US4684550A
Expired / Lapsed
US
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Electroless copper plating and bath therefor
Assignee: MSA Safety Inc
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Filing: 1986-04-25
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Granted: 1987-08-04
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Expires: 2006-04-25
Abstract
Abstract Electroless copper is plated from aqueous plating baths comprising a soluble copper salt, ethylenediamine tetraacetic acid, dimethylamine borane, thiodyglycolic acid and a surfactant reaction product of ethylene oxide and an acetylenic glycol.
Inventors
- 👤 John W. Milius
- 👤 Jill D. Alderson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:22
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
91 words
An electroless copper plating bath substantially free of alkali metal ions and consisting essentially of an aqueous solution of (1) about 0.6 to 6.4 g/l of a water soluble copper salt, (2) about 6 to 50 g/l of ethlenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 50 mg/l of thiodiglycolic acid, (5) about 2.5 to 1000 mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.0 and 11.5.
Claim 2
Dependent Claim
91 words
An electroless copper plating bath substantially free of alkali metal ions and consisting essentially of an aqueous solution of (1) about 0.6 to 6.4 g/l of a water soluble copper salt, (2) about 6 to 50 g/l of ethlenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 50 mg/l of thiodiglycolic acid, (5) about 2.5 to 1000 mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.0 and 11.5.
Claim 3
Dependent Claim
14 words
A bath according to claim 1 in which the acetylenic glycol is 2,4,7,9 tetra-methyl-5-decyne-4,7-diol.
Claim 4
Dependent Claim
14 words
A bath according to claim 1 in which the copper salt is copper sulfate.
Claim 5
Dependent Claim
14 words
A bath according to claim 2 in which the copper salt is copper sulfate.
Claim 6
Dependent Claim
54 words
A bath according to claim 1 having a pH between 9.5 and 10.5 and containing about 3.2 g/l of copper sulfate, about 12 g/l ethylene diamine tetraacetic acid, about 5.5 g/l of dimethylamine borane, about 10 mg/l of thiodiglycolic acid, and about 11 mg/l of a surfactant adduct of ethylene oxide and 2,4,7,9-tetra-methyl-5-decyne-4,7 diol.
Claim 7
Independent Claim
111 words
A method for the electroless deposition of copper on a substrate comprising contacting the substrate with an aqueous bath at a temperature between about 25° C. and 80° C., the bath being substantially free of alkali metal ions and containing (1) about 0.6 to 6.4 g/l a water soluble copper salt, (2) about 6 to 50 g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 500 mg/l of thiodiglycolic acid, (5) about 2.5 to 1000 mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.0 and 11.5.
Claim 8
Independent Claim
111 words
A method for the electroless deposition of copper on a substrate comprising contacting the substrate with an aqueous bath at a temperature between about 25° C. and 80° C., the bath being substantially free of alkali metal ions and containing (1) about 0.6 to 6.4 g/l a water soluble copper salt, (2) about 6 to 50 g/l of ethylenediamine tetraacetic acid, (3) about 2.5 to 12.5 g/l of dimethylamine borane, (4) about 2.5 to 500 mg/l of thiodiglycolic acid, (5) about 2.5 to 1000 mg/l of a surfactant reaction product of ethylene oxide and an acetylenic glycol, and (6) sufficient ammonium hydroxide to adjust the pH between about 8.0 and 11.5.
Claim 9
Dependent Claim
59 words
A method according to claim 6 in which the bath has a pH between about 9.5 and 10.5 and contains about 3.2 g/l of copper sulfate, about 12 g/l ethylene diamine tetraacetic acid, about 5.5 g/l of dimethylamine borane, about 10 mg/l of thiodiglycolic acid, and about 11 mg/l of a surfactant adduct of ethylene oxide and 2,4,7,9-tetra-methyl-5-decyne-4,7 diol.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-03 | 1991-02-02 | 1991-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-03 | 1995-02-02 | 1995-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-03 | 1999-02-02 | 1999-08-04 | $7700.00 | Window Closed / Lapsed |