Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate
Abstract
Abstract The apparatus includes a treating container having a light transmission window and a closure member for opening and closing the container, a light source positioned opposite the light transmission window, and equipment for deoxygenating at least a substantial portion of the oxygen from the interior of the container. The container is charged with a semiconductor wafer adhered to a substantially light transparent substrate by a photo-setting adhesive agent. The agent is cured or hardened by irradiation by the light source thereby decreasing its adhesive force. A first cassette casing, a charging conveyor for removing untreated workpieces from the first cassette casing, a charging conveyor for removing untreated workpieces from the charging conveyor into the container can be provided at one side of the container. A discharging arm for removing the treated workpiece from the container, second cassette casing, and a discharging conveyor for transferring treated workpieces from the discharging arm to the second cassette casing can be provided on the other side of the container.
Inventors
- 👤 Eiichi Irie
Bibliographic Details
Claims Analysis
Total Claims: 6References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-01-11 | 1991-07-13 | 1992-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-01-11 | 1995-07-13 | 1996-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-01-11 | 1999-07-13 | 2000-01-12 | $7700.00 | Window Closed / Lapsed |