Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
81 words
A hybrid integrated circuit substrate for a motor circuit comprising: a magnetic substrate; a resin layer formed at least on one major surface of said magnetic substrate, said resin layer containing aromatic polyamide fiber mixed therein; and a copper foil layer formed on said resin layer; the ratio between the thickness of said copper foil layer and said resin layer being in a range selected to conform the coefficient of expansion thereof to the coefficient of expansion of said magnetic substrate.
Claim 2
Dependent Claim
81 words
A hybrid integrated circuit substrate for a motor circuit comprising: a magnetic substrate; a resin layer formed at least on one major surface of said magnetic substrate, said resin layer containing aromatic polyamide fiber mixed therein; and a copper foil layer formed on said resin layer; the ratio between the thickness of said copper foil layer and said resin layer being in a range selected to conform the coefficient of expansion thereof to the coefficient of expansion of said magnetic substrate.
Claim 3
Dependent Claim
21 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said magnetic substrate is a iron substrate.
Claim 4
Dependent Claim
24 words
A hybrid integrated circuit substrate for a motor in accordance with claim 2, wherein said iron substrate is 0.35 to 1.0 mm in thickness.
Claim 5
Dependent Claim
22 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said resin layer is an epoxy resin layer.
Claim 6
Dependent Claim
36 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein the ratio in thickness of said copper foil layer to said resin layer is within a range of about 0.1 to 0.7.
Claim 7
Dependent Claim
29 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said aromatic polyamide fiber has a thermal expansion coefficient of about -2×10 -6 /° C.
Claim 8
Dependent Claim
29 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said aromatic polyamide fiber is mixed in said resin layer in the form of cloth.
Claim 9
Dependent Claim
29 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said aromatic polyamide fiber is mixed in said resin layer in the form of paper.
Claim 10
Dependent Claim
24 words
A hybrid integrated circuit substrate for a motor in accordance with claim 1, wherein said copper foil layer forms conductive paths of prescribed patterns.
Claim 11
Dependent Claim
166 words
A motor comprising: a hybrid integrated circuit substrate including: a magnetic substrate, a resin layer formed on one major surface of said magnetic substrate, said resin layer containing aromatic polyamide fiber mixed therein, and a cooper foil layer formed on said resin layer to form conductive paths of prescribed patterns, the ratio between the thickness of said copper foil layer and said resin layer being in a range selected to conform the coefficient of expansion thereof to the coefficient of expansion of said magnetic substrate; stator coils arranged on said resin layer to be connected to said conductive paths; magnetic circuit elements arranged on said resin layer to be connected to said conductive paths; bearing means formed on said hybrid integrated circuit substrate; rotor case having a rotor shaft supported by said bearing means; and a rotor magnet provided in said rotor case to be opposite to said stator coils while defining a prescribed space in the axial direction between said stator coils and the same.
Claim 12
Dependent Claim
166 words
A motor comprising: a hybrid integrated circuit substrate including: a magnetic substrate, a resin layer formed on one major surface of said magnetic substrate, said resin layer containing aromatic polyamide fiber mixed therein, and a cooper foil layer formed on said resin layer to form conductive paths of prescribed patterns, the ratio between the thickness of said copper foil layer and said resin layer being in a range selected to conform the coefficient of expansion thereof to the coefficient of expansion of said magnetic substrate; stator coils arranged on said resin layer to be connected to said conductive paths; magnetic circuit elements arranged on said resin layer to be connected to said conductive paths; bearing means formed on said hybrid integrated circuit substrate; rotor case having a rotor shaft supported by said bearing means; and a rotor magnet provided in said rotor case to be opposite to said stator coils while defining a prescribed space in the axial direction between said stator coils and the same.
Claim 13
Dependent Claim
15 words
A motor in accordance with claim 10, wherein said magnetic substrate is an iron substrate.
Claim 14
Dependent Claim
18 words
A motor in accordance with claim 11, wherein said iron substrate is 0.35 to 1.0 mm in thickness.
Claim 15
Dependent Claim
16 words
A motor in accordance with claim 10, wherein said resin layer is an epoxy resin layer.
Claim 16
Dependent Claim
30 words
A motor in accordance with claim 10, wherein the ratio in thickness of said copper foil layer to said resin layer is within a range of about 0.1 to 0.7.
Claim 17
Dependent Claim
23 words
A motor in accordance with claim 10, wherein said aromatic polyamide fiber has a thermal expansion coefficient of about -2×10 -6 /° C.
Claim 18
Dependent Claim
23 words
A motor in accordance with claim 10, wherein said aromatic polyamide fiber is mixed in said resin layer in the form of cloth.
Claim 19
Dependent Claim
23 words
A motor in accordance with claim 10, wherein said aromatic polyamide fiber is mixed in said resin layer in the form of paper.
Claim 20
Dependent Claim
63 words
A hybrid integrated substrate in accordance with claim 1, said substrate being of the type in which said copper foil layer is formed into conductive paths of prescribed patterns, and further comprising: stator and coils arranged on said resin layer to be connected to said conductive paths; and magnetic circuit elements arranged on said resin layer to be connected to said conductive paths.