US4752816A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic component
Assignee: GEC-MARONI Ltd
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Filing: 1986-12-30
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Granted: 1988-06-21
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Expires: 2006-12-30
Abstract
Abstract The electronic component includes a mounting substrate having a surface provided with a plurality of spaced contact pads. A semiconductor chip is mounted on the substrate and includes at least one active element in the form of a photodiode on a substrate of light transmissive material. The active element has a metallized contact region and the semiconductor chip has a plurality of projecting metallized contact regions which are each electrically conductively bonded to a different one of the spaced contact pads of the mounting substrate. The photodiode may be a PIN diode and the semiconductor chips may be an integrated circuit to which the PIN diode is connected thereby providing an optical receiver equivalent to a PIN receiver.
Inventors
- 👤 Ricardo S. Sussman
- 👤 Robert C. Goodfellow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 22:32
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/855; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4219; G02B6/4228; G02B6/423; G02B6/4249; H10D; H10D62/00; H10D62/10; H10D62/117; H10F; H10F77/00; H10F77/50; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/484; G02B6/4236; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
111 words
In an electronic component comprising: a mounting substrate having an upper surface provided with a plurality of spaced contact pads; and, a semiconductor chip having at least one active element, said semiconductor chip having a plurality of mesa structures on a lower surface thereof, each said mesa structure providing a metallised contact region, said semiconductor chip being mounted on said mounting substrate with each said metallised contact region electrically conductively bonded to a respective one of said spaced contact pads. the improvement wherein said semiconductor chip is formed of a light transmissive semiconductor material and said at least one active element comprises a photodiode constituted by one of said mesa structures.
Claim 2
Dependent Claim
111 words
In an electronic component comprising: a mounting substrate having an upper surface provided with a plurality of spaced contact pads; and, a semiconductor chip having at least one active element, said semiconductor chip having a plurality of mesa structures on a lower surface thereof, each said mesa structure providing a metallised contact region, said semiconductor chip being mounted on said mounting substrate with each said metallised contact region electrically conductively bonded to a respective one of said spaced contact pads. the improvement wherein said semiconductor chip is formed of a light transmissive semiconductor material and said at least one active element comprises a photodiode constituted by one of said mesa structures.
Claim 3
Dependent Claim
39 words
An improved electronic component according to claim 1 wherein said semiconductor chip has a well providing a reduced thickness thereof in alignment with said at least one active element to improve the light transmission of said semiconductor chip thereat.
Claim 4
Dependent Claim
17 words
An improved electronic component according to claim 1 wherein each said mesa structure provides an active element.
Claim 5
Dependent Claim
27 words
An improved electronic component as claimed in claim 1 wherein at least one of said plurality of spaced contact pads forms part of an extended conductor connection.
Claim 6
Dependent Claim
19 words
An improved electronic component according to claim 4 wherein said extended conductor connection terminates in an enlarged connection pad.
Claim 7
Dependent Claim
32 words
An improved electronic component according to claim 1 wherein said semiconductor chip has an outer face, opposite said lower face, and wherein a metallised contact region is provided on said outer face.
Claim 8
Dependent Claim
27 words
An improved electronic component according to claim 1 wherein the electrically conductive bonds between said metallised contact regions and said spaced contact pads are thermal compression bonds.
Claim 9
Dependent Claim
26 words
An improved elecronic component according to claim 1 wherein the electrically conductive bonds between said metallised contact regions and said spaced contact pads are solder bonds.
Claim 10
Dependent Claim
16 words
An improved electronic component according to claim 1 wherein said mounting substrate is an integrated circuit.
Claim 11
Dependent Claim
28 words
An improved electronic component according to claim 9 wherein said photodiode is a PIN photodiode and said PIN photodiode and said integrated circuit together provide an optical receiver.
Claim 12
Dependent Claim
16 words
An improved electronic component according to claim 2 further including a microlens disposed in said well.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-21 | 1991-12-21 | 1992-06-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-21 | 1995-12-21 | 1996-06-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-21 | 1999-12-21 | 2000-06-21 | $7700.00 | Window Closed / Lapsed |