US4727633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of securing metallic members together
Assignee: Techsearch LLC
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Filing: 1986-09-22
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Granted: 1988-03-01
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Expires: 2006-09-22
Abstract
Abstract Two metallic members are connected together over a defined area of respective surfaces of the members by providing at least one layer of metal on at least one of the surfaces. The or each layer of metal has at least one elementary component and is of essentially uniform composition over the defined area, and is of essentially uniform thickness over the defined area. The two surfaces are brought into confronting, contacting relationship, and heat is applied to cause the metal of the or each layer to melt, whereby the members are bonded together by an alloy having a melting point in the range from about 500 degrees C to about 900 degrees C.
Inventors
- 👤 Geoffrey C. Herrick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 02:19
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; B23K35/00; B23K35/001; B23K35/22; B23K35/24; B23K35/30; B23K35/3006; H; H10; H10W; H10W70/00; H10W70/099; B23K2101/00; B23K2101/36; B23K2101/40; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/346; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
112 words
A method of securing first and second metallic members together over a defined area of respective surfaces of said members, the first metallic member being a multiple layer metallic coating on a dielectric substrate, comprising: (a) coating a layer of metal on selected areas of the surface of the second metallic member, the layer of metal being silver and copper having a melting point in the range of 500 degrees C. to about 900 degrees C., being of essentially uniform composition over said area, and being of essentially uniform thickness over said defined area; (b) bringing said surfaces into confronting, contacting relationship; and (c) brazing the first and second metallic members together.
Claim 2
Independent Claim
112 words
A method of securing first and second metallic members together over a defined area of respective surfaces of said members, the first metallic member being a multiple layer metallic coating on a dielectric substrate, comprising: (a) coating a layer of metal on selected areas of the surface of the second metallic member, the layer of metal being silver and copper having a melting point in the range of 500 degrees C. to about 900 degrees C., being of essentially uniform composition over said area, and being of essentially uniform thickness over said defined area; (b) bringing said surfaces into confronting, contacting relationship; and (c) brazing the first and second metallic members together.
Claim 3
Dependent Claim
69 words
A method according to claim 1 wherein said dielectric substrate is made of a ceramic material and is formed within said area with a hole, the hole being metallized by the multiple layer metallic coating and the second metallic member covering the hole such that, when the layer of metal melts during the brazing step, a portion of the metal flows into the hole to provide an hermetic seal.
Claim 4
Dependent Claim
45 words
A method according to claim 2 wherein the layer of metal of step (a) comprises sequentially two layers of metal, the two layers being copper and silver and each being of essentially uniform thickness over said area and of essentially uniform thickness over said area.
Claim 5
Dependent Claim
19 words
A method according to claim 2 wherein the layer of metal comprises a eutectic alloy of copper and silver.
Claim 6
Independent Claim
130 words
A method for bonding a leadframe to a thin film hybrid substrate having throughholes comprising the steps of: evaporating consecutive layers of titanium, palladium and gold onto the substrate including the throughholes; masking the resulting metallized substrate and plating gold on the unmasked regions to form conductors having an annular portion around the throughholes; etching away the metallization, leaving only the conductors; contacting the leadframe having leads with a circular portion corresponding to the annular portion of the conductors, the leads being coated with a eutectic alloy of silver and copper, to the substrate such that the leads are in registration with and confront the conductors; and brazing the leads to the conductors such that a portion of the eutectic alloy flows into the throughholes to provide an hermetic seal.
Claim 7
Independent Claim
130 words
A method for bonding a leadframe to a thin film hybrid substrate having throughholes comprising the steps of: evaporating consecutive layers of titanium, palladium and gold onto the substrate including the throughholes; masking the resulting metallized substrate and plating gold on the unmasked regions to form conductors having an annular portion around the throughholes; etching away the metallization, leaving only the conductors; contacting the leadframe having leads with a circular portion corresponding to the annular portion of the conductors, the leads being coated with a eutectic alloy of silver and copper, to the substrate such that the leads are in registration with and confront the conductors; and brazing the leads to the conductors such that a portion of the eutectic alloy flows into the throughholes to provide an hermetic seal.
References Cited (Backward Citations)
US2133492A
Cited
US3923551A
Cited
JPS4814505B1
Cited
US4000054A
Cited
US3862488A
Cited
US3865970A
Cited
US3929426A
Cited
US3926360A
Cited
US4016050A
Cited
US4054484A
Cited
US4139881A
Cited
US4312897A
Cited
US4373259A
Cited
US4332341A
Cited
US4352449A
Cited
US4423401A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-01 | 1991-08-31 | 1992-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-01 | 1995-08-31 | 1996-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-01 | 1999-08-31 | 2000-03-01 | $7700.00 | Window Closed / Lapsed |