region formed in a semiconductor substrate, said semiconductor substrate being of a first conductivity type and said first region being of a second conductivity type; a second region of the second conductivity type formed to surround the outer side of said first region, said second region being a guard ring for said first region; an insulating film formed on the surface of the semiconductor substrate; a first electrode formed on said insulating film, said first electrode being in ohmic contact with said first region; and a metal film formed on said surface portion of said insulating film situated above said second region, said metal film being electrically isolated from elements of said semiconductor device including said second region.
Claim 2
Dependent Claim 124 words
A semiconductor device comprising: a first region formed in a semiconductor substrate, said semiconductor substrate being of a first conductivity type and said first region being of a second conductivity type; a second region of the second conductivity type formed to surround the outer side of said first region, said second region being a guard ring for said first region; an insulating film formed on the surface of the semiconductor substrate; a first electrode formed on said insulating film, said first electrode being in ohmic contact with said first region; and a metal film formed on said surface portion of said insulating film situated above said second region, said metal film being electrically isolated from elements of said semiconductor device including said second region.
Claim 3
Dependent Claim 21 words
A semiconductor device according to claim 1, in which said second region has a ring-like shape which surrounds said first region.
Claim 4
Dependent Claim 21 words
A semiconductor device according to claim 1, in which said second region is exposed on the surface of said semiconductor substrate.
Claim 5
Dependent Claim 21 words
A semiconductor device according to claim 2, in which said second region is exposed on the surface of said semiconductor substrate.
Claim 6
Dependent Claim 17 words
A semiconductor device according to claim 1, in which plural regions are provided for said second region.
Claim 7
Dependent Claim 26 words
A semiconductor device according to claim 1, in which said second region comprises a plurality of coaxial ring-shaped regions each of which surrounds said first region.
Claim 8
Dependent Claim 17 words
A semiconductor device according to claim 3, in which plural regions are provided for said second region.
Claim 9
Dependent Claim 26 words
A semiconductor device according to claim 3, in which said second region comprises a plurality of coaxial ring-shaped regions each of which surrounds said first region.
Claim 10
Dependent Claim 34 words
A semiconductor device according to claim 5, in which said metal film is formed on that surface portion of said insulating film which is situated above said second region nearest to said first region.
Claim 11
Dependent Claim 34 words
A semiconductor device according to claim 6, in which said metal film is formed on that surface portion of said insulating film which is situated above said second region nearest to said first region.
Claim 12
Dependent Claim 14 words
A semiconductor device according to claim 2, which is of a planar, bipolar type.
Claim 13
Dependent Claim 14 words
A semiconductor device according to claim 3, which is of a planar, bipolar type.
Claim 14
Dependent Claim 14 words
A semiconductor device according to claim 5, which is of a planar, bipolar type.
Claim 15
Dependent Claim 14 words
A semiconductor device according to claim 6, which is of a planar, bipolar type.
Claim 16
Dependent Claim 14 words
A semiconductor device according to claim 9, which is of a planar, bipolar type.

References Cited (Backward Citations)

US3728166A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-01-31 1992-08-01 1993-01-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-01-31 1996-08-01 1997-01-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-01-31 2000-08-01 2001-01-31 $7700.00 Window Closed / Lapsed

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