Apparatus for simultaneously encapsulating a plurality of electronic components

Claim 1

An apparatus for simultaneously encapsulating a plurality of electronic components which are fastened by their connection points to the conductors of a strip which is subsequently to be divided into separate parts, said apparatus comprising: a heatable mold comprising a top half and a bottom half which when placed together form a mold cavity, a plurality of cavity sprues, and a plurality of plunger cavities, the mold being adapted to receive at least one strip containing one or more electronic components; an injection unit placed along the long side of the mold, comprising: a carrier frame which is movable toward and away from the mold at a controlled speed by a driving mechanism; a plurality of hydraulically controllable plungers mounted on the carrier frame and adapted to move in and out of the plunger cavities toward and away from the cavity sprues, each of said plungers having a heating element; a plurality of chambers interposed between the mold and the plungers when they are in their retracted position, said chambers being adapted to receive pellets of material used for encapsulating the electronic components, the number of chambers being equal to the number of plungers; pressure means for exerting a constant pressure on the plungers; and a plurality of sensing means for sensing when each pellet is sufficiently softened to be injected, each sensing means sending a signal to an operating circuit; said driving mechanism being actuatable only when a circuit for operating the driving mechanism is closed by all of the sensing means, indicating that all of the pellets are sufficiently softened for injection.

Claim 2

An apparatus for simultaneously encapsulating a plurality of electronic components which are fastened by their connection points to the conductors of a strip which is subsequently to be divided into separate parts, said apparatus comprising: a heatable mold comprising a top half and a bottom half which when placed together form a mold cavity, a plurality of cavity sprues, and a plurality of plunger cavities, the mold being adapted to receive at least one strip containing one or more electronic components; an injection unit placed along the long side of the mold, comprising: a carrier frame which is movable toward and away from the mold at a controlled speed by a driving mechanism; a plurality of hydraulically controllable plungers mounted on the carrier frame and adapted to move in and out of the plunger cavities toward and away from the cavity sprues, each of said plungers having a heating element; a plurality of chambers interposed between the mold and the plungers when they are in their retracted position, said chambers being adapted to receive pellets of material used for encapsulating the electronic components, the number of chambers being equal to the number of plungers; pressure means for exerting a constant pressure on the plungers; and a plurality of sensing means for sensing when each pellet is sufficiently softened to be injected, each sensing means sending a signal to an operating circuit; said driving mechanism being actuatable only when a circuit for operating the driving mechanism is closed by all of the sensing means, indicating that all of the pellets are sufficiently softened for injection.

Claim 5

An apparatus as claimed in claims 1, 2 or 3, wherein said chambers are formed by recesses, open at the top, in a strip, said strip being reciprocatingly movable in a direction perpendicular to the direction of movement of the plungers, said injection unit further comprising a magazine which delivers pellets in the vertical direction from an outlet to the recesses, said magazine depositing one pellet in each recess when that recess is situated under the outlet.