§
Luxuse
Patent Intelligence
Sign In
← Back to Patent Explorer
EP0070320A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Sealing and molding machine

Assignee: I Pex Inc
•
Filing: 1982-01-25
•
Granted: —
•
Expires: 2002-01-25
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract 57 A sealing and molding machine used for sealing and molding small electric elements on synthetic resin. This machine can shorten the cycle time of the sealing and molding steps, reduce the facility cost required for molding dies, molding press, etc., and decrease losses of the synthetic resin material. When the small electric elements are sealed and molded in the synthetic resin material, pots (30) are provided to rapidly load the synthetic resin material at equal distances for a plurality of cavities forming the sealing and molding resin section arranged in molds (11), (12), and the sealing and molding is done by plungers (31) at every pot. This sealing and molding machine can be used as a resin sealing unit for semiconductor devices or the like.

Inventors

  • 👤 Akira Konishi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 00:10
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; B29C45/02

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 79 words
An encapsulation molding apparatus for use in encapsulation molding of small-sized electrical elements by a synthetic resin material, which comprises a plurality of cavities provided in metal molds for formation of encapsulation molded portions thereby, pots provided at preferably equal intervals for charging the synthetic resin material thereinto so as to correspond to said cavities, and extruding plungers provided to correspond to said respective pots for extruding said synthetic resin material therefrom so as to effect said encapsulation molding.
Claim 2
Dependent Claim 79 words
An encapsulation molding apparatus for use in encapsulation molding of small-sized electrical elements by a synthetic resin material, which comprises a plurality of cavities provided in metal molds for formation of encapsulation molded portions thereby, pots provided at preferably equal intervals for charging the synthetic resin material thereinto so as to correspond to said cavities, and extruding plungers provided to correspond to said respective pots for extruding said synthetic resin material therefrom so as to effect said encapsulation molding.
Claim 3
Dependent Claim 20 words
An encapsulation molding apparatus as claimed in Claim 1, wherein each of said plungers is arranged to be resiliently supported.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag