Patent US4762560A successfully refreshed from Google Patents.
US4762560A
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US
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Copper colloid and method of activating insulating surfaces for subsequent electroplating
Assignee: Shipley Co Inc
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Filing: 1987-12-10
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Granted: 1988-08-09
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Expires: 2007-12-10
Abstract
Abstract A copper colloid containing a minor amount of an ionizable palladium compound for use in activating non-conductive materials for subsequent electroplating.
Inventors
- 👤 William R. Brasch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:17
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/30; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/188
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
64 words
The method of preparing a copper colloid for activation of a non-conducting substrate which comprises adding a minor amount of an ionizable palladium compound to the copper colloid and reducing the palladium compound therein to form metallic palladium particles in an amount at least about 8 ppm to maintain the copper colloidal particles as the primary activating agent but less than about 80 ppm.
Claim 2
Independent Claim
64 words
The method of preparing a copper colloid for activation of a non-conducting substrate which comprises adding a minor amount of an ionizable palladium compound to the copper colloid and reducing the palladium compound therein to form metallic palladium particles in an amount at least about 8 ppm to maintain the copper colloidal particles as the primary activating agent but less than about 80 ppm.
Claim 3
Dependent Claim
31 words
The method of claim 1 in which the copper colloid contains excess reducing agent after its preparation and the palladium compound is added thereto after the copper colloid has been prepared.
Claim 4
Independent Claim
95 words
The method of activating a non-conducting substrate comprising treating the substrate with a composition containing a minor amount of at least about 8 ppm of an ionizable palladium compound and a major amount of hydrous oxide copper colloid particles containing a sufficient amount of reducing agent to reduce the ionizable palladium compound to less than about 80 ppm of palladium metal and reducing the hydrous oxide colloid and the ionizable palladium compound to metallic copper and metallic palladium while adhered to said conducting substrate and in which the metallic copper is the primary activating agent.
Claim 5
Independent Claim
95 words
The method of activating a non-conducting substrate comprising treating the substrate with a composition containing a minor amount of at least about 8 ppm of an ionizable palladium compound and a major amount of hydrous oxide copper colloid particles containing a sufficient amount of reducing agent to reduce the ionizable palladium compound to less than about 80 ppm of palladium metal and reducing the hydrous oxide colloid and the ionizable palladium compound to metallic copper and metallic palladium while adhered to said conducting substrate and in which the metallic copper is the primary activating agent.
Claim 6
Dependent Claim
59 words
An aqueous copper colloid for the activation of non-conductive substrates for subsequent electroless plating comprising colloidal particles of metallic copper and a minor amount of at least about 8 ppm palladium metallic particles formed by reduction of an ionizable palladium compound within said copper colloid after or during preparation of the copper colloid by reduction of a copper compound.
Claim 7
Dependent Claim
59 words
An aqueous copper colloid for the activation of non-conductive substrates for subsequent electroless plating comprising colloidal particles of metallic copper and a minor amount of at least about 8 ppm palladium metallic particles formed by reduction of an ionizable palladium compound within said copper colloid after or during preparation of the copper colloid by reduction of a copper compound.
Claim 8
Dependent Claim
41 words
A non-conductive substrate having activating sites thereon sufficient to permit electroless plating thereon in which the activated sites comprise a mixture of a major amount of copper metal and a minor amount of palladium metal but less than about 80 ppm.
Claim 9
Dependent Claim
41 words
A non-conductive substrate having activating sites thereon sufficient to permit electroless plating thereon in which the activated sites comprise a mixture of a major amount of copper metal and a minor amount of palladium metal but less than about 80 ppm.
Claim 10
Dependent Claim
100 words
A stable aqueous colloid for the activation of non-conductive substrates for electroless plating which comprises particles of metallic copper and/or copper oxide having a particle size of between about 10 and 100 millimicrons and having a zeta potential between about +3 and +12 millivolts, said colloid having an amount of particles to activate the surface of a non-conductor and containing a minor proportion of at least about 8 ppm of palladium produced by reduction from an ionizable palladium compound but less than about 80 ppm within said colloid or during preparation of the colloid by reduction of a copper compound.
Claim 11
Dependent Claim
100 words
A stable aqueous colloid for the activation of non-conductive substrates for electroless plating which comprises particles of metallic copper and/or copper oxide having a particle size of between about 10 and 100 millimicrons and having a zeta potential between about +3 and +12 millivolts, said colloid having an amount of particles to activate the surface of a non-conductor and containing a minor proportion of at least about 8 ppm of palladium produced by reduction from an ionizable palladium compound but less than about 80 ppm within said colloid or during preparation of the colloid by reduction of a copper compound.
Claim 12
Dependent Claim
23 words
The method of claim 1 wherein the amount of palladium metal is at least about 12 ppm but less than about 40 ppm.
Claim 13
Dependent Claim
23 words
The method of claim 3 wherein the amount of palladium metal is at least about 12 ppm but less than about 40 ppm.
Claim 14
Dependent Claim
22 words
The colloid of claim 4 wherein the palladium metal content is at least about 12 ppm but less than about 40 ppm.
Claim 15
Dependent Claim
22 words
The substrate of claim 5 wherein the palladium metal content is at least about 12 ppm but less than about 40 ppm.
Claim 16
Dependent Claim
22 words
The colloid of claim 6 wherein the palladium metal content is at least about 12 ppm but less than about 40 ppm.
Claim 17
Dependent Claim
18 words
The method of claim 1 wherein the amount of palladium metal is between about 20 and 40 ppm.
Claim 18
Dependent Claim
18 words
The method of claim 3 wherein the amount of palladium metal is between about 20 and 40 ppm.
Claim 19
Dependent Claim
17 words
The method of claim 4 wherein the palladium metal content is between about 20 and 40 ppm.
Claim 20
Dependent Claim
17 words
The method of claim 5 wherein the palladium metal content is between about 20 and 40 ppm.
Claim 21
Dependent Claim
17 words
The method of claim 6 wherein the palladium metal content is between about 20 and 40 ppm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-09 | 1992-02-08 | 1992-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-09 | 1996-02-08 | 1996-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-09 | 2000-02-08 | 2000-08-09 | $7700.00 | Window Closed / Lapsed |