US3870526A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless deposition of copper and copper-tin alloys
Assignee: United States Department of the Army
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Filing: 1973-09-20
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Granted: 1975-03-11
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Expires: 1993-09-20
Abstract
Abstract Electroless bath compositions for the deposition of copper or copper-tin alloys, said baths being devoid of formaldehyde or potassium heptagluconate and having less alkalinity than prior art baths, said baths providing highly adherent deposits to such substrates as steel, for example, and consisting of: Copper sulfate.5H2O Di-sodium salt of Ethylenediamine tetra-acetic acid.2H2O Ammonium hydroxide (28 percent NH3) Dimethylamine borane AND IF A COPPER-TIN ALLOY DEPOSIT IS DESIRED, STANNOUS CHLORIDE.2H2O.
Inventors
- 👤 Fred Pearlstein
- 👤 Robert F Weightman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:54
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/48
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
55 words
An electroless plating bath for providing a predominately copper deposit which is firmly adherent to various substrates, said bath being devoid of formaldehyde or potassium heptagluconate and comprising 0.5 to 3.0 g/l copper sulfate.5H2O, 1.0 to 10.0 g/l disodium salt of EDTA, 5 to 150 ml/l NH4OH(28 percent NH3), and 0.5 to 10.0 g/l DMAB.
Claim 2
Dependent Claim
55 words
An electroless plating bath for providing a predominately copper deposit which is firmly adherent to various substrates, said bath being devoid of formaldehyde or potassium heptagluconate and comprising 0.5 to 3.0 g/l copper sulfate.5H2O, 1.0 to 10.0 g/l disodium salt of EDTA, 5 to 150 ml/l NH4OH(28 percent NH3), and 0.5 to 10.0 g/l DMAB.
Claim 3
Dependent Claim
56 words
AN ELECTROLESS PLATING BATH FOR PROVIDING A PREDOMINATELY COPPER DEPOSIT WHICH IS FIRMLY ADHERENT TO VARIOUS SUBSTRATES, SAID BATH BEING DEVOID OF FORMALDEHYDE OR POTASSIUM HEPTAGLUCONATE AND COMPRISING 0.5 TO 3.0 G.L COPPER SULFATE, 5H2O, 1.0 TO 10.0 G/L DISODIUM SALT OF EDTA, 5 TO 150 ML/L NH4OH(28 PERCENT NH3), AND 0.5 TO 10.0 G/L DMAB.
Claim 4
Dependent Claim
56 words
AN ELECTROLESS PLATING BATH FOR PROVIDING A PREDOMINATELY COPPER DEPOSIT WHICH IS FIRMLY ADHERENT TO VARIOUS SUBSTRATES, SAID BATH BEING DEVOID OF FORMALDEHYDE OR POTASSIUM HEPTAGLUCONATE AND COMPRISING 0.5 TO 3.0 G.L COPPER SULFATE, 5H2O, 1.0 TO 10.0 G/L DISODIUM SALT OF EDTA, 5 TO 150 ML/L NH4OH(28 PERCENT NH3), AND 0.5 TO 10.0 G/L DMAB.
Claim 5
Dependent Claim
15 words
The bath as described in claim 1, said deposit comprising about 98.6 weight percent copper.
Claim 6
Dependent Claim
43 words
The bath as described in claim 1 further characterized by the inclusion of 0.1 to 5.0 g/l stannous chloride.2H2O and said deposit comprising copper-tin, said tin being present in said deposit in an amount of about 10 weight percent, balance being substantially copper.
Claim 7
Dependent Claim
56 words
The bath as described in claim 1, said copper sulfate.5H2O being present in an amount of 2 g/l, said disodium salt of EDTA being present in an amount of 6 g/l, said ammonium hydroxide (28 percent NH3) being present in an amount of 50 ml/l, and said DMAB being present in an amount of 4 g/l.
Claim 8
Dependent Claim
65 words
The bath as described in claim 3, said copper sulfate.5H2O being present in amount of 1 g/l, said stannous chloride being present in an amount of 2 g/l, said disodium salt of EDTA being present in an amount of 6 g/l, said ammonium hydroxide (28 percent NH3) being present in amount of 50 ml/l, and said DMAB being present in an amount of 4 g/l.
Claim 9
Dependent Claim
26 words
The bath as described in claim 1 wherein said substrate is selected from the group consisting of steel, copper, electroless nickel plated steel, and palladium-activated plastic.
Claim 10
Dependent Claim
26 words
The bath as described in claim 4 wherein said substrate is selected from the group consisting of steel, copper, electroless nickel plated steel, and palladium-activated plastic.
Claim 11
Dependent Claim
26 words
The bath as described in claim 5 wherein said substrate is selected from the group consisting of steel, copper, electroless nickel plated steel, and palladium-activated plastic.
Claim 12
Dependent Claim
75 words
The bath as described in claim 1 wherein said copper sulfate.5H2O is present in an amount of 2 g/l, said disodium salt of EDTA is present in an amount of 6 g/l, said NH4OH (28 percent NH3) is present in an amount of 50 ml/l, and said DMAB is present in an amount of 4 g/l, said substrate is palladium-activated acrylonitrile-butadiene-styrene, and said deposit is substantially all copper having a thickness of about 0.4 microns.
Claim 13
Dependent Claim
105 words
The bath as described in claim 3 wherein said copper sulfate.5H2O is present in amount of 1 g/l, said stannous chloride is present in an amount of 4 g/l, said disodium salt of EDTA is present in an amount of 6 g/l, and NH4OH (28 percent NH3) is present in an amount of 50 ml/l, and said DMAB is present in an amount of 4 g/l, said substrate is copper, and said deposit comprises copper-tin, said tin being present in said deposit in an amount of about 10.0 weight percent, balance being substantially copper, and said copper-tin deposit having a thickness of about 0.8 microns.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-03-10 | 1978-09-09 | 1979-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-03-10 | 1982-09-09 | 1983-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-03-10 | 1986-09-09 | 1987-03-11 | $7700.00 | Window Closed / Lapsed |