US4371397A
Expired / Lapsed
US
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Chemical copper-plating bath
Assignee: Toshiba Corp
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Filing: 1980-12-04
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Granted: 1983-02-01
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Expires: 2000-12-04
Abstract
Abstract There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.
Inventors
- 👤 Hideo Honma
- 👤 Kunihiro Ikari
- 👤 Osamu Sasaki
- 👤 Toshiki Sasabe
- 👤 Kazuhiro Takeda
- 👤 Tsutomu Takamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:46
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
71 words
In a chemical copper-plating bath, comprising a copper salt, a complex-forming agent, a reducing agent and a pH controller, the improvement which comprises a nonionic surfactant represented by the formula: ##STR3## wherein m and n are integers of 1 or more, and m+n≧12, and at least one compound selected from the group consisting of 2,9-dimethyl-1,10-phenanthroline and 2,2'-dipyridyl in amounts effective to improve the ductility of copper films produced from the bath.
Claim 2
Dependent Claim
71 words
In a chemical copper-plating bath, comprising a copper salt, a complex-forming agent, a reducing agent and a pH controller, the improvement which comprises a nonionic surfactant represented by the formula: ##STR3## wherein m and n are integers of 1 or more, and m+n≧12, and at least one compound selected from the group consisting of 2,9-dimethyl-1,10-phenanthroline and 2,2'-dipyridyl in amounts effective to improve the ductility of copper films produced from the bath.
Claim 3
Dependent Claim
18 words
A chemical copper-plating bath according to claim 1, wherein m+n is in the range from 20 to 500.
Claim 4
Dependent Claim
23 words
A chemical copper-plating bath according to claim 2, wherein the nonionic surfactant is contained in an amount of 10 mg/liter to 2 g/liter.
Claim 5
Dependent Claim
23 words
A chemical copper-plating bath according to claim 1, wherein said compound is present in an amount of from about 2 to 200 mg/liter.
Claim 6
Dependent Claim
14 words
A chemical copper-plating bath according to claim 1, wherein m+n is 50 or greater.
Claim 7
Dependent Claim
18 words
A chemical copper-plating bath according to claim 5, wherein the bath contains a mixture of 2,2'-dipyridyl and 2,9-dimethyl-1,10-phenanthroline.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-01-31 | 1986-08-02 | 1987-02-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-01-31 | 1990-08-02 | 1991-02-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-01-31 | 1994-08-02 | 1995-02-01 | $7700.00 | Window Closed / Lapsed |