US4735908A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for fabricating solid-state imaging device
Assignee: Fujifilm Corp
•
Filing: 1987-07-24
•
Granted: 1988-04-05
•
Expires: 2007-07-24
Abstract
Abstract A solid-state imaging device having a scanning circuit and a photoconductive film formed in layers on a semiconductor substrate, and a process for forming the same, wherein high resolution with substantially no color mixing is attained. An electrode layer is formed over the semiconductor substrate for providing the plural electrodes, and a photoconductive film is formed over the electrode layer. A first transparent electrode is produced over the photoconductive film, after which a resist pattern is formed on the first transparent electrode layer corresponding to the pixels. The first transparent layer and the photoconductive film are etched according to the resist pattern to spatially isolate adjacent pixels in the first transparent layer and the photoconductive film. Adjacent pixels are isolated by etching, using the resist pattern, that part of the electrode layer on which are disposed the first transparent electrode layer and the photoconductive film between isolated pixels.
Inventors
- 👤 Akio Higashi
- 👤 Haruji Shinada
- 👤 Kazuhiro Kawajiri
- 👤 Yoshihiro Ono
- 👤 Mitsuo Saitou
- 👤 Hiroshi Tamura
- 👤 Mitsuru Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 11:01
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/20; H10F77/244; H10F39/00; H10F39/10; H10F39/12; H10F39/191
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
180 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming said photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; forming a resist pattern on said first transparent electrode layer that corresponds to said plurality of pixels; etching said first transparent electrode layer and said photoconductive film according to said resist pattern so as to spatially isolate adjacent pixels in said first transparent electrode layer and said photoconductive film; and isolating adjacent pixels in said electrode layer by etching, according to said resist pattern, that part of said electrode layer on which are disposed said first transparent electrode layer and said photoconductive film between isolated pixels.
Claim 2
Dependent Claim
180 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming said photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; forming a resist pattern on said first transparent electrode layer that corresponds to said plurality of pixels; etching said first transparent electrode layer and said photoconductive film according to said resist pattern so as to spatially isolate adjacent pixels in said first transparent electrode layer and said photoconductive film; and isolating adjacent pixels in said electrode layer by etching, according to said resist pattern, that part of said electrode layer on which are disposed said first transparent electrode layer and said photoconductive film between isolated pixels.
Claim 3
Dependent Claim
228 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming said photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; forming a resist pattern on said first transparent electrode layer that corresponds to said plurality of pixels; etching said first transparent electrode layer and said photoconductive film according to said resist pattern so as to spatially isolate adjacent pixels in said first transparent electrode layer and said photoconductive film; isolating adjacent pixels in said electrode layer by etching, according to said resist pattern, that part of said electrode layer on which are disposed said first transparent electrode layer and said photoconductive film between isolated pixels; covering a space between adjacent isolated pixels with a passivation film; depositing a second transparent electrode layer over said first transparent electrode layer and said passivation film; and providing a light-shielding layer in that area of said second transparent electrode layer which corresponds to spaces between adjacent isolated pixels.
Claim 4
Dependent Claim
228 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming said photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; forming a resist pattern on said first transparent electrode layer that corresponds to said plurality of pixels; etching said first transparent electrode layer and said photoconductive film according to said resist pattern so as to spatially isolate adjacent pixels in said first transparent electrode layer and said photoconductive film; isolating adjacent pixels in said electrode layer by etching, according to said resist pattern, that part of said electrode layer on which are disposed said first transparent electrode layer and said photoconductive film between isolated pixels; covering a space between adjacent isolated pixels with a passivation film; depositing a second transparent electrode layer over said first transparent electrode layer and said passivation film; and providing a light-shielding layer in that area of said second transparent electrode layer which corresponds to spaces between adjacent isolated pixels.
Claim 5
Dependent Claim
53 words
The process according to claim 1 or 2, wherein said photoconductive film comprises a p + type amorphous silicon film and an n- or i-type amorphous silicon film arranged in a superposed relationship so that said p + type amorphous silicon film is located closer to a surface on which incident light falls.
Claim 6
Dependent Claim
74 words
The process according to claim 1 or 2, wherein said photoconductive film comprises a p + type amorphous silicon film, an n- or i-type amorphous silicon film and a p - type amorphous silicon film arranged in a superposed relationship so that said p + type amorphous silicon film is located closest to a surface on which incident light falls, whereas said p - type amorphous silicon film is located farthest from such surface.
Claim 7
Dependent Claim
204 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming a photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; photolithographically separating said electrode layer, said photoconductive film and said first transparent electrode layer to provide regions corresponding to said plurality of pixels; depositing an interlevel insulation film over the separated first transparent electrode layer and isolation regions between adjacent pixels; photolithographically forming holes in selected areas of said interlevel insulation film that correspond to said plurality of pixels; forming a second transparent electrode layer over said interlevel insulation film with holes and that portion of said first transparent electrode layer which is exposed in said holes; and forming a light-shielding metal layer in that area of said second transparent electrode layer which corresponds to isolation regions between adjacent pixels.
Claim 8
Dependent Claim
204 words
A process for fabricating a solid-state imaging device that comprises a semiconductor substrate having arranged thereon, in the stated order, a circuit for scanning a plurality of pixels, a photoconductive film and a transparent electrode layer, said plurality of pixels being defined by a plurality of electrodes on said semiconductor substrate and said transparent electrode layer, said process comprising the steps of: forming an electrode layer over said semiconductor substrate for providing said plurality of electrodes; forming a photoconductive film over said electrode layer; forming a first transparent electrode layer over said photoconductive film; photolithographically separating said electrode layer, said photoconductive film and said first transparent electrode layer to provide regions corresponding to said plurality of pixels; depositing an interlevel insulation film over the separated first transparent electrode layer and isolation regions between adjacent pixels; photolithographically forming holes in selected areas of said interlevel insulation film that correspond to said plurality of pixels; forming a second transparent electrode layer over said interlevel insulation film with holes and that portion of said first transparent electrode layer which is exposed in said holes; and forming a light-shielding metal layer in that area of said second transparent electrode layer which corresponds to isolation regions between adjacent pixels.
References Cited (Backward Citations)
US4236829A
Cited
US4532536A
Cited
US4582721A
Cited
US4507519A
Cited
US4542578A
Cited
US4447291A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-04-05 | 1991-10-05 | 1992-04-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-04-05 | 1995-10-05 | 1996-04-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-04-05 | 1999-10-05 | 2000-04-05 | $7700.00 | Window Closed / Lapsed |