Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
188 words
A two-terminal semiconductor diode arrangement, comprising: a semi-insulating substrate having first and second major surfaces; a semiconductor diode located on the first major surface of said semi-insulating substrate, said diode having an upper portion and a lower base portion, the lower base portion having an annular upper surface extending outwardly from the base of the upper portion; a first metal contact in electrical contact with the upper portion of said semiconductor diode; a second metal contact in the shape of a ring located on and making electrical contact to the annular upper surface of the lower base portion; a layer of dielectric material disposed over said semiconductor diode, first and second metal contacts, and first major surface of said substrate, said dielectric layer having a first hole therethrough to said first metal contact; metallic heat sink means thermally and electrically coupled to said first metal contact through said first hole, said semi-insulating substrate and lower base portion having a second offset hole extending vertically therethrough to said ring-shaped metal contact; and a metallic bias line making electrical contact to said second ring-shaped contact through said second offset hole.
Claim 2
Dependent Claim
188 words
A two-terminal semiconductor diode arrangement, comprising: a semi-insulating substrate having first and second major surfaces; a semiconductor diode located on the first major surface of said semi-insulating substrate, said diode having an upper portion and a lower base portion, the lower base portion having an annular upper surface extending outwardly from the base of the upper portion; a first metal contact in electrical contact with the upper portion of said semiconductor diode; a second metal contact in the shape of a ring located on and making electrical contact to the annular upper surface of the lower base portion; a layer of dielectric material disposed over said semiconductor diode, first and second metal contacts, and first major surface of said substrate, said dielectric layer having a first hole therethrough to said first metal contact; metallic heat sink means thermally and electrically coupled to said first metal contact through said first hole, said semi-insulating substrate and lower base portion having a second offset hole extending vertically therethrough to said ring-shaped metal contact; and a metallic bias line making electrical contact to said second ring-shaped contact through said second offset hole.
Claim 3
Dependent Claim
27 words
A two-terminal diode arrangement as defined in claim 1 wherein said upper portion is substantially frusto-conical in shape and said lower base portion is substantially disc shaped.
Claim 4
Dependent Claim
31 words
A two-terminal diode arrangement as defined in claim 1 wherein said upper portion is of a first conductivity type and said lower base portion is of a second opposite conductivity type.
Claim 5
Dependent Claim
49 words
A two-terminal diode arrangement as defined in claim 1 wherein said semiconductor diode includes three layers: a bottom layer adjacent to said substrate of N+ conductivity, a middle layer adjacent to the bottom layer of N conductivity, and a top layer adjacent to said middle layer of N+ conductivity.
Claim 6
Dependent Claim
48 words
A two-terminal diode as defined in claim 1 wherein said semiconductor diode includes three layers: a bottom layer adjacent to said substrate of N+ conductivity, a middle layer adjacent to the bottom layer of N conductivity and a top layer adjacent to said middle layer of P+ conductivity.
Claim 7
Dependent Claim
17 words
A two-terminal diode arrangement as defined in claim 1 wherein said dielectric layer is made of polyimide.
Claim 8
Dependent Claim
20 words
A two-terminal diode arrangement as defined in claim 6 further comprising a layer of silicon dioxide over said dielectric layer.
Claim 9
Dependent Claim
20 words
A two-terminal diode arrangement as defined in claim 6 further comprising a layer of silicon nitride over said dielectric layer.
Claim 10
Dependent Claim
17 words
A two-terminal diode arrangement as defined in claim 1 further comprising means for biasing said semiconductor diode.
Claim 11
Dependent Claim
19 words
A two-terminal diode arrangement as defined in claim 1 wherein said semiconductor diode is made of III-V semiconductor material.
Claim 12
Dependent Claim
18 words
A two-terminal diode arrangement as defined in claim 10 wherein said semiconductor diode is made of gallium arsenide.
Claim 13
Dependent Claim
18 words
A two-terminal diode arrangement as defined in claim 10 wherein said semiconductor diode is made of indium phosphide.
Claim 14
Dependent Claim
174 words
A two-terminal diode arrangement, comprising: a semi-insulating substrate having first and second essentially parallel major surfaces; a semiconductor diode located on the first major surface of said semi-insulating substrate, said diode having an upper disc-shaped portion and a lower disc-shaped base portion, the lower base portion having an upper surface extending outwardly from the base of the upper portion; a first electrical contact on the upper portion of said semiconductor; a metal contact in the shape of a ring making electrical contact to the upper surface of the lower base portion; a layer of dielectric material overlying said semiconductor diode having a first hole extending vertically therethrough to said first electrical contact; a metallic heat sink extending into and filling said first via hole and contacting said first electrical contact; said substrate having a second offset hole extending vertically through said substrate and said lower base portion to said ring-shaped metal contact; and a metallic bias contact extending into and filling said second offset via hole making electrical contact to said ring-shaped metal contact.
Claim 15
Dependent Claim
174 words
A two-terminal diode arrangement, comprising: a semi-insulating substrate having first and second essentially parallel major surfaces; a semiconductor diode located on the first major surface of said semi-insulating substrate, said diode having an upper disc-shaped portion and a lower disc-shaped base portion, the lower base portion having an upper surface extending outwardly from the base of the upper portion; a first electrical contact on the upper portion of said semiconductor; a metal contact in the shape of a ring making electrical contact to the upper surface of the lower base portion; a layer of dielectric material overlying said semiconductor diode having a first hole extending vertically therethrough to said first electrical contact; a metallic heat sink extending into and filling said first via hole and contacting said first electrical contact; said substrate having a second offset hole extending vertically through said substrate and said lower base portion to said ring-shaped metal contact; and a metallic bias contact extending into and filling said second offset via hole making electrical contact to said ring-shaped metal contact.
Claim 16
Dependent Claim
46 words
A two-terminal diode arrangement as defined in claim 13 wherein said upper surface of lower base portion extends annularly around the base of the upper portion and said second metal contact is in the shape of a ring making electrical contact to the annular upper surface.
Claim 17
Dependent Claim
26 words
A two-terminal diode arrangement as defined in claim 13 wherein said upper portion is substantially frusto-conical in shape and said lower portion is substantially disk shaped.
Claim 18
Dependent Claim
45 words
A two-terminal diode arrangement as defined in claim 13 wherein said diode includes three layers, a layer adjacent the substrate of N+ conductivity-type, a middle layer adjacent the bottom layer of N+ conductivity and a top layer adjacent the middle layer of an N+ conductivity-type.
Claim 19
Dependent Claim
47 words
A two-terminal diode arrangement as defined in claim 13 wherein said semiconductor diode includes three layers, a bottom layer adjacent to the substrate of N+ conductivity, a middle layer adjacent the bottom layer of N-type conductivity, and a top layer adjacent the middle layer of P+ conductivity.
Claim 20
Dependent Claim
17 words
A two-terminal diode arrangement as defined in claim 13 further comprising means for biasing said semiconductor diode.