Patent US4737236A successfully refreshed from Google Patents.
US4737236A
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Method of making microwave integrated circuits
Assignee: TE Connectivity Corp
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Filing: 1986-09-08
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Granted: 1988-04-12
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Expires: 2006-09-08
Abstract
Abstract A method of making a multiplicity of microwave integrated circuits is disclosed wherein a thin glass substrate is etched to contain both via holes and large area holes which receive discrete active devices therein. An electrically and thermally conductive carrier is adhered to one surface of the glass substrate with the electrical interconnections and circuit components formed on the opposing surface of the glass substrate. The method enables a multiplicity of microwave circuits to be made and tested by batch processing techniques prior to division into individual circuits.
Inventors
- 👤 Richard J. Perko
- 👤 Alejandro Chu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 20:07
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W44/00; H10W44/20; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/075; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/50; H10W72/521; H10W72/527; H10W72/531; H10W72/533; H10W72/534; H10W72/5363; H10W72/5366; H10W72/537; H10W72/541; H10W72/5445; H10W72/547; H10W72/5473; H10W72/5475; H10W72/59; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
192 words
A method of making a multiplicity of individual microwave integrated circuits wherein a glass substrate is utilized both as a dielectric material for the transmission of microwave energy and as a fabrication base for circuit components, said method comprising the following steps: (a) etching selected areas of at least one surface of a thin glass substrate having a thickness within the range of 4 to 12 mils and including first and second opposing surfaces to form a multiplicity of openings extending therethrough; (b) adhering an electrically and thermally conductive carrier to said first or second opposing surface of said glass substrate; (c) forming a multiplicity of conductive patterns on said at least one surface of the substrate; (d) placing active devices within selected openings of said multiplicity of opening said substrate; (e) affixing said active devices to said conductive carrier in heat transfer relationship thereto; (f) forming electrical interconnections between each of said active devices and an adjacent portion of the conductive pattern located on said at least one surface of the substrate; and (g) dividing said substrate and carrier into a multiplicity of individual integrated circuits containing active devices positioned therein.
Claim 2
Independent Claim
192 words
A method of making a multiplicity of individual microwave integrated circuits wherein a glass substrate is utilized both as a dielectric material for the transmission of microwave energy and as a fabrication base for circuit components, said method comprising the following steps: (a) etching selected areas of at least one surface of a thin glass substrate having a thickness within the range of 4 to 12 mils and including first and second opposing surfaces to form a multiplicity of openings extending therethrough; (b) adhering an electrically and thermally conductive carrier to said first or second opposing surface of said glass substrate; (c) forming a multiplicity of conductive patterns on said at least one surface of the substrate; (d) placing active devices within selected openings of said multiplicity of opening said substrate; (e) affixing said active devices to said conductive carrier in heat transfer relationship thereto; (f) forming electrical interconnections between each of said active devices and an adjacent portion of the conductive pattern located on said at least one surface of the substrate; and (g) dividing said substrate and carrier into a multiplicity of individual integrated circuits containing active devices positioned therein.
Claim 3
Dependent Claim
37 words
The method of claim 1 wherein said initial step comprises: (a) etching selected areas of said thin glass substrate to form a multiplicity of small and large diameter openings, said large diameter openings receiving active devices therein.
Claim 4
Dependent Claim
61 words
The method of claim 2 further comprising the steps of: (a) locating a mask on said one surface of the glass substrate to define a multiplicity of masked areas thereon; and (b) chemically etching said unmasked areas to form small and large diameter openings extending through the glass substrate prior to adhering said carrier to the opposing surface of said substrate.
Claim 5
Dependent Claim
31 words
The method of claim 3 further comprising the steps of locating masks on both surfaces of said substrate and then chemically etching unmasked areas on both surfaces of said glass substrate.
Claim 6
Dependent Claim
34 words
The method of claim 4 wherein the step of adhering a conductive carrier to said layer comprises: adhering a metal composite carrier to said opposing layer to form a structure for subsequent fabrication steps.
Claim 7
Independent Claim
188 words
A method of making a multiplicity of individual microwave integrated circuits wherein a glass substrate is utilized both as a dielectric material for the transmission of microwave energy and as a fabrication base for circuit components, said method comprising the following steps: (a) etching selected areas of at least one surface of a glass substrate having first and second opposing surfaces to form a multiplicity of openings extending therethrough; (b) plating a conductive layer on said first or second opposing surface of said glass substrate; (c) adhering an electrically and thermally conductive carrier to said layer; (d) forming a multiplicity of conductive patterns on said at least one surface of the substrate; (e) placing active devices within selected openings of said multiplicity of openings in said substrate; (f) affixing said active devices to said conductive carrier in heat transfer relationship thereto; (g) forming electrical interconnections between each of said active devices and an adjacent portion of the conductive pattern located on said at least one surface of the substrate; and (h) dividing said substrate and carrier into a multiplicity of individual integrated circuits containing active devices positioned therein.
Claim 8
Independent Claim
188 words
A method of making a multiplicity of individual microwave integrated circuits wherein a glass substrate is utilized both as a dielectric material for the transmission of microwave energy and as a fabrication base for circuit components, said method comprising the following steps: (a) etching selected areas of at least one surface of a glass substrate having first and second opposing surfaces to form a multiplicity of openings extending therethrough; (b) plating a conductive layer on said first or second opposing surface of said glass substrate; (c) adhering an electrically and thermally conductive carrier to said layer; (d) forming a multiplicity of conductive patterns on said at least one surface of the substrate; (e) placing active devices within selected openings of said multiplicity of openings in said substrate; (f) affixing said active devices to said conductive carrier in heat transfer relationship thereto; (g) forming electrical interconnections between each of said active devices and an adjacent portion of the conductive pattern located on said at least one surface of the substrate; and (h) dividing said substrate and carrier into a multiplicity of individual integrated circuits containing active devices positioned therein.
Claim 9
Dependent Claim
43 words
The method of claim 6 wherein said initial step comprises: (a) etching selected areas of at least one surface of a thin glass substrate having a thickness within the range of 4 to 12 mils to form a multiplicity of openings extending therethrough.
Claim 10
Dependent Claim
54 words
The method of claim 6 wherein the step of adhering a conductive carrier to said layer comprises: (a) placing a carrier formed of a semiconductor material and having a thickness at least as large as the glass substrate in contact with said layer; and (b) adhering said carrier to said layer and glass substrate.
Claim 11
Dependent Claim
49 words
The method of claim 6 wherein the step of adhering a conductive carrier to said layer comprises: (a) plating a metallic layer on said opposing layer; and (b) adhering a highly-doped silicon carrier, a metal composite or other carrier material thereto to form a structure for subsequent fabrication steps.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-12 | 1991-10-12 | 1992-04-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-12 | 1995-10-12 | 1996-04-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-12 | 1999-10-12 | 2000-04-12 | $7700.00 | Window Closed / Lapsed |