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US4724182A
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Thin film circuit substrate
Assignee: Alps Alpine Co Ltd
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Filing: 1986-11-25
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Granted: 1988-02-09
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Expires: 2006-11-25
Abstract
Abstract Disclosed is a thin film circuit substrate which comprises an electrically insulating substrate, and at least one conductor layer and one protecting layer which are formed on the substrate, the insulating substrate having a surface roughness which is equal to or smaller than 0.1 μRa when measured as a center line average height. The thin film circuit substrate is suitable for use, for example, in a thermal head.
Inventors
- 👤 Masakazu Kato
- 👤 Takashi Shirakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 06:14
CPC Classifications
H; H10; H10N; H10N97/00; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926; Y10T428/31
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
101 words
A thin film circuit substrate comprising: an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; a conductor layer formed on said surface of said substrate, and a protecting layer formed on said conductor layer, wherein the low surface roughness of the insulating substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
Claim 2
Dependent Claim
101 words
A thin film circuit substrate comprising: an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; a conductor layer formed on said surface of said substrate, and a protecting layer formed on said conductor layer, wherein the low surface roughness of the insulating substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
Claim 3
Dependent Claim
104 words
A thermal head having a thin film circuit substrate comprising: an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; a conductor layer formed on said surface of said substrate, and a protecting layer formed on said conductor layer, wherein the low surface roughness of the substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
Claim 4
Dependent Claim
104 words
A thermal head having a thin film circuit substrate comprising: an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; a conductor layer formed on said surface of said substrate, and a protecting layer formed on said conductor layer, wherein the low surface roughness of the substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
Claim 5
Independent Claim
104 words
A method of forming a thin film circuit substrate comprising: providing an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; forming a conductor layer on said surface of said substrate, and a protecting layer on said conductor layer, wherein the low surface roughness of the substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
Claim 6
Independent Claim
104 words
A method of forming a thin film circuit substrate comprising: providing an electrically insulating substrate made of a ceramic material and having a surface with a low surface roughness which is equal to or less than 0.1 μRa when measured as a centerline average height; forming a conductor layer on said surface of said substrate, and a protecting layer on said conductor layer, wherein the low surface roughness of the substrate allows the conductor and protecting layers to be formed without substantial surface uneveness such as might cause pin holes in the protecting layer and a resulting corrosion of the conductor layer to occur.
References Cited (Backward Citations)
US4343986A
Cited
US4340635A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-02-08 | 1991-08-10 | 1992-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-02-08 | 1995-08-10 | 1996-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-02-08 | 1999-08-10 | 2000-02-09 | $7700.00 | Window Closed / Lapsed |