Full panel electronic packaging structure and method of making same

Claim 1

A method for making an electronic packaging structure comprising the steps of: fabricating a substrate with circuitry having a plurality of bonding sites arranged in a selected pattern; forming a layer of flexible polyimide film on a support structure, said flexible film sized and configured to cover the bonding sites of the circuitized substrate when said flexible film is mounted on the circuitized substrate, and said flexible polyimide film having a thickness of less than approximately 25.0 microns (about 0.001 inch); circuitizing the flexible film on the support structure with a circuit pattern having a plurality of device attachment sites matching the selected pattern of bonding sites on the circuitized substrate, said circuit pattern including pads at each device attachment site for facilitating connection of an electronic device to the circuitry on the flexible film and lands for facilitating connection of the circuitry on the flexible film to the circuitry at the bonding sites on the circuitized substrate; attaching a selected electronic device to the pads at each device attachment site of the circuitry on the flexible film using a controlled collapse chip connection (C-4) technique; testing each of the electronic devices attached to the circuitized, flexible film; and mounting the circuitized, flexible film, with the electronic devices attached thereto, on the circuitized substrate, only if for each matching bonding site on the circuitized substrate there is a corresponding electronic device, found to be functional after testing, which, as a result of this mounting step, will be electrically interconnected through the circuitry on the flexible film to the circuitry at the matching bonding site on the circuitized substrate.

Claim 2

A method for making an electronic packaging structure comprising the steps of: fabricating a substrate with circuitry having a plurality of bonding sites arranged in a selected pattern; forming a layer of flexible polyimide film on a support structure, said flexible film sized and configured to cover the bonding sites of the circuitized substrate when said flexible film is mounted on the circuitized substrate, and said flexible polyimide film having a thickness of less than approximately 25.0 microns (about 0.001 inch); circuitizing the flexible film on the support structure with a circuit pattern having a plurality of device attachment sites matching the selected pattern of bonding sites on the circuitized substrate, said circuit pattern including pads at each device attachment site for facilitating connection of an electronic device to the circuitry on the flexible film and lands for facilitating connection of the circuitry on the flexible film to the circuitry at the bonding sites on the circuitized substrate; attaching a selected electronic device to the pads at each device attachment site of the circuitry on the flexible film using a controlled collapse chip connection (C-4) technique; testing each of the electronic devices attached to the circuitized, flexible film; and mounting the circuitized, flexible film, with the electronic devices attached thereto, on the circuitized substrate, only if for each matching bonding site on the circuitized substrate there is a corresponding electronic device, found to be functional after testing, which, as a result of this mounting step, will be electrically interconnected through the circuitry on the flexible film to the circuitry at the matching bonding site on the circuitized substrate.