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Low temperature deposition utilizing organometallic compounds

Assignee: Nokia Bell Labs
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Filing: 1986-07-28
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Granted: 1988-01-12
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Expires: 2006-07-28
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Abstract

Abstract It has been found that deposition temperature for materials such as cadmium mercury telluride is significantly lowered by precracking selected precursor materials. For example, if organometallic compounds such as diethylmercury and diethyltellurium are decomposed before introduction in the deposition vapor, epitaxial layer formation is possible at 250° C.

Inventors

  • 👤 Po-Yen Lu
  • 👤 Chi-Hua Wang
  • 👤 Larry M. Williams

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 10:01
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/29; H10P14/2901; H10P14/2907; H10P14/2911; H10P14/24; H10P14/2913; H10P14/2917; H10P14/34; H10P14/3402; H10P14/3424; H10P14/3432

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 74 words
A process for forming a device comprising the steps of (1) subjecting a heated substrate to at least two precursor gases whereby the deposition of a II-VI semiconductor material on said substrate is induced, and (2) completing said device CHARACTERIZED IN THAT at least one of said precursor gases substantially decomposes only at temperatures above 300° C. and each of said precursor gases that substantially decomposes only at temperatures above 300° C. is precracked.
Claim 2
Dependent Claim 74 words
A process for forming a device comprising the steps of (1) subjecting a heated substrate to at least two precursor gases whereby the deposition of a II-VI semiconductor material on said substrate is induced, and (2) completing said device CHARACTERIZED IN THAT at least one of said precursor gases substantially decomposes only at temperatures above 300° C. and each of said precursor gases that substantially decomposes only at temperatures above 300° C. is precracked.
Claim 3
Dependent Claim 12 words
The process of claim 1 wherein said II-VI material comprises cadmium telluride.
Claim 4
Dependent Claim 13 words
The process of claim 1 wherein said II-VI material comprises cadmium mercury telluride.
Claim 5
Dependent Claim 16 words
The process of claim 1 wherein said substrate is heated to a temperature below 300° C.
Claim 6
Dependent Claim 16 words
The process of claim 4 wherein said substrate is heated to a temperature below 250° C.
Claim 7
Dependent Claim 24 words
The process of claim 4 wherein an entity from said precracked precursor is reacted with a second of said precursor gases at the substrate.
Claim 8
Dependent Claim 24 words
The process of claim 1 wherein an entity from said precracked precursor is reacted with a second of said precursor gases at said substrate.
Claim 9
Dependent Claim 13 words
The process of claim 7 wherein said precursor that is precracked comprises dimethylmercury.
Claim 10
Dependent Claim 11 words
The process of claim 8 wherein said second precursor comprises dimethylcadmium.
Claim 11
Dependent Claim 13 words
The process of claim 1 wherein said precursor that is precracked is dimethylmercury.
Claim 12
Dependent Claim 13 words
The process of claim 1 wherein said precursor that is precracked is diethyltelluride.

References Cited (Backward Citations)

US4116733A Cited
US4468283A Cited
US4566918A Cited
JPS60215596A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-01-11 1991-07-13 1992-01-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-01-11 1995-07-13 1996-01-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-01-11 1999-07-13 2000-01-12 $7700.00 Window Closed / Lapsed

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