Thermally conductive module

Claim 2

A thermally conductive module adapted for mounting a plurality of electronic components, comprising: a first ceramic substrate; a first layer of metal or alloy foil being disposed on a first surface of said first ceramic substrate, said first layer of foil adapted for mounting at least one of said plurality of electronic components; a first layer of bonding glass bonding said first layer of foil to a first surface of said ceramic substrate; a second layer of metal or alloy foil disposed on a second surface of said ceramic substrate, said second layer of foil having at least first and second interconnected channels carrying cooling fluid to conduct heat from said module; and a second layer of bonding glass bonding said second layer of foil to said second surface of said first ceramic substrate.

Claim 3

The module of claim 1 wherein said first layer of foil further includes circuitry formed therein adapted for electrical connection with one or more of said plurality of electronic components.

Claim 4

The module of claim 2 further including at least a first through-hole extending through said first ceramic substrate; and a first conductor disposed in said at least a first through-hole for interconnecting said first and second foils to enhance heat transfer from said first foil to said second foil.

Claim 5

The module of claim 2 wherein said bonding glass is selected from the group consisting of silicate, borosilicate, phosphate and zinc borosilicate glasses.

Claim 6

The module of claim 4 wherein the first ceramic substrate is formed of a material selected from the group consisting of alumina having a purity of over 90%, silica, silicon carbide, zirconia, beryllia, zircon and mixtures thereof.

Claim 7

The thermally conductive module of claim 1 further including a conduit in said first layer of bonding glass formed between said first layer of foil and said ceramic substrate, carrying cooling fluid to conduct heat from said first layer of foil.

Claim 8

The thermally conductive module of claim 6 wherein said metal or alloy foil is selected of an alloy from the group consisting of deoxidized and oxygen free copper alloy.

Claim 9

The module of claim 6 further including fluid source means connected to said first and second interconnected channels and said conduit for transferring the cooling fluid to and from said module.

Claim 10

The thermally conductive module of claim 1, wherein said first and second channels are cut into said second layer of foil by electronic drilling.

Claim 11

The thermally conductive module of claim 9 wherein said first and second channels have diameters as small as about 1 mil.

Claim 12

The process of forming a thermally conductive module adapted for mounting a plurality of electronic components, comprising the steps of: providing a first ceramic substrate; providing a first layer of metal or alloy foil having a first surface adapted for mounting at least one of said plurality of electronic components; forming an open conduit in a second surface of said first layer of foil for carrying cooling fluid to conduct heat from said module; coating said second surface of said first layer of foil with a first layer of said glass, said conduit being free of said glass coating; providing a bonding glass; stacking said second surface of said first layer of foil to a first surface of said ceramic substrate with said first layer of said bonding glass therebetween whereby said conduit is closed by said ceramic substrate; providing a second layer of metal or alloy foil for conducting heat from said module; forming at least a first and second interconnected channels within said second layer of foil to carry cooling fluid; stacking said second layer of foil on a second surface of said first ceramic substrate with said second layer of bonding glass therebetween; and heating the assembly of said first and second layers of foil, said first and second layers of glass and said substrate to bond said assembly together.

Claim 13

The process of forming a thermally conductive module adapted for mounting a plurality of electronic components, comprising the steps of: providing a first ceramic substrate; providing a first layer of metal or alloy foil having a first surface adapted for mounting at least one of said plurality of electronic components; forming an open conduit in a second surface of said first layer of foil for carrying cooling fluid to conduct heat from said module; coating said second surface of said first layer of foil with a first layer of said glass, said conduit being free of said glass coating; providing a bonding glass; stacking said second surface of said first layer of foil to a first surface of said ceramic substrate with said first layer of said bonding glass therebetween whereby said conduit is closed by said ceramic substrate; providing a second layer of metal or alloy foil for conducting heat from said module; forming at least a first and second interconnected channels within said second layer of foil to carry cooling fluid; stacking said second layer of foil on a second surface of said first ceramic substrate with said second layer of bonding glass therebetween; and heating the assembly of said first and second layers of foil, said first and second layers of glass and said substrate to bond said assembly together.

Claim 14

The process of claim 11 including the step of forming said first and second channels by cutting into said second layer of foil by electronic drilling.

Claim 15

The process of claim 11 including the step of selecting said metal or alloy foil from the group consisting of deoxidized and oxygen free copper alloy.

Claim 16

The process of claim 13 further including the steps of: providing fluid source means; and connecting said fluid source means to said first and second interconnected channels and to said conduit for transferring the cooling fluid to and from said module.

Claim 17

The process of claim 14 including the step of forming circuitry in said first layer of foil being adapted for electrical connection with one or more of said plurality of electronic components.

