Patent US4786675A successfully refreshed from Google Patents.
US4786675A
Expired / Lapsed
US
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Sealed semiconductor containing an epoxy resin composition
Assignee: Zeon Corp
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Filing: 1987-04-29
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Granted: 1988-11-22
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Expires: 2007-04-29
Abstract
Abstract For use in sealing semiconductors, an epoxy resin composition is provided which comprises an epoxy resin, a curing agent, a filler and a modifier, wherein the modifier is a diene polymer or acrylic polymer having an iodine number of not more than 120 or both included in an amount of 1 to 50 parts by weight per 100 parts by weight of the epoxy resin.
Inventors
- 👤 Riso Iwata
- 👤 Yoichiro Kubo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:14
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C; C08; C08L; C08L63/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
88 words
A sealed semiconductor device comprising a molded epoxy resin composition for sealing semiconductors said epoxy resin composition comprising an epoxy resin, a curing agent for said epoxy resin, a filler and a modifier, wherein the modifier comprises a diene polymer which is a hydrogenated product of a polymer or copolymer prepared from at least one conjugated diene monomer having an iodine number of not more than 120 in an amount of 1 to 50 parts by weight of modifier per 100 parts by weight of the epoxy resin.
Claim 2
Dependent Claim
88 words
A sealed semiconductor device comprising a molded epoxy resin composition for sealing semiconductors said epoxy resin composition comprising an epoxy resin, a curing agent for said epoxy resin, a filler and a modifier, wherein the modifier comprises a diene polymer which is a hydrogenated product of a polymer or copolymer prepared from at least one conjugated diene monomer having an iodine number of not more than 120 in an amount of 1 to 50 parts by weight of modifier per 100 parts by weight of the epoxy resin.
Claim 3
Dependent Claim
15 words
The sealed semiconductor device of claim 1 wherein the diene polymer is a rubbery polymer.
Claim 4
Dependent Claim
25 words
The sealed semiconductor device of claim 1 wherein the diene polymer is a liquid polymer having a viscosity at 25° C. of 2,000 to 1,000,000.
Claim 5
Dependent Claim
26 words
The sealed semiconductor device of claim 1 wherein the diene polymer is selected from the group consisting of an ancrylonitrile/butadiene copolymer, a styrene/butadiene copolymer and polybutadiene.
Claim 6
Dependent Claim
41 words
The sealed semiconductor device of claim 1 wherein the filler is an inorganic filler selected from the group consisting of calcium carbonate, silica powder, zirconium silicate, calcium silicate, quartz glass powder, talc, clay, mica and glass fiber powders or mixtures thereof.
References Cited (Backward Citations)
GB809658A
Cited
US4119616A
Cited
US4073776A
Cited
US4073826A
Cited
US4251415A
Cited
US4259403A
Cited
US4480009A
Cited
US4460746A
Cited
US4476285A
Cited
US4588778A
Cited
US4503174A
Cited
US4632960A
Cited
US4617353A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-22 | 1992-05-23 | 1992-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-22 | 1996-05-23 | 1996-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-22 | 2000-05-23 | 2000-11-22 | $7700.00 | Window Closed / Lapsed |