Semiconductor chip mounting system

Claim 2

A semiconductor chip module comprising: a mounting surface; a silicon semiconductor chip with electronic circuits formed therein having a back face and contacts on the opposite, front face, said back face being metallized and heat treated to include a nickel-rich silicide reaction layer, a nickel-vanadium barrier layer overlying the reaction layer, and a nickel-gold alloy layer overlying the barrier layer; and a solder layer securing the metallized back face of the chip to the mounting surface substantially without voids.

Claim 3

The module of claim 1 wherein the nickel-vanadium layer contains 7% by weight vanadium.

Claim 4

The module of claim 1 wherein the barrier layer is metallized nickel--7 wt. % vanadium.

Claim 5

The module of claim 3 wherein said gold layer has a thickness of approximately 3,000 Angstroms.

Claim 6

A semiconductor chip module comprising: a mounting surface; a silicon semiconductor chip with electronic circuits therein having a back face and contacts on the opposite, front face, said back face being metallized to include a layer of gold and nickel-vanadium reacted with the silicon to form a diffusion of gold and silicon and a nickel-rich silicide, a layer of nickel-vanadium, a layer of gold/nickel-vanadium alloy, and a gold layer; and a solder layer securing the metallized back face of the chip to the mounting surface the gold layer being leached into the solder during soldering.

Claim 7

A semiconductor chip module comprising: a mounting surface; a silicon semiconductor chip with electronic circuits therein having a back face and contacts on the opposite, front face, said back face being metallized to include a layer of gold and nickel-vanadium reacted with the silicon to form a diffusion of gold and silicon and a nickel-rich silicide, a layer of nickel-vanadium, a layer of gold/nickel-vanadium alloy, and a gold layer; and a solder layer securing the metallized back face of the chip to the mounting surface the gold layer being leached into the solder during soldering.

Claim 8

The module of claim 1 or 5 wherein the mounting surface comprises a heat sink having a cooled mounting surface.

Claim 9

the module of claim 6 wherein the heat sink is liquid cooled.

Claim 10

The module of claim 6 wherein the heat sink is constructed of molybdenum.

Claim 11

The module of claim 1 or 5 wherein the solder is lead/indium in equal parts by weight.

Claim 12

The module of claim 1 or 5 wherein the solder has melting/freezing temperature of about 160° C.

Claim 13

The module of claim 1 or 5 wherein the semiconductor chip comprises a single, unitary chip having an area of about 3,600 square millimeters.

Claim 14

The module according to claim 3 wherein a portion of the reaction layer is formed by reaction of the silicon with the barrier layer.

Claim 15

The module according to claim 12 wherein the solder layer has gold disposed therein.

Claim 16

The module according to claim 13 wherein the gold is leached from a gold layer disposed between the solder layer and the barrier layer.

Claim 17

The module according to claim 14 wherein the solder layer has nickel and vanadium disposed therein.

Claim 18

The module according to claim 15 wherein the nickel and vanadium are leached from a nickel-vanadium intermediate layer disposed between the solder layer and the barrier layer.

Claim 19

The module according to claim 16 wherein the nickel-vanadium intermediate layer has a thickness of approximately 800 Anstroms.

Claim 20

The module according to claim 16 wherein the nickel-vanadium intermediate layer is disposed between the gold layer and the barrier layer, the gold layer forming a wetable surface for the solder layer.

Claim 21

The module according to claim 18 wherein the nickel-vanadium intermediate layer is disposed between the gold layer and the nickel-gold alloy layer.