Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
43 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn, into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material of single crystal InP on the ion-implanted surface of said substrate.
Claim 2
Independent Claim
43 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn, into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material of single crystal InP on the ion-implanted surface of said substrate.
Claim 3
Dependent Claim
34 words
The method of producing a semiconductor device as defined in claim 1, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 4
Dependent Claim
22 words
The method of producing a semiconductor device as defined in claim 1, wherein the compound semiconductor layer is epitaxially grown by MOCVD.
Claim 5
Dependent Claim
22 words
The method of producing a semiconductor device as defined in claim 1, wherein the compound semiconductor layer is epitaxially grown by MBE.
Claim 6
Dependent Claim
47 words
The method of producing a semiconductor device as defined in claim 1, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 3% different than the lattice constant of said layer of compound semiconductor material.
Claim 7
Dependent Claim
34 words
The method of producing a semiconductor device as defined in claim 5, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 8
Dependent Claim
28 words
The method of producing a semiconductor device as defined in claim 6, wherein the impurity concentration of the ion-implanted impurity is made substantially uniform in the depth direction.
Claim 9
Dependent Claim
47 words
The method of producing a semiconductor device as defined in claim 6, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 1% different than the lattice constant of said layer of compound semiconductor material.
Claim 10
Independent Claim
53 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material selected from the group consisting of single crystal InP and InP system mixed crystal on the ion-implanted surface of said substrate.
Claim 11
Independent Claim
53 words
A method of producing a semiconductor device comprising the steps of: ion-implanting an ion species of Sn into a substrate of Si crystal; and growing epitaxially a layer of compound semiconductor material selected from the group consisting of single crystal InP and InP system mixed crystal on the ion-implanted surface of said substrate.
Claim 12
Dependent Claim
24 words
The method of producing a semiconductor device as defined in claim 9, wherein said layer of compound semiconductor material is InP system mixed crystal.
Claim 13
Dependent Claim
22 words
The method of producing a semiconductor device as defined in claim 10, wherein the compound semiconductor layer is epitaxially grown by MOCVD.
Claim 14
Dependent Claim
22 words
The method of producing a semiconductor device as defined in claim 10, wherein the compound semiconductor layer is epitaxially grown by MBE.
Claim 15
Dependent Claim
47 words
The method of producing a semiconductor device as defined in claim 10, wherein the ion-implanting is performed so as to change the lattice constant of the substrate of Si crystal to be less than 3% different than the lattice constant of said layer of compound semiconductor material.
Claim 16
Dependent Claim
34 words
The method of producing a semiconductor device as defined in claim 13, wherein said ion species element is ion-implanted from the surface of said substrate crystal in a depth of 0.5 to 5 μm.
Claim 17
Dependent Claim
28 words
The method of producing a semiconductor device as defined in claim 14, wherein the impurity concentration of the ion-implanted impurity is made substantially uniform in the depth direction.