Patent FR796608A successfully refreshed from Google Patents.
Patent US4771759A successfully refreshed from Google Patents.
US4771759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for severing a rod in slices, slicing machine for carrying out the method and use of the slicing machine
Assignee: Machinenfabrik Meyer and Burger AG
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Filing: 1987-04-15
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Granted: 1988-09-20
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Expires: 2007-04-15
Abstract
Abstract A slicing machine in which a workpiece rod is disposed without cutting base on a table of the machine and it may be brought by means of a feeding slide step by step into a working position in the range of action of an inner cutting-off wheel. For removing the severed slices of arbitrary thickness, a vacuum chuck with a crown of suction nozzles is connected through a ball joint capable to be locked with a support and a horizontal slide. By shifting the horizontal slide and when the ball joint is loosened, the vacuum chuck may be put against the rod with a definite force and oriented, and then the ball joint is locked so that the vacuum chuck is rigidly maintained in the oriented position. The pressure force of the vacuum chuck may be recleared and the vacuum chuck with its support may be clamped with the vacuum chuck in the released position. This permits a clear, proper slicing of the rod without danger of breaks at the time when the separation takes place.
Inventors
- 👤 Armin Zoebeli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 22:11
CPC Classifications
B; B23; B23Q; B23Q1/00; B23Q1/25; B23Q1/26; B23Q1/28; B23Q1/0009; B23Q1/0018; B23Q1/44; B23Q1/50; B23Q1/54; B23Q1/545; B23Q1/5462; B28; B28D; B28D5/00; B28D5/0058; B28D5/0082; B28D5/0094; B28D5/02; B28D5/022; B28D5/028
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
186 words
A method of slicing a rod into wafers of constant or variable thickness by a slicing machine having a vacuum chuck for holding sliced wafers, the method comprising: (a) displacing the vacuum chuck axially until the vacuum chuck contacts the end of the rod from which the wafers are severed by applying a displacing pressure force to the vacuum chuck; (b) orienting the vacuum chuck by allowing the vacuum chuck freedom of movement so that is may be oriented and aligned with the face of the vacuum chuck uniformly contacting the end of the rod from which wafers are to be cut; (c) applying vacuum to the vacuum chuck before the completion of a slicing cut; (d) relieving the displacing pressure force on the vacuum chuck before completion of a slicing cut by the slicing machine; (e) withdrawing the vacuum chuck from the rod at the completion of the slicing cut so that a sliced wafer is removed from the rod; and (f) removing vacuum from the vacuum chuck after completion of the slicing cut so that a cut wafer is removed from the vacuum chuck.
Claim 2
Independent Claim
186 words
A method of slicing a rod into wafers of constant or variable thickness by a slicing machine having a vacuum chuck for holding sliced wafers, the method comprising: (a) displacing the vacuum chuck axially until the vacuum chuck contacts the end of the rod from which the wafers are severed by applying a displacing pressure force to the vacuum chuck; (b) orienting the vacuum chuck by allowing the vacuum chuck freedom of movement so that is may be oriented and aligned with the face of the vacuum chuck uniformly contacting the end of the rod from which wafers are to be cut; (c) applying vacuum to the vacuum chuck before the completion of a slicing cut; (d) relieving the displacing pressure force on the vacuum chuck before completion of a slicing cut by the slicing machine; (e) withdrawing the vacuum chuck from the rod at the completion of the slicing cut so that a sliced wafer is removed from the rod; and (f) removing vacuum from the vacuum chuck after completion of the slicing cut so that a cut wafer is removed from the vacuum chuck.
Claim 3
Dependent Claim
18 words
A method as in claim 1 further comprising clamping the vacuum chuck after completion of the orienting step.
Claim 4
Dependent Claim
26 words
A method as in claim 1 wherein the relieving of displacing pressure force on the vacuum chuck is accomplished by removal of pressure to a cylinder.
Claim 5
Dependent Claim
28 words
A method as in claim 3 further comprising clamping the axial displacement position of the vacuum chuck after release of the displacing pressure force on the vacuum chuck.
