Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
149 words
A method for making a microminiature structure with two members measuring less than 100 μm in any linear dimension and relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate, (d) adding a second structural layer thereover and defining it, and (e) etching the first and second sacrificial layers to remove them completely so that the two structural layers become movable relative to each other.
Claim 2
Independent Claim
149 words
A method for making a microminiature structure with two members measuring less than 100 μm in any linear dimension and relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate, (d) adding a second structural layer thereover and defining it, and (e) etching the first and second sacrificial layers to remove them completely so that the two structural layers become movable relative to each other.
Claim 3
Dependent Claim
27 words
The method of claim 1 wherein said sacrificial coating consists of material selected from the group consisting of silicon oxide, silicon nitride, polyimide, and resists, including photoresists.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein said structural layers consists of material selected from the group consisting of polysilicon, silicon nitride, and silicides.
Claim 5
Dependent Claim
13 words
The method of claim 1 wherein said structural layers consist of a metal.
Claim 6
Dependent Claim
9 words
The product resulting from the method of claim 1.
Claim 7
Dependent Claim
13 words
The product of claim 5 wherein said product is a microminiature pin joint.
Claim 8
Dependent Claim
14 words
The product of claim 5 wherein said product is an X-Y micropositioning moving table.
Claim 9
Dependent Claim
15 words
The product of claim 5 wherein said product is a micromechanical force or torque transducer.
Claim 10
Dependent Claim
12 words
The product of claim 5 wherein said product is a micromechanical ratchet.
Claim 11
Dependent Claim
14 words
The product of claim 5 wherein said product is an analog micromechanical computing device.
Claim 12
Dependent Claim
14 words
The product of claim 5 wherein said product is a digital micromechanical logic device.
Claim 13
Dependent Claim
11 words
The product of claim 5 wherein said product is an accelerometer.
Claim 14
Dependent Claim
13 words
The product of claim 5 wherein said product is an engine knock sensor.
Claim 15
Dependent Claim
13 words
The product of claim 5 wherein said product is a micromechanical optical shutter.
Claim 16
Dependent Claim
13 words
The product of claim 5 wherein said product is a micromechanical fluid valve.
Claim 17
Independent Claim
140 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate, (d) adding a second structural layer thereover and defining it, and (e) etching the first and second sacrificial layers to remove them completely so that the two polysilicon layers become movable relative to each other.
Claim 18
Independent Claim
140 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing a second sacrificial coating over said second exposed portion of the substrate and said first structural layer, with openings through both the first and second sacrificial layers to expose a third portion of the substrate, (d) adding a second structural layer thereover and defining it, and (e) etching the first and second sacrificial layers to remove them completely so that the two polysilicon layers become movable relative to each other.
Claim 19
Dependent Claim
9 words
The product resulting from the method of claim 16.
Claim 20
Independent Claim
199 words
A method for making a microminiature device with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a substrate wafer, (b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant, (c) providing openings through said first sacrificial layer to expose a portion of the substrate, (d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer, (e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate, (f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer, (g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate, (h) adding a second structural coating to form a second layer thereover and defining it, and (i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become moveable relative to each other.
Claim 21
Independent Claim
199 words
A method for making a microminiature device with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a substrate wafer, (b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant, (c) providing openings through said first sacrificial layer to expose a portion of the substrate, (d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer, (e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate, (f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer, (g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate, (h) adding a second structural coating to form a second layer thereover and defining it, and (i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become moveable relative to each other.
Claim 22
Dependent Claim
27 words
The device of claim 18 wherein said sacrificial coating consists of material selected from the group consisting of silicon oxide, silicon nitride, polyimide, and resists, including photoresists.
Claim 23
Dependent Claim
23 words
The device of claim 18 wherein said structural layers consists of material selected from the group consisting of polysilicon, silicon nitride, and silicides.
Claim 24
Dependent Claim
13 words
The device of claim 18 wherein said structural layers consist of a metal.
Claim 25
Dependent Claim
9 words
The product resulting from the method of claim 18.
Claim 26
Independent Claim
200 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a substrate wafer, (b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant, (c) providing openings through said first sacrificial layer to expose a portion of the substrate, (d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer, (e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate, (f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer, (g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate, (h) adding a second structural coating to form a second layer thereover and defining it, and (i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become movable relative to each other.
Claim 27
Independent Claim
200 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a substrate wafer, (b) providing a first sacrificial layer thereon, said layer having a high etching rate in a selected etchant, (c) providing openings through said first sacrificial layer to expose a portion of the substrate, (d) depositing over said first sacrificial layer and the exposed portion of the substrate a first structural layer, (e) defining a selected area of said first structural layer and providing openings through that area of said structural layer and said first sacrificial layer to expose a second portion of said substrate, (f) coating a second sacrificial layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first structural layer, (g) providing openings through both said first and second sacrificial layers to expose a third portion of said substrate, (h) adding a second structural coating to form a second layer thereover and defining it, and (i) etching the first and second sacrificial layers to remove them completely so that said first and second structural layers become movable relative to each other.
