Patent US4680471A successfully refreshed from Google Patents.
US4680471A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packaging
Assignee: Motorola Solutions Inc
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Filing: 1985-03-20
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Granted: 1987-07-14
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Expires: 2005-03-20
Abstract
Abstract An integrated circuit comprising: a semiconductor die having an integrated circuit formed therein; a package for supporting the die and for providing electrical contact thereto, the radiation properties of the package having been characterized as follows: fabricating a detector using a semiconductor fabrication technique, the detector having substantially the same dimensions as an integrated circuit to be packaged in the packaging materia; packaging the detector using integrated circuit packaging techniques; and measuring the radiation environment of the detector.
Inventors
- 👤 Steven L. Morris
- 👤 Gary C. Lewis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:32
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10F30/00; H10F30/20; H10F30/29; H10W; H10W42/00; H10W42/20; H10W42/25
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
88 words
A method for fabricating an integrated circuit comprising: fabricating a semiconductor die having an integrated circuit formed therein: assembling the die into a package of a packaging material, the radiation properties of which have been characterized as follows: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation into said package of said packaging material using integrated circuit packaging techniques; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
Claim 2
Independent Claim
88 words
A method for fabricating an integrated circuit comprising: fabricating a semiconductor die having an integrated circuit formed therein: assembling the die into a package of a packaging material, the radiation properties of which have been characterized as follows: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation into said package of said packaging material using integrated circuit packaging techniques; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
Claim 3
Dependent Claim
33 words
A method as set forth in claim 1 wherein the means for detecting radiation has substantially the same dimensions as an integrated circuit to be packaged in the package of the packaging material.
Claim 4
Dependent Claim
37 words
A method as set forth in claim 1 wherein the means for detecting radiation has substantially the same dimensions as a critical portion of an integrated circuit to be packaged in the package of the packaging material.
Claim 5
Dependent Claim
37 words
A method as set forth in claim 1 wherein the dimensions of the means for detecting radiation are proportional to a critical portion of an integrated circuit to be packaged in the package of the packaging material.
Claim 6
Dependent Claim
85 words
An integrated circuit comprising: a semiconductor die having an integrated circuit formed therein; a package of a packaging material for supporting the die and for providing electrical contact thereto, the radiation properties of the package having been characterized as follows: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation in said package of said packaging material; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
Claim 7
Dependent Claim
85 words
An integrated circuit comprising: a semiconductor die having an integrated circuit formed therein; a package of a packaging material for supporting the die and for providing electrical contact thereto, the radiation properties of the package having been characterized as follows: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation in said package of said packaging material; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
Claim 8
Dependent Claim
33 words
A circuit as set forth in claim 5 wherein the means for detecting radiation has substantially the same dimensions as an integrated circuit to be packaged in said package of the packaging material.
Claim 9
Dependent Claim
37 words
A circuit as set forth in claim 5 wherein the means for detecting radiation has substantially the same dimensions as a critical portion of an integrated circuit to be packaged in said package of the packaging material.
Claim 10
Dependent Claim
37 words
A circuit as set forth in claim 5 wherein the dimensions of the means for detecting radiation are proportional to a critical portion of an integrated circuit to be packaged in said package of the packaging material.
Claim 11
Independent Claim
54 words
A method for determining the radiation properties of an integrated circuit package comprising: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation in said package; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
Claim 12
Independent Claim
54 words
A method for determining the radiation properties of an integrated circuit package comprising: fabricating a means for detecting radiation using a semiconductor fabrication technique; packaging the means for detecting radiation in said package; and measuring the radiation emitted by said package of the packaging material by said means for detecting radiation within the package.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-07-13 | 1991-01-12 | 1991-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-07-13 | 1995-01-12 | 1995-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-07-13 | 1999-01-12 | 1999-07-14 | $7700.00 | Window Closed / Lapsed |