Method of producing printed circuit boards

Claim 1

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit patterns, applying a first solder resist in individual annular configurations about corresponding individual lands to be soldered and each portion of the resist having an inner diameter somewhat larger than an outer diameter of a corresponding land to be soldered and having a uniform distance between said inner and said outer diameter not less than 0.5 mm, and applying a second solder resist to a front face of the circuit pattern so as to leave uncovered an individual area about each land having an inner diameter larger than the size of the corresponding land and at least as large as the inner diameter of the first solder resist and having an area outer diameter less than an outer diameter of the corresponding first solder resist annular configuration in order to provide said printed circuit board free from solder bridging.

Claim 2

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit patterns, applying a first solder resist in individual annular configurations about corresponding individual lands to be soldered and each portion of the resist having an inner diameter somewhat larger than an outer diameter of a corresponding land to be soldered and having a uniform distance between said inner and said outer diameter not less than 0.5 mm, and applying a second solder resist to a front face of the circuit pattern so as to leave uncovered an individual area about each land having an inner diameter larger than the size of the corresponding land and at least as large as the inner diameter of the first solder resist and having an area outer diameter less than an outer diameter of the corresponding first solder resist annular configuration in order to provide said printed circuit board free from solder bridging.

Claim 3

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit pattern, applying a first solder resist in a rectangular area configuration about several circularly shaped lands to be soldered so as to leave uncovered circular spaces free of the first resist about individual corresponding lands, each circular space having an inner diameter somewhat larger than an outer diameter of a corresponding land to be soldered, and applying a second solder resist to a front face of the conductor circuit pattern so as to leave uncovered individual areas each about a respective land, each uncovered area having an inner diameter larger than the size of the corresponding land and having an outer diameter less than an outer diameter of the corresponding uncovered circular spaces of the first solder resist in order to provide said printed circuit board free of solder bridging.

Claim 4

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit pattern, applying a first solder resist in a rectangular area configuration about several circularly shaped lands to be soldered so as to leave uncovered circular spaces free of the first resist about individual corresponding lands, each circular space having an inner diameter somewhat larger than an outer diameter of a corresponding land to be soldered, and applying a second solder resist to a front face of the conductor circuit pattern so as to leave uncovered individual areas each about a respective land, each uncovered area having an inner diameter larger than the size of the corresponding land and having an outer diameter less than an outer diameter of the corresponding uncovered circular spaces of the first solder resist in order to provide said printed circuit board free of solder bridging.

Claim 5

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit pattern, applying a first solder resist on an area having a given configuration about a plurality of circularly shaped lands to be soldered, said given area having first resist-free spaces each having an inner diameter somewhat larger than an outer diameter of a corresponding land within a corresponding resist-free space, and applying a second solder resist on a front face of the circuit pattern so as to leave uncovered individual areas about each land, each area left uncovered being larger than the size of a corresponding land therein and having an outer diameter less than an outer diameter of a corresponding first resist-free space about the corresponding land in order to provide said printed circuit board free of solder bridging.

Claim 6

A method of producing a printed circuit board free of solder bridging comprising the steps of: forming on an insulating substrate a selected conductor circuit pattern, applying a first solder resist on an area having a given configuration about a plurality of circularly shaped lands to be soldered, said given area having first resist-free spaces each having an inner diameter somewhat larger than an outer diameter of a corresponding land within a corresponding resist-free space, and applying a second solder resist on a front face of the circuit pattern so as to leave uncovered individual areas about each land, each area left uncovered being larger than the size of a corresponding land therein and having an outer diameter less than an outer diameter of a corresponding first resist-free space about the corresponding land in order to provide said printed circuit board free of solder bridging.