EP0079744A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Clutch assembly for removing a severed wafer from an ingot
Assignee: Silicon Technology Corp Japan
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Filing: 1982-11-09
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Granted: —
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Expires: 2002-11-09
Abstract
Abstract The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture In the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slide for moving the head back and forth and a carriage for vertically moving the head up and down. A motor is used to actuate the carriage while air cylinders are used to actuate the slide and pivot arm assembly.
Inventors
- 👤 Robert E. Steere
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 16:07
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/0082; B28D5/0094; B23; B23Q; B23Q7/00; B23Q7/04; B23Q7/047; B28D5/02; B28D5/022; B28D5/028
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
79 words
A wafering system including a rotary cutting blade (22) having a bore and a cutting edge (24) about said bore for severing a wafer (25) from a delivered ingot (19) and characterized in having a chuck assembly (26) including a head (27) for engaging a severed wafer from the ingot; and means (28) for moving said head between a rest position on one side of said blade and a wafer holding position on an opposite side of said blade.
Claim 2
Dependent Claim
79 words
A wafering system including a rotary cutting blade (22) having a bore and a cutting edge (24) about said bore for severing a wafer (25) from a delivered ingot (19) and characterized in having a chuck assembly (26) including a head (27) for engaging a severed wafer from the ingot; and means (28) for moving said head between a rest position on one side of said blade and a wafer holding position on an opposite side of said blade.
Claim 3
Dependent Claim
83 words
A wafering system as set forth in claim 1 wherein said means for moving said head is characterized in having a carriage (56), a carriage guide (58) extending transversely of said blade, means (67, 68) for reciprocating said carriage along said guide, an arm (30) secured to said head, an arm assembly (34) having said arm secured therein and being pivotally mounted on said carriage, and means (73) for pivoting said arm assembly to move said head through said bore in said blade.
Claim 4
Dependent Claim
61 words
A wafering system as set forth in Claim 1 or 2, wherein said head is characterized in having a plurality of nozzles (29) on one face of said head and said arm is characterized in having a hollow bore extending from said nozzles on said head and a spigot (33) in communication with said bore for attachment to a vacuum source.
Claim 5
Dependent Claim
62 words
4 . A wafering system as set forth in any preceding claim wherein said means for moving said head is further characterized in having a slide (46) having said arm assembly pivotally mounted thereon, a slide guide (50) mounted on said carriage in a plane perpendicular to said blade, and means (76) for reciprocating said slide on said slide-guide a predetermined stroke.
Claim 6
Dependent Claim
45 words
5 . A wafering system as set forth in any preceding claim which is further characterized in having programming means (15) for programming movement of said means for reciprocating said carriage, said means for reciprocating said slide and said means for pivoting said arm assembly.
Claim 7
Dependent Claim
92 words
A chuck assembly for a wafering system including a head (27) for releaseably engaging a wafer severed from an ingot characterized in having an arm (30) secured to and extending from said head; an arm assembly (34) having said arm mounted thereon; a slide (46) having said arm assembly pivotally mounted thereon about a first axis; and a carriage (56) having said slide movably mounted thereon on a second axis perpendicular to said first axis, said carriage being movable along a third axis perpendicular to said second axis and said first axis.
Claim 8
Dependent Claim
92 words
A chuck assembly for a wafering system including a head (27) for releaseably engaging a wafer severed from an ingot characterized in having an arm (30) secured to and extending from said head; an arm assembly (34) having said arm mounted thereon; a slide (46) having said arm assembly pivotally mounted thereon about a first axis; and a carriage (56) having said slide movably mounted thereon on a second axis perpendicular to said first axis, said carriage being movable along a third axis perpendicular to said second axis and said first axis.
Claim 9
Dependent Claim
52 words
A chuck assembly as set forth in claim 6 wherein said arm (34) is characterized in having a straight section (31) extending from said arm assembly and a bent section (32) extending from said straight section, said bent section having said head (22) mounted thereon in offset relation to said straight section.
Claim 10
Dependent Claim
59 words
8 . A chuck assembly as set forth in Claim 6 or 7 which is further characterized in having a first means (73) for pivoting said arm assembly (34) on said slide, a second means (76) for reciprocating said slide (46) relative to said carriage and a third means (67, 68) for reciprocating said carriage along said third axis.
Claim 11
Dependent Claim
58 words
A chuck assembly as set forth in claim 8 which is further characterized in that said third means includes a motor (67) and a threaded screw (68) rotatably connected to said motor and in threaded engagement with said carriage and in having programming means (15) for actuating said first means, said motor and said second means in sequence.
Claim 12
Independent Claim
130 words
A method of severing and removing a wafer from an ingot, said method including the steps of positioning the ingot within a bore of a rotary cutting blade having an internal cutting edge about the bore and moving the cutting blade transversely relative to the ingot to sever a wafer from one end thereof; and characterized in moving a head of a chuck assembly from a rest position on one side of the blade through the bore to a holding position on an opposite side of the blade and in facing relation to the wafer; gripping a severed wafer on the head in said holding position; moving the gripped wafer and head from said holding position through the bore to said rest position; and releasing the wafer from the head.
Claim 13
Independent Claim
130 words
A method of severing and removing a wafer from an ingot, said method including the steps of positioning the ingot within a bore of a rotary cutting blade having an internal cutting edge about the bore and moving the cutting blade transversely relative to the ingot to sever a wafer from one end thereof; and characterized in moving a head of a chuck assembly from a rest position on one side of the blade through the bore to a holding position on an opposite side of the blade and in facing relation to the wafer; gripping a severed wafer on the head in said holding position; moving the gripped wafer and head from said holding position through the bore to said rest position; and releasing the wafer from the head.
References Cited (Backward Citations)
No citation records indexed.
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