US4602318A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrates to interconnect electronic components
Assignee: Advanced Interconnection Technology Inc
•
Filing: 1984-07-25
•
Granted: 1986-07-22
•
Expires: 2004-07-25
Abstract
Abstract Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
Inventors
- 👤 Charles L. Lassen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:12
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K7/00; H05K7/02; H05K7/06; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K3/00; H05K3/10; H05K3/103; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
130 words
An article for providing high density electronic networks comprising: (a) a substrate; (b) a plurality of filaments having at least one conductive portion; (c) an encapsulating coating which maintains the positional stability of the filaments in relation to a datum, the surface of said coating being substantially smooth, flat and planar; (d) at least one termination point comprising a cavity at a predetermined point in registration with a filament, said conductive portion of said filament being substantially exposed and traversing said cavity, such that the position of said filament is maintained by surrounding material comprising the encapsulating coating; and (e) interfacing means at said predetermined points in contact with and substantially surrounding said filament, thereby interfacing the conductive portion of said filament with the external surface of said encapsulating coating.
Claim 2
Dependent Claim
130 words
An article for providing high density electronic networks comprising: (a) a substrate; (b) a plurality of filaments having at least one conductive portion; (c) an encapsulating coating which maintains the positional stability of the filaments in relation to a datum, the surface of said coating being substantially smooth, flat and planar; (d) at least one termination point comprising a cavity at a predetermined point in registration with a filament, said conductive portion of said filament being substantially exposed and traversing said cavity, such that the position of said filament is maintained by surrounding material comprising the encapsulating coating; and (e) interfacing means at said predetermined points in contact with and substantially surrounding said filament, thereby interfacing the conductive portion of said filament with the external surface of said encapsulating coating.
Claim 3
Dependent Claim
14 words
An article, as recited in claim 1, wherein said filament is an insulated conductor.
Claim 4
Dependent Claim
15 words
An article, as recited in claim 1, wherein said filament is an insulated metal wire.
Claim 5
Dependent Claim
17 words
An article, as recited in claim 3, wherein said insulated metal wire is an insulated copper wire.
Claim 6
Dependent Claim
15 words
An article, as recited in claim 1, wherein said interfacing means is a conductive material.
Claim 7
Dependent Claim
13 words
An article, as recited in claim 5, wherein said conductive material is plated.
Claim 8
Dependent Claim
17 words
An article, as recited in claim 5, wherein said conductive material is electrolessly plated and then electroplated.
Claim 9
Dependent Claim
15 words
An article, as recited in claim 5, wherein said conductive material is electrolessly plated metal.
Claim 10
Dependent Claim
12 words
An article, as recited in claim 1, having a plurality of cavities.
Claim 11
Dependent Claim
45 words
An article, as recited in claim 1, wherein said substrate comprises a core which has a coefficient of thermal expansion in the plane parallel to the plane on which components are to be mounted which substantially matches the coefficient of thermal expansion of said components.
Claim 12
Dependent Claim
22 words
An article, as recited in claim 10, wherein said coefficient of thermal expansion is from about 5 to about 20×10 -6 in/in/°C.
Claim 13
Dependent Claim
14 words
An article, as recited in claim 11, wherein said core comprises a metal alloy.
Claim 14
Dependent Claim
18 words
An article, as recited in claim 12, wherein said metal alloy comprises about 35-45% nickel and 55-65% iron.
Claim 15
Dependent Claim
14 words
An article, as recited in claim 12, wherein said core is clad with copper.
Claim 16
Dependent Claim
38 words
An article, as recited in claim 10, wherein said core comprises a fiberglass-reinforced epoxy resin sheet bonded on both planar surfaces to 35-40% nickel, 60-65% iron metal alloy sheets said metal alloy sheets being clad with copper metal.
Claim 17
Dependent Claim
15 words
An article, as recited in claim 10, wherein said core comprises a polymer resin sheet.
Claim 18
Dependent Claim
15 words
An article, as recited in claim 16, wherein said polymer resin sheet comprises a polyimide.
Claim 19
Dependent Claim
15 words
An article, as recited in claim 16, wherein said polymer resin sheet comprises an epoxy.
Claim 20
Dependent Claim
73 words
An article, as recited in claim 1, wherein said substrate comprises a core clad with conductive material, a circuit pattern, a laminate sheet comprising a non-conductive layer and a conductive layer wherein said conductive layer is external to the article, a circuit pattern formed on said external conductive layer, and at least one cavity formed in the non-conductive layer which is exposed after the formation of said circuit pattern, said pattern being plated.
Claim 21
Dependent Claim
21 words
An article, as recited in claim 1, having filaments, an encapsulation layer and cavities on both planar surfaces of the substrate.
Claim 22
Dependent Claim
110 words
An article for providing high density networks comprising a substrate, a plurality of filaments, said filaments having at least one conductive portion, which have been applied and affixed to said substrate, a substantially smooth, flat, planar encapsulation layer which maintains the positional relationship of the filaments, at least one cavity at a predetermined point in registration with a filament, said conductive portion of said filament being substantially exposed, at least one hole intersecting a filament and extending through said substrate, means for interfacing said cavity and filament with the surface of the encapsulating layer and means for interfacing said hole and intersected filament with the surface of the encapsulation layer.
Claim 23
Dependent Claim
110 words
An article for providing high density networks comprising a substrate, a plurality of filaments, said filaments having at least one conductive portion, which have been applied and affixed to said substrate, a substantially smooth, flat, planar encapsulation layer which maintains the positional relationship of the filaments, at least one cavity at a predetermined point in registration with a filament, said conductive portion of said filament being substantially exposed, at least one hole intersecting a filament and extending through said substrate, means for interfacing said cavity and filament with the surface of the encapsulating layer and means for interfacing said hole and intersected filament with the surface of the encapsulation layer.
Claim 24
Dependent Claim
16 words
An article, as recited in claim 21, wherein said interfacing means are provided by metallized holes.
References Cited (Backward Citations)
US3674602A
Cited
US3646572A
Cited
US3646246A
Cited
US3701838A
Cited
US4000558A
Cited
US4065850A
Cited
US4276775A
Cited
GB2097998A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-21 | 1990-01-20 | 1990-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-21 | 1994-01-20 | 1994-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-21 | 1998-01-20 | 1998-07-22 | $7700.00 | Window Closed / Lapsed |