Claim 6
Dependent Claim
203 words
A slicing machine for severing a rod into wafers comprising: (a) a machine support base; (b) a workpiece holder for a rod to be sliced, the workpiece holder movably mounted on the machine base; (c) a vacuum chuck having a face for contacting and removing wafers severed from the rod; (d) vacuum chuck mounting means mounted on the machine base allowing the vacuum chuck to move freely axially of the rod workpiece to allow orientation of a vacuum chuck face with an outer face of a wafer to be severed from the rod; (e) means for applying vacuum to the vacuum chuck; (f) power displacement means for moving the vacuum chuck mounting means to move the vacuum chuck face axially against the outer face of the wafer to be severed from the rod with a positive pressure force; (g) an internal diameter saw movably mounted from the machine base and driven to cut wafers from the end of the rod; (h) control means for releasing the positive pressure force of the vacuum chuck against the wafer applied by the power displacement means before the saw completes a cut, and for releasing the vacuum to the vacuum chuck after the saw completes a cut.
Claim 7
Dependent Claim
203 words
A slicing machine for severing a rod into wafers comprising: (a) a machine support base; (b) a workpiece holder for a rod to be sliced, the workpiece holder movably mounted on the machine base; (c) a vacuum chuck having a face for contacting and removing wafers severed from the rod; (d) vacuum chuck mounting means mounted on the machine base allowing the vacuum chuck to move freely axially of the rod workpiece to allow orientation of a vacuum chuck face with an outer face of a wafer to be severed from the rod; (e) means for applying vacuum to the vacuum chuck; (f) power displacement means for moving the vacuum chuck mounting means to move the vacuum chuck face axially against the outer face of the wafer to be severed from the rod with a positive pressure force; (g) an internal diameter saw movably mounted from the machine base and driven to cut wafers from the end of the rod; (h) control means for releasing the positive pressure force of the vacuum chuck against the wafer applied by the power displacement means before the saw completes a cut, and for releasing the vacuum to the vacuum chuck after the saw completes a cut.
Claim 8
Dependent Claim
35 words
A slicing machine as in claim 5 wherein the vacuum chuck mounting means includes an axially movable vacuum chuck support and a ball joint between a face of vacuum chuck and the vacuum chuck support.
Claim 9
Dependent Claim
18 words
A slicing machine as in claim 6 further comprising means for locking the ball joint in any position.
Claim 10
Dependent Claim
22 words
A slicing machine as in claim 7 further comprising a cardonic safety joint between the vacuum chuck and the vacuum chuck support.
Claim 11
Dependent Claim
16 words
A slicing machine as in claim 5 wherein the power displacement means is a pressure cylinder.
Claim 12
Dependent Claim
23 words
A slicing machine as in claim 9 wherein the pressure cylinder includes means allowing the vacuum chuck support to move with little friction.
Claim 13
Dependent Claim
40 words
A slicing machine as in claim 9 wherein the pressure cylinder comprises a piston and a piston rod which carries a nut, and a spring positioned to return the piston and release pressure of the vacuum chuck against the wafer.
Claim 14
Dependent Claim
32 words
A slicing machine as in claim 5 further comprising means for mutually rigidly positioning the workpiece holder and the vacuum chuck to the machine support base when the saw slices a wafer.
Claim 15
Dependent Claim
35 words
A slicing machine as defined in claim 5 further comprising means for feeding the vacuum chuck axially to the rod and swinging radially of the rod to accommodate at least one further wafer removal system.
Claim 16
Dependent Claim
28 words
A slicing machine as in claim 5 further comprising means positioning the face of the vacuum chuck eccentrically to the side of rod that the saw blade enters.
Claim 17
Dependent Claim
33 words
A slicing machine as in claim 5 wherein the power displacement means is resilient such that displacement of the vacuum chuck is independent of the thickness of a wafer cut from the rod.
Claim 18
Dependent Claim
19 words
A slicing machine as defined in claim 5 wherein the vacuum chuck face contains a plurality of suction nozzles.
Claim 19
Dependent Claim
17 words
A slicing machine as defined in claim 16 wherein the suction nozzles have precisely machined front faces.
Claim 20
Dependent Claim
35 words
A slicing machine as defined in claim 5 wherein the vacuum chuck mounting means allows horizontal displacement of the vacuum chuck, and the workpiece holder mounts the rod to be sliced on a horizontal axis.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-09-20 | 1992-03-21 | 1992-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-09-20 | 1996-03-21 | 1996-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-09-20 | 2000-03-21 | 2000-09-20 | $7700.00 | Window Closed / Lapsed |