US3879837A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of soldering a semiconductor plate
Assignee: Panasonic Holdings Corp
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Filing: 1974-02-19
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Granted: 1975-04-29
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Expires: 1994-02-19
Abstract
Abstract A method of soldering a semiconductor plate to a metal substrate comprising the steps of disposing or supplying solder at that portion of the metal substrate which is remote from the portion to be soldered with the semiconductor plate, and supplying the melted solder to the soldering portion of said semiconductor plate and said metal substrate through a groove provided in said metal substrate and extending from said remote portion to said soldering portion.
Inventors
- 👤 Kanji Mizukoshi
- 👤 Minoru Andou
- 👤 Hisao Okuno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 00:30
CPC Classifications
H; H10; H10P; H10P95/00; B; B23; B23K; B23K1/00; B23K1/20; B23K3/00; B23K3/08; B23K3/087; H10W; H10W72/00; H10W72/30; B23K2101/00; B23K2101/36; B23K2101/40; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/351; H10W72/352
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
92 words
A method of soldering a semiconductor body to a metal substrate comprising the steps of: disposing solid solder in a recessed portion of the metal substrate having a groove connected with said recessed portion, and placing the semiconductor body above said groove at a distance from said recessed portion; heating the assembly of said semiconductor body and said metal substrate to melt the solder disposed in said recessed portion and supply melted solder from the recessed portion to the bonding surfaces of said semiconductor body and said metal substrate through said groove.
Claim 2
Independent Claim
92 words
A method of soldering a semiconductor body to a metal substrate comprising the steps of: disposing solid solder in a recessed portion of the metal substrate having a groove connected with said recessed portion, and placing the semiconductor body above said groove at a distance from said recessed portion; heating the assembly of said semiconductor body and said metal substrate to melt the solder disposed in said recessed portion and supply melted solder from the recessed portion to the bonding surfaces of said semiconductor body and said metal substrate through said groove.
Claim 3
Independent Claim
99 words
A method of soldering a semiconductor body to a metal substrate with solder employing a jig for supplying solder comprising the steps of: disposing a semiconductor body at a predetermined bonding portion of a metal substrate having said portion for mounting the semiconductor body and a groove extending from said portion to the exterior, and disposing a jig on said metal substrate the jig having a straight through hole extending to a portion of said groove different from that in the bonding region, and supplying melted solder through said straight through hole and said groove to the bonding surfaces.
Claim 4
Independent Claim
99 words
A method of soldering a semiconductor body to a metal substrate with solder employing a jig for supplying solder comprising the steps of: disposing a semiconductor body at a predetermined bonding portion of a metal substrate having said portion for mounting the semiconductor body and a groove extending from said portion to the exterior, and disposing a jig on said metal substrate the jig having a straight through hole extending to a portion of said groove different from that in the bonding region, and supplying melted solder through said straight through hole and said groove to the bonding surfaces.
Claim 5
Dependent Claim
63 words
A method of soldering a semiconductor body to a metal substrate with solder according to claim 2, in which said straight through hole in the jig has a funnel portion and a hole portion and a solder solid is first retained in said funnel portion and then is melted by heating and supplied to the groove through said funnel and said hole portion.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-28 | 1978-10-28 | 1979-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-28 | 1982-10-28 | 1983-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-28 | 1986-10-28 | 1987-04-29 | $7700.00 | Window Closed / Lapsed |