Claim 18

The process of claim 12 wherein said first and second channels are drilled to diameters as small as about 1 mil.

Claim 19

A hermetically sealed module adapted for mounting a plurality of electronic components, comprising: a first ceramic substrate; a first layer of metal or alloy foil being disposed on a first surface of said first ceramic substrate, said first layer of foil adapted for mounting at least one of said plurality of electronic components; a first layer of bonding glass bonding said first layer of foil to a first surface of said ceramic substrate; a second layer of metal or alloy foil disposed on a second surface of said first ceramic substrate, said second layer of foil having at least a first and second channels carrying cooling fluid to conduct heat from said module; a second layer of bonding glass bonding said second layer of foil to said second surface of said first ceramic substrate; and a second ceramic substrate stacked against the second surface of said first ceramic substrate, a first surface of said second ceramic substrate being bonded to said first ceramic substrate with a third layer of said bonding glass.

Claim 20

A hermetically sealed module adapted for mounting a plurality of electronic components, comprising: a first ceramic substrate; a first layer of metal or alloy foil being disposed on a first surface of said first ceramic substrate, said first layer of foil adapted for mounting at least one of said plurality of electronic components; a first layer of bonding glass bonding said first layer of foil to a first surface of said ceramic substrate; a second layer of metal or alloy foil disposed on a second surface of said first ceramic substrate, said second layer of foil having at least a first and second channels carrying cooling fluid to conduct heat from said module; a second layer of bonding glass bonding said second layer of foil to said second surface of said first ceramic substrate; and a second ceramic substrate stacked against the second surface of said first ceramic substrate, a first surface of said second ceramic substrate being bonded to said first ceramic substrate with a third layer of said bonding glass.

Claim 21

The module of claim 17 further including at least one through-hole extending through said second ceramic substrate; and a conductor disposed in said at least one through-hole for electrical interconnection with said second layer metal or alloy foil.

Claim 22

The module of claim 18 further including at least a first conductor pin bonded to said at least one conductor, said first conductor pin extending outward from said module.

Claim 23

The thermally conductive module of claim 17 further including a conduit in said first layer of bonding glass formed between said first layer of foil and said ceramic substrate, carrying cooling fluid to conduct heat from said first layer of foil.

Claim 24

The thermally conductive module of claim 20 wherein said metal or alloy foil is selected of an alloy from the group consisting of deoxidized and oxygen free copper alloy.

Claim 25

The module of claim 17 further including a third layer of metal or alloy foil, said third layer of foil adapted for mounting at least one of a plurality of electronic components; and a fourth layer of said bonding glass bonding said third layer of foil to a second surface of second ceramic substrate.

Claim 26

The module of claim 22 further including at least a second conduit within said third layer of foil to carry cooling fluid for conducting heat from said module.

Claim 27

The module of claim 23 further including fluid source means connected to said first and second interconnected channels and said first and second conduits for transferring the cooling fluid to and from said module.

Claim 28

The module of claim 23 further including first and second ceramic covers; and means for hermetically sealing said first and second covers to said first and second ceramic substrates, respectively.

Claim 29

The module of claim 25 wherein said third layer of foil includes circuitry formed therein and adapted for electrical connection to one or more of said plurality of electronic components.

Claim 30

The hermetically sealed module of claim 17 wherein said first and second channels are cut into said second layer of foil by electronic drilling.

Claim 31

The hermetically sealed module of claim 27 wherein said first and second channels have diameters as small as about 1 mil.

Claim 32

A thermally conductive module adapted for mounting a plurality of electronic components, comprising: a first ceramic substrate; a first layer of metal or alloy foil being disposed on a first surface of said first ceramic substrate, said first layer of foil adapted for mounting at least one of said plurality of electronic components; a first layer of bonding glass bonding said first layer of foil to a first surface of said ceramic substrate; and a first conduit embedded wholly within the thickness of said first layer of foil carrying cooling fluid to conduct heat from said module.

Claim 33

A thermally conductive module adapted for mounting a plurality of electronic components, comprising: a first ceramic substrate; a first layer of metal or alloy foil being disposed on a first surface of said first ceramic substrate, said first layer of foil adapted for mounting at least one of said plurality of electronic components; a first layer of bonding glass bonding said first layer of foil to a first surface of said ceramic substrate; and a first conduit embedded wholly within the thickness of said first layer of foil carrying cooling fluid to conduct heat from said module.

Claim 34

The thermally conductive module of claim 29 wherein said metal or alloy foil is selected of an alloy from the group consisting of deoxidized and oxygen free copper alloy.

Claim 35

The module of claim 30 further including fluid source means connected to said conduit for transferring the cooling fluid to and from said module.