US3604989A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure for rigidly mounting a semiconductor chip on a lead-out base plate
Assignee: NEC Corp
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Filing: 1969-10-09
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Granted: 1971-09-14
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Expires: 1989-10-09
Abstract
Abstract A semiconductor wiring unit is formed by passing conducting needles projecting from a stem plate through apertures formed in the wiring layers of a semiconductor chip. The apertures are located in registration with the needles. After insertion in the apertures the needles are soldered to the wiring layers.
Inventors
- 👤 Yuichi Haneta
- 👤 Toshio Wada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:27
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/20; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
129 words
A semiconductor device comprising a stem plate having a plurality of conductive needles projecting substantially perpendicularly from one main surface thereof; a semiconductor chip having apertures provided therethrough in the direction of the thickness thereof to admit said needles in one-to-one correspondence, said needles respectively extending through said apertures, an insulator film covering one main surface of said semiconductor chip, a plurality of circuit elements formed in said chip, a plurality of wiring conductor strips formed on said insulator film and electrically connected to said circuit elements and extending to said apertures; means for electrically connecting the free ends of said needles to said conducting strips, means for insulating said needles from said semiconductor chip, and wiring Means bonded to said stem plate and connected respectively to said needles.
Claim 2
Dependent Claim
129 words
A semiconductor device comprising a stem plate having a plurality of conductive needles projecting substantially perpendicularly from one main surface thereof; a semiconductor chip having apertures provided therethrough in the direction of the thickness thereof to admit said needles in one-to-one correspondence, said needles respectively extending through said apertures, an insulator film covering one main surface of said semiconductor chip, a plurality of circuit elements formed in said chip, a plurality of wiring conductor strips formed on said insulator film and electrically connected to said circuit elements and extending to said apertures; means for electrically connecting the free ends of said needles to said conducting strips, means for insulating said needles from said semiconductor chip, and wiring Means bonded to said stem plate and connected respectively to said needles.
Claim 3
Dependent Claim
47 words
The semiconductor of claim 1, in which said stem plate comprises an insulating base, each of said needles comprising a core portion having a lower part embedded in said base, said electrical connecting means including a layer of soldering material disposed over the projecting upper part thereof.
Claim 4
Dependent Claim
22 words
The semiconductor device of claim 1, in which said insulating means comprises an insulating material formed on the surfaces of said apertures.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-13 | 1975-03-15 | 1975-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-13 | 1979-03-15 | 1979-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-13 | 1983-03-15 | 1983-09-14 | $7700.00 | Window Closed / Lapsed |