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US4766092A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of growing heteroepitaxial InP on Si using Sn substrate implantation

Assignee: Hitachi Ltd
•
Filing: 1986-12-02
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Granted: 1988-08-23
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Expires: 2006-12-02
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Abstract

Abstract When a semiconductor device is produced by growing epitaxially a compound semiconductor layer on a Si or Ge substrate, lattice matching between the substrate crystal and the compound semiconductor layer to be formed on the substrate can be improved by ion-implanting an ion species element, which increases the lattice constant of Si or Ge as the substrate, into the Si or Ge substrate in order to increase its lattice constant. In comparison with conventional semiconductor devices using Si or Ge into which ion implantation is not made, the semiconductor device produced by the method described above can improve remarkably its characteristics. In the case of a semiconductor laser device, for example, its threshold value drops drastically and its service life can be prolonged remarkably.

Inventors

  • 👤 Takao Kuroda
  • 👤 Kenji Hiruma
  • 👤 Hiroyoshi Matsumura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 13:51
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10P14/00; H10P14/20; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/34; H10P14/3402; H10P14/3414; H10P14/3418; H10P14/3421; H10P14/36; H10P30/208; H01; H01S; H01S2301/00; H01S2301/17; H01S2301/173; H01S2304/00; H01S2304/04; H01S5/00; H01S5/02; H01S5/0206; H01S5/021; H01S5/04; H01S5/042; H01S5/0421; H01S5/0422; H01S5/30; H01S5/305; H01S5/3054; Y; Y10; Y10S; Y10S148/00; Y10S148/072; Y10S148/097; Y10S148/119; Y10S438/00; Y10S438/933; Y10S438/938

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 43 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn, into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material of single crystal InP on the ion-implanted surface of said substrate.
Claim 2
Independent Claim 43 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn, into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material of single crystal InP on the ion-implanted surface of said substrate.
Claim 3
Dependent Claim 34 words
The method of producing a semiconductor device as defined in claim 1, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 4
Dependent Claim 22 words
The method of producing a semiconductor device as defined in claim 1, wherein the compound semiconductor layer is epitaxially grown by MOCVD.
Claim 5
Dependent Claim 22 words
The method of producing a semiconductor device as defined in claim 1, wherein the compound semiconductor layer is epitaxially grown by MBE.
Claim 6
Dependent Claim 47 words
The method of producing a semiconductor device as defined in claim 1, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 3% different than the lattice constant of said layer of compound semiconductor material.
Claim 7
Dependent Claim 34 words
The method of producing a semiconductor device as defined in claim 5, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 8
Dependent Claim 28 words
The method of producing a semiconductor device as defined in claim 6, wherein the impurity concentration of the ion-implanted impurity is made substantially uniform in the depth direction.
Claim 9
Dependent Claim 47 words
The method of producing a semiconductor device as defined in claim 6, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 1% different than the lattice constant of said layer of compound semiconductor material.
Claim 10
Independent Claim 53 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material selected from the group consisting of single crystal InP and InP system mixed crystal on the ion-implanted surface of said substrate.
Claim 11
Independent Claim 53 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material selected from the group consisting of single crystal InP and InP system mixed crystal on the ion-implanted surface of said substrate.
Claim 12
Dependent Claim 24 words
The method of producing a semiconductor device as defined in claim 9, wherein said layer of compound semiconductor material is InP system mixed crystal.
Claim 13
Dependent Claim 22 words
The method of producing a semiconductor device as defined in claim 10, wherein the compound semiconductor layer is epitaxially grown by MOCVD.
Claim 14
Dependent Claim 22 words
The method of producing a semiconductor device as defined in claim 10, wherein the compound semiconductor layer is epitaxially grown by MBE.
Claim 15
Dependent Claim 47 words
The method of producing a semiconductor device as defined in claim 10, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 3% different than the lattice constant of said layer of compound semiconductor material.
Claim 16
Dependent Claim 34 words
The method of producing a semiconductor device as defined in claim 13, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 17
Dependent Claim 28 words
The method of producing a semiconductor device as defined in claim 14, wherein the impurity concentration of the ion-implanted impurity is made substantially uniform in the depth direction.

References Cited (Backward Citations)

US3520741A Cited
US3836999A Cited
US4177321A Cited
US3793093A Cited
US4133702A Cited
US4622093A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-08-23 1992-02-22 1992-08-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-08-23 1996-02-22 1996-08-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-08-23 2000-02-22 2000-08-23 $7700.00 Window Closed / Lapsed

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