Apparatus for handling semiconductor wafers during fabrication of integrated circuits

Claim 1

A semiconductor wafer handling apparatus comprising: a body member, made of molded alumina, said body member having; a first planar surface with a relief in said surface; a second planar surface parallel to the first planar surface, a rear planar surface at substantially right angles to said first and second planar surface forming a rear surface of the body member; a third planar surface angled at a sharp acute angle compared to the first surface and forming a first intersection with said second planar surface, the first intersection parallel to said rear surface and; a fourth planar surface angled at a less sharp acute angle compared to the first surface forming a second intersection with said third planar surface, the second intersection parallel to said rear surface, said fourth surface additionally forming a third intersection with said first surface, the third intersection parallel to said rear surface; and means for connecting said relief to means for generating air pressure differential.