US4436985A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for heat treating semiconductor wafers
Assignee: GCA Corp
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Filing: 1982-05-03
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Granted: 1984-03-13
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Expires: 2002-05-03
Abstract
Abstract In the heat treating apparatus disclosed herein, a semiconductor wafer, held in a vacuum chuck, is traversed under an infrared source in which radiant energy from a linear, high intensity lamp is focused by an elongate elliptical reflector to generate a linear target zone through which the surface of the wafer is effectively scanned by the relative motion.
Inventors
- 👤 T. Jerome Weber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0436; C; C30; C30B; C30B33/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
138 words
Apparatus for heat treating semiconductor wafers, said apparatus comprising: infrared source means including a linear high intensity lamp and a linear reflector focusing radiation from said lamp on a linear target zone; a vacuum chuck for holding a wafer to be treated; a heat sink on the opposite side of said zone from said lamp; means for traversing said chuck through the region between said source and said sink from a first station on one side of the course to a second station on the other side of said source thereby to cause said zone to sweep the surface of a wafer held by said chuck; air track means for transporting wafers to be treated to said chuck at said first station; and air track means for taking treated wafers away from said chuck at said second station.
Claim 2
Dependent Claim
138 words
Apparatus for heat treating semiconductor wafers, said apparatus comprising: infrared source means including a linear high intensity lamp and a linear reflector focusing radiation from said lamp on a linear target zone; a vacuum chuck for holding a wafer to be treated; a heat sink on the opposite side of said zone from said lamp; means for traversing said chuck through the region between said source and said sink from a first station on one side of the course to a second station on the other side of said source thereby to cause said zone to sweep the surface of a wafer held by said chuck; air track means for transporting wafers to be treated to said chuck at said first station; and air track means for taking treated wafers away from said chuck at said second station.
Claim 3
Dependent Claim
145 words
Apparatus for heat treating semiconductor wafers, said apparatus comprising: infrared source means including a linear quartz lamp and a linear reflector incorporating cooling means for focusing radiation from said lamp on a linear target zone; a vacuum chuck for holding a wafer to be treated; a heat sink, on the opposite side of said zone from said lamp; means for traversing said chuck at a preselected speed through the region between said source and said sink from a first station on one side of the course to a second station on the other side of said source thereby to cause said zone to sweep the surface of a wafer held by said chuck; air track means for transporting wafers to be treated to said chuck at said first station; and air track means for taking treated wafers away from said chuck at said second station.
Claim 4
Dependent Claim
145 words
Apparatus for heat treating semiconductor wafers, said apparatus comprising: infrared source means including a linear quartz lamp and a linear reflector incorporating cooling means for focusing radiation from said lamp on a linear target zone; a vacuum chuck for holding a wafer to be treated; a heat sink, on the opposite side of said zone from said lamp; means for traversing said chuck at a preselected speed through the region between said source and said sink from a first station on one side of the course to a second station on the other side of said source thereby to cause said zone to sweep the surface of a wafer held by said chuck; air track means for transporting wafers to be treated to said chuck at said first station; and air track means for taking treated wafers away from said chuck at said second station.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-03-13 | 1987-09-12 | 1988-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-03-13 | 1991-09-12 | 1992-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-03-13 | 1995-09-12 | 1996-03-13 | $7700.00 | Window Closed / Lapsed |