US4784310A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for screen printing solder paste onto a substrate with device premounted thereon
Assignee: Motors Liquidation Co
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Filing: 1986-11-28
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Granted: 1988-11-15
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Expires: 2006-11-28
Abstract
Abstract A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the screen over the pre-mounted device to protect the device against damage during a subsequent screen printing operation. Different elements may, therefore, be bonded to a substrate in completely independent steps without the need for fluxing operations in later bonding operations.
Inventors
- 👤 David B. Metzger
- 👤 Glenn S. Johnson
- 👤 Michael D. Bramel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0448; B; B41; B41C; B41C1/00; B41C1/14; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/1225; H05K2203/00; H05K2203/30; H05K2203/304
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
138 words
A method of manufacturing electrical circuit devices of the type including a substrate having at least two elements solder-bonded to a common surface thereof comprising the successive steps of: (a) screening a solder-flux mixture onto a first area of the substrate surface; (b) placing a first element on the screened-on solder-flux mixture; (c) fusing the solder-flux mixture to bond the first element to the substrate; (d) screening a solder-flux mixture onto a second area of the substrate surface by means of a screen having a covered aperture generally conforming with the first element; (e) placing a second element on the screened-on solder-flux mixture on the second area; and (f) heating the combination of substance, bonded first element, second element, and latter solder-flux mixture to fuse the latter solder-flux mixture and thereby bond the second element to the substrate.
Claim 2
Independent Claim
138 words
A method of manufacturing electrical circuit devices of the type including a substrate having at least two elements solder-bonded to a common surface thereof comprising the successive steps of: (a) screening a solder-flux mixture onto a first area of the substrate surface; (b) placing a first element on the screened-on solder-flux mixture; (c) fusing the solder-flux mixture to bond the first element to the substrate; (d) screening a solder-flux mixture onto a second area of the substrate surface by means of a screen having a covered aperture generally conforming with the first element; (e) placing a second element on the screened-on solder-flux mixture on the second area; and (f) heating the combination of substance, bonded first element, second element, and latter solder-flux mixture to fuse the latter solder-flux mixture and thereby bond the second element to the substrate.
Claim 3
Dependent Claim
30 words
A method as defined in claim 1 wherein the first element is a flip chip, the second element is a different element, and the solder-flux mixtures are of different compositions.
References Cited (Backward Citations)
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US3879837A
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US4269870A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-15 | 1992-05-16 | 1992-11-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-15 | 1996-05-16 | 1996-11-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-15 | 2000-05-16 | 2000-11-15 | $7700.00 | Window Closed / Lapsed |