US4729063A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic molded semiconductor integrated circuit device with nail section
Assignee: Mitsubishi Electric Corp
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Filing: 1986-02-20
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Granted: 1988-03-01
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Expires: 2006-02-20
Abstract
Abstract A plastic molded semiconductor integrated circuit device, includes: a semiconductor substrate in which circuit elements are fabricated, metal wirings for transmitting the power supply voltage or signals of internal circuits provided on the semiconductor substrate via an insulating film, a plurality of apertures produced at portions of the insulating film directly below the metal wirings, and a nail section provided integrally with the metal wiring in the aperture, wherein the nail section is provided without being electrically connected with any of the circuit elements or the other metal wirings.
Inventors
- 👤 Ryuichi Matsuo
- 👤 Masahide Kaneko
- 👤 Hirokazu Harima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 03:34
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/42; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
92 words
A plastic molded semiconductor integrated circuit device, comprising: a semiconductor substrate in which circuit elements are fabricated; metal wirings for transmitting a power supply voltage or signals of internal circuits, said metal wirings being provided on the semiconductor substrate via an insulating film; a plurality of apertures formed at portions of the insulating film directly below said metal wirings; and a nail section formed integrally with said metal wiring in said plurality of apertures, wherein said nail section is electrically independent from any of the circuit elements or the other metal wirings.
Claim 2
Dependent Claim
92 words
A plastic molded semiconductor integrated circuit device, comprising: a semiconductor substrate in which circuit elements are fabricated; metal wirings for transmitting a power supply voltage or signals of internal circuits, said metal wirings being provided on the semiconductor substrate via an insulating film; a plurality of apertures formed at portions of the insulating film directly below said metal wirings; and a nail section formed integrally with said metal wiring in said plurality of apertures, wherein said nail section is electrically independent from any of the circuit elements or the other metal wirings.
Claim 3
Dependent Claim
112 words
A plastic molded semiconductor integrated circuit device, comprising: a semiconductor substrate; metal wirings for transmitting a power supply voltage or signals of internal circuits; impurity diffusion layer means permitting voltages on said metal wirings to vary over a predetermined range without shorting into said semiconductor substrate, said diffusion layer means being produced by diffusing material into the semiconductor substrate directly below said metal wirings; and an insulating film provided between said metal wirings and said impurity diffusion layer means; wherein a portion of the metal of said metal wirings are extend into apertures formed in said insulating film at predetermined intervals for electrically connecting metal wirings and said impurity diffusion layer means.
Claim 4
Dependent Claim
112 words
A plastic molded semiconductor integrated circuit device, comprising: a semiconductor substrate; metal wirings for transmitting a power supply voltage or signals of internal circuits; impurity diffusion layer means permitting voltages on said metal wirings to vary over a predetermined range without shorting into said semiconductor substrate, said diffusion layer means being produced by diffusing material into the semiconductor substrate directly below said metal wirings; and an insulating film provided between said metal wirings and said impurity diffusion layer means; wherein a portion of the metal of said metal wirings are extend into apertures formed in said insulating film at predetermined intervals for electrically connecting metal wirings and said impurity diffusion layer means.
Claim 5
Dependent Claim
109 words
A plastic molded semiconductor integrated circuit device, comprising: metal wirings for transmitting a supply voltage power or signals of internal circuits; an insulating film formed between said metal wirings and a semiconductor substrate formed directly below said metal wirings; and conductivity layer means for permitting voltages on said metal wirings to vary over a predetermined range without shorting into said semiconductor substrate, said conductivity layer means being formed in said insulating film at predetermined intervals; wherein portions of metal of said metal wirings extend into apertures provided at a position above said conductivity layer of said insulating film for electrically connecting said metal wirings and said conductivity layer means.
Claim 6
Dependent Claim
109 words
A plastic molded semiconductor integrated circuit device, comprising: metal wirings for transmitting a supply voltage power or signals of internal circuits; an insulating film formed between said metal wirings and a semiconductor substrate formed directly below said metal wirings; and conductivity layer means for permitting voltages on said metal wirings to vary over a predetermined range without shorting into said semiconductor substrate, said conductivity layer means being formed in said insulating film at predetermined intervals; wherein portions of metal of said metal wirings extend into apertures provided at a position above said conductivity layer of said insulating film for electrically connecting said metal wirings and said conductivity layer means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-01 | 1991-08-31 | 1992-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-01 | 1995-08-31 | 1996-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-01 | 1999-08-31 | 2000-03-01 | $7700.00 | Window Closed / Lapsed |