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Desmear and etchback using NF3 /O2 gas mixtures

Assignee: Versum Materials US LLC
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Filing: 1987-09-25
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Granted: 1988-11-29
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Expires: 2007-09-25
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Abstract

Abstract The present invention is directed to a method for plasma desmear and etchback of epoxy and polyimide materials from a multilayered or double sided printed circuit board using a plasma gas composition in the range of 20-45% NF 3 , the remainder being O 2 .

Inventors

  • 👤 John A. Barkanic
  • 👤 Donna M. Reynolds

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 22:23
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; C; C09; C09K; C09K13/00; C09K13/04; C09K13/08; H05K3/0011; H05K3/0055; H05K3/10; H05K3/18; H05K2203/00; H05K2203/09; H05K2203/095

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 96 words
In a method for desmearing printed circuit boards using a plasma gas desmearing medium produced between a pair of electrodes in an evacuated chamber wherein the material being desmeared is selected from the group consisting of epoxy and polyimide, the improvement comprising desmearing with a plasma comprising a gas mixture of 20-45% NF 3 the remainder being O 2 wherein the chamber is evacuated to a pressure in the range of 1000 to 3000 milli-Torr, and wherein the power density used to create the plasma is in the range of 0.08 to 0.25 wat/cm 2 .
Claim 2
Dependent Claim 96 words
In a method for desmearing printed circuit boards using a plasma gas desmearing medium produced between a pair of electrodes in an evacuated chamber wherein the material being desmeared is selected from the group consisting of epoxy and polyimide, the improvement comprising desmearing with a plasma comprising a gas mixture of 20-45% NF 3 the remainder being O 2 wherein the chamber is evacuated to a pressure in the range of 1000 to 3000 milli-Torr, and wherein the power density used to create the plasma is in the range of 0.08 to 0.25 wat/cm 2 .
Claim 3
Dependent Claim 12 words
The method of claim 1 wherein the material being desmeared is epoxy.
Claim 4
Dependent Claim 18 words
The method of claim 1 wherein the temperature of the plasma is in the range of 80°-140° C.
Claim 5
Dependent Claim 15 words
The method of claim 1 wherein the temperature of the plasma is approximately 100° C.
Claim 6
Dependent Claim 21 words
The method of claim 1 wherein the gas mixture comprises 25 to 40% NF 3 the remainder being O 2 .
Claim 7
Dependent Claim 19 words
The method of claim 1 wherein the gas mixture comprises approximately 35% NF 3 and 65% O 2 .

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-11-29 1992-05-30 1992-11-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-11-29 1996-05-30 1996-11-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-11-29 2000-05-30 2000-11-29 $7700.00 Window Closed / Lapsed

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