Claim 28
Dependent Claim
10 words
The pin joint resulting from the method of claim 23.
Claim 29
Independent Claim
212 words
A method for making a microminiature device with at least two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid, (c) providing openings through said first oxide layer to expose a portion of said substrate, (d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate, (f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second oxide layers to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.
Claim 30
Independent Claim
212 words
A method for making a microminiature device with at least two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid, (c) providing openings through said first oxide layer to expose a portion of said substrate, (d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate, (f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second oxide layers to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.
Claim 31
Dependent Claim
9 words
The device resulting from the method of claim 25.
Claim 32
Independent Claim
211 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of; (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid, (c) providing openings through said first oxide layer to expose a portion of said substrate, (d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate, (f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second oxide layers to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.
Claim 33
Independent Claim
211 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of; (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of an oxide thereon, said oxide having a high etching rate in a selected etching acid, (c) providing openings through said first oxide layer to expose a portion of said substrate, (d) depositing over said first oxide layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of polysilicon and providing openings through that area of said first polysilicon layer and said first oxide layer, to expose a second portion of the base substrate, (f) coating a second oxide layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second oxide layers to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second oxide layers to remove them completely, so that the first and second polysilicon layers become movable relative to each other.
Claim 34
Dependent Claim
10 words
The pin joint resulting from the method of claim 27.
Claim 35
Independent Claim
206 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of phosphosilicate glass thereon, (c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate, (d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate, (f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.
Claim 36
Independent Claim
206 words
A method for making a microminiature pin joint with two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of phosphosilicate glass thereon, (c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate, (d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate, (f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.
Claim 37
Dependent Claim
10 words
The pin joint resulting from the method of claim 29.
Claim 38
Independent Claim
207 words
A method for making a microminiature device having at least two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of phosphosilicate glass thereon, (c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate, (d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate, (f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.
Claim 39
Independent Claim
207 words
A method for making a microminiature device having at least two members relatively movable to each other, comprising the steps of: (a) cleaning thoroughly and preparing a silicon substrate wafer, (b) providing a first layer of phosphosilicate glass thereon, (c) providing openings through said first phosphosilicate glass layer to expose a portion of said substrate, (d) depositing over said first phosphosilicate glass layer and the exposed portion of said substrate a first layer of polysilicon, (e) defining a selected area of said first layer of layer polysilicon and providing openings through that area of said first polysilicon layer and said first layer of coating to expose a second portion of said substrate, (f) coating a second phosphosilicate glass layer over said second exposed portion of said substrate and the edges of the openings leading thereto and said first layer of polysilicon, (g) providing openings through both the first and second layers of phosphosilicate glass to expose a third portion of said substrate, (h) adding a second coating of polysilicon to form a second polysilicon layer thereover and defining it, and (i) etching said first and second phosphosilicate glass layers to remove them completely, so that said first and second polysilicon layers become movable relative to each other.
Claim 40
Dependent Claim
9 words
The device resulting from the product of claim 31.
Claim 41
Dependent Claim
12 words
The device of claim 32 wherein the device is a coil spring.
Claim 42
Dependent Claim
13 words
The device of claim 32 wherein the device is a spring-restrained pin joint.
Claim 43
Dependent Claim
13 words
The device of claim 32 wherein the device is a beam-restrained pin joint.
Claim 44
Dependent Claim
12 words
The device of claim 32 wherein the device is a four-joint crank.
Claim 45
Dependent Claim
12 words
The device of claim 32 wherein the device is a crank-slot combination.
Claim 46
Dependent Claim
16 words
The device of claim 32 wherein the device is a rectangular slide structure with restraining flanges.
Claim 47
Dependent Claim
27 words
The device of claim 32 wherein the device is a gear-slide combination with a spring restraining member and gears that mesh with teeth on a sliding element.
Claim 48
Independent Claim
145 words
A method for making a microminiature structure with a plurality of members measuring less than 1000 μm in any linear dimension and relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing additional sacrificial coatings successively over such exposed portions of substrate and a said structural layer, with openings through said sacrificial layers to expose other portions of the substrate, (d) adding additional structural layers over each said sacrificial coating and defining it, and (e) etching the sacrificial layers to remove them completely so that the plurality of structural layers become movable relative to each other.
Claim 49
Independent Claim
145 words
A method for making a microminiature structure with a plurality of members measuring less than 1000 μm in any linear dimension and relatively movable to each other, comprising the steps of: (a) providing a first sacrificial coating over a substrate having openings therethrough to expose a portion of the substrate, (b) depositing a first structural layer over said first sacrificial coating and the exposed portion of the substrate, with openings therethrough to expose a second portion of the substrate, (c) providing additional sacrificial coatings successively over such exposed portions of substrate and a said structural layer, with openings through said sacrificial layers to expose other portions of the substrate, (d) adding additional structural layers over each said sacrificial coating and defining it, and (e) etching the sacrificial layers to remove them completely so that the plurality of structural layers become movable relative to each other.