Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
219 words
A GaAs semiconductor device comprising an enhancement-mode FET and a depletion-mode FET which have a heterojunction and at least one of which utilizes a two-dimensional electron gas, said semiconductor device comprising: a semi-insulating GaAs substrate; an updoped GaAs layer formed on said semi-insulating GaAs substrate; an N-type AlGaAs layer formed on said undoped GaAs layer and including an exposed portion; a first N-type GaAs layer formed on said N-type AlGaAs layer and having a groove formed therein; an etching stoppable N-type AlGaAs layer formed on said first N-type GaAs layer; a second N-type GaAs layer formed on said etching stoppable N-type AlGaAs layer and having a groove formed therein; a gate electrode of said enhancement-mode FET self-aligningly filling the groove formed in said first GaAs layer and formed on an exposed portion of said N-type AlGaAs layer for providing an electron supply layer for said enhancement-mode FET; and a gate electrode of said depletion-mode FET for self-aligning filling a groove formed in said second N-type GaAs layer and formed on an exposed portion of said etching stoppable AlGaAs layer, said etching stoppable layer, said first GaAs layer and said N-type AlGaAs layer providing an electron supply layer for said depletion-mode FET, said gate electrode of said enhancement-mode FET and said gate electrode of said depletion-mode FET being formed simultaneously.
Claim 2
Dependent Claim
219 words
A GaAs semiconductor device comprising an enhancement-mode FET and a depletion-mode FET which have a heterojunction and at least one of which utilizes a two-dimensional electron gas, said semiconductor device comprising: a semi-insulating GaAs substrate; an updoped GaAs layer formed on said semi-insulating GaAs substrate; an N-type AlGaAs layer formed on said undoped GaAs layer and including an exposed portion; a first N-type GaAs layer formed on said N-type AlGaAs layer and having a groove formed therein; an etching stoppable N-type AlGaAs layer formed on said first N-type GaAs layer; a second N-type GaAs layer formed on said etching stoppable N-type AlGaAs layer and having a groove formed therein; a gate electrode of said enhancement-mode FET self-aligningly filling the groove formed in said first GaAs layer and formed on an exposed portion of said N-type AlGaAs layer for providing an electron supply layer for said enhancement-mode FET; and a gate electrode of said depletion-mode FET for self-aligning filling a groove formed in said second N-type GaAs layer and formed on an exposed portion of said etching stoppable AlGaAs layer, said etching stoppable layer, said first GaAs layer and said N-type AlGaAs layer providing an electron supply layer for said depletion-mode FET, said gate electrode of said enhancement-mode FET and said gate electrode of said depletion-mode FET being formed simultaneously.
Claim 3
Dependent Claim
25 words
A device according to claim 1, wherein a drain electrode of said enhancement-mode FET and a source electrode of said depletion-mode FET are in common.
Claim 4
Dependent Claim
19 words
A device according to claim 1, wherein all the electrodes of both said FET's are separated from each other.
Claim 5
Dependent Claim
44 words
The device of claim 1, comprising an isolation region for isolating said FETSs from each other, said isolation region extending to include the portion of said N-type AlGaAs layer underneath said depletion-mode GaAs FET, wherein only said enhancement-mode FET utilizes said two-dimensional electron gas.
Claim 6
Dependent Claim
29 words
The device of claim 1, comprising an isolation region for isolating said FETs, said isolation region extending to said substrate, wherein both said FETs utilize a two-dimensional electron gas.
Claim 7
Dependent Claim
20 words
The device of claim 1, comprising two source and drain electrodes of said FETs being provided by a single electrode.