Patent US4750800A successfully refreshed from Google Patents.
US4750800A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low stress mounting of integrated optic chips
Assignee: Honeywell Inc
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Filing: 1986-11-04
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Granted: 1988-06-14
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Expires: 2006-11-04
Abstract
Abstract An integrated optic IO device chip with anisotropic thermal expansion properties is packaged in a material enclosure by first bonding the chip to a substrate having anisotropic thermal expansion properties substantially equivalent to those of the IO device and substrate thickness substantially greater than that of the IO device, and bonding the substrate to the enclosure.
Inventors
- 👤 Joseph T. Fournier
- 👤 Richard E. Swarts
- 👤 Mario T. Lopiccolo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:51
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/26; G02B6/30; G02B6/10; G02B6/12; G02B6/122
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
128 words
Apparatus for enclosing an integrated optical IO device having an optical signal path fabricated in a crystalline chip of a thickness and crystallographic orientation selected to provide anisotropic thermal expansion in the principal plane of the optical signal path, comprising: a substrate comprising crystalline material having a similar crystallographic axes orientation and similar anisotropic coefficients of thermal expansion to those of the chip, and having substrate first and second mounting surfaces spaced apart at a substrate thickness, said substrate first mounting surface being adapted to receive the IO chip in bonded relationship thereto with mutual crystallographic orientation of the chip principal plane with said substrate first mounting surface; and package enclosure means having an enclosure mounting surface bonded to said substrate second mounting surface with a resilient adhesive.
Claim 2
Dependent Claim
128 words
Apparatus for enclosing an integrated optical IO device having an optical signal path fabricated in a crystalline chip of a thickness and crystallographic orientation selected to provide anisotropic thermal expansion in the principal plane of the optical signal path, comprising: a substrate comprising crystalline material having a similar crystallographic axes orientation and similar anisotropic coefficients of thermal expansion to those of the chip, and having substrate first and second mounting surfaces spaced apart at a substrate thickness, said substrate first mounting surface being adapted to receive the IO chip in bonded relationship thereto with mutual crystallographic orientation of the chip principal plane with said substrate first mounting surface; and package enclosure means having an enclosure mounting surface bonded to said substrate second mounting surface with a resilient adhesive.
Claim 3
Dependent Claim
20 words
The apparatus of claim 1, wherein said substrate thickness is at least ten times greater than said chip selected thickness.
Claim 4
Dependent Claim
12 words
The apparatus of claim 1, wherein said resilient adhesive is silicon rubber.
Claim 5
Dependent Claim
14 words
The apparatus of claim 1, wherein said substrate material is LiNbO 3 cut crystal.
Claim 6
Dependent Claim
15 words
The apparatus of claim 1, wherein said substrate material is an anisotropic, graphite-aluminum composite material.
Claim 7
Independent Claim
133 words
The method of mounting, to an enclosure surface, an integrated optical (IO) device of the type having an optical signal path disposed on a crystalline chip having anisotropic thermal characteristics, comprising the steps of: determining the coefficients of thermal expansion of the chip and the orientation of the chip crystallographic axes in the principal plane of the optical signal path; providing a crystalline material substrate having a similar crystallographic axes orientation and similar anisotropic coefficients of thermal expansion to those of the chip, and having substrate first and second mounting surfaces spaced apart at a substrate thickness; fastening the chip to said substrate to provide mutual crystallographic orientation of the principal plane with said substrate first mounting surface; and bonding said substrate second mounting surface to the enclosure surface with a resilient adhesive.
Claim 8
Independent Claim
133 words
The method of mounting, to an enclosure surface, an integrated optical (IO) device of the type having an optical signal path disposed on a crystalline chip having anisotropic thermal characteristics, comprising the steps of: determining the coefficients of thermal expansion of the chip and the orientation of the chip crystallographic axes in the principal plane of the optical signal path; providing a crystalline material substrate having a similar crystallographic axes orientation and similar anisotropic coefficients of thermal expansion to those of the chip, and having substrate first and second mounting surfaces spaced apart at a substrate thickness; fastening the chip to said substrate to provide mutual crystallographic orientation of the principal plane with said substrate first mounting surface; and bonding said substrate second mounting surface to the enclosure surface with a resilient adhesive.
Claim 9
Dependent Claim
42 words
The method of claim 6, wherein said step of determining further includes the step of measuring the chip thickness, and said step of providing further includes selecting a substrate having a substrate thickness at least ten times greater than said chip thickness.
Claim 10
Dependent Claim
27 words
The method of claim 6, wherein said step of fastening includes the step of bonding the chip to said substrate first mounting surface with an epoxy bond.
Claim 11
Dependent Claim
12 words
The method of claim 6, wherein said resilient adhesive is silicon rubber.
Claim 12
Dependent Claim
24 words
The method of claim 6, wherein said integrated optic device is fabricated in LiNbO 3 crystal and said substrate material is LiNbO 3 crystal.
Claim 13
Dependent Claim
24 words
The method of claim 6, wherein said integrated optic device is fabricated in LiTaO 3 crystal and said substrate material is LiNbO 3 crystal.
Claim 14
Dependent Claim
28 words
The method of claim 10, wherein said substrate material is a graphite fiber-aluminum composite material with anisotropic thermal expansion coefficients substantially equal to those of LiNbO 3 .
Claim 15
Dependent Claim
27 words
The method of claim 11, wherein said substrate material is a graphite fiber-aluminum composite material with anisotropic expansion coefficients substantially equal to those of LiTaO 3 .
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-14 | 1991-12-14 | 1992-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-14 | 1995-12-14 | 1996-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-14 | 1999-12-14 | 2000-06-14 | $7700.00 | Window Closed / Lapsed |