Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
170 words
a process for the production of a monocrystalline silicon film on an insulating support comprising the following successive stages: (a) covering a monocrystaline silicon substrate of given orientation with an insulating material layer, (b) forming in the insulating layer, by a first etching thereof, overhanging strips and recessed strips, which are parallel and alternate, with an orientation close to an orientation (100) of the substrate, the widths of the overhanging strips being smaller than that of the recessed strips, (c) producing a second etching of the insulating layer in order to locally form at the ends of said layer at least one opening, said second etching being continued until the substrate is exposed, (d) depositing on the etched insulating layer a silicon film, (e) covering the silicon film with a layer of an encapsulating material, (f) carrying out a heat treatment of the structure obtained in order to recrystallize the silicon film in monocrystalline form with the same orientation as the insulating strips and, (g) eliminating the encapsulating material layer.
Claim 2
Dependent Claim
170 words
a process for the production of a monocrystalline silicon film on an insulating support comprising the following successive stages: (a) covering a monocrystaline silicon substrate of given orientation with an insulating material layer, (b) forming in the insulating layer, by a first etching thereof, overhanging strips and recessed strips, which are parallel and alternate, with an orientation close to an orientation (100) of the substrate, the widths of the overhanging strips being smaller than that of the recessed strips, (c) producing a second etching of the insulating layer in order to locally form at the ends of said layer at least one opening, said second etching being continued until the substrate is exposed, (d) depositing on the etched insulating layer a silicon film, (e) covering the silicon film with a layer of an encapsulating material, (f) carrying out a heat treatment of the structure obtained in order to recrystallize the silicon film in monocrystalline form with the same orientation as the insulating strips and, (g) eliminating the encapsulating material layer.
Claim 3
Dependent Claim
15 words
A production process according to claim 1, wherein the substrate has a crystalline orientation (100).
Claim 4
Dependent Claim
41 words
A production process according to claim 1, wherein stage (f) consists of locally melting the silicon film and moving the melted zones parallel to the insulating strips, the melted zone being in the form of a line perpendicular to said strips.
Claim 5
Dependent Claim
19 words
A Production process according to claim 3, wherein the melted zone is moved at a speed below 0.5 mm/s.
Claim 6
Dependent Claim
21 words
A production process according to claim 3, wherein the melted zone is moved at a speed of 0.1 to 0.2 mm/s.
Claim 7
Dependent Claim
35 words
A production process according to claim 1, wherein the heat treatment is performed by subjecting the structure to the action of an energy line perpendicular to the insulating strips and moving parallel to the latter.
Claim 8
Dependent Claim
16 words
A production process according to claim 1, wherein the openings are located in the recessed strips.
Claim 9
Dependent Claim
22 words
A production process according to claim 1, wherein the overhanging strips and the recessed strips are arranged according to a periodic configuration.
Claim 10
Dependent Claim
21 words
A production process according to claim 1, wherein the first and/or second etchings of the insulating strip are reactive ionic etchings.
Claim 11
Dependent Claim
21 words
A production process according to claim 1, wherein the insulating layer and/or the encapsulating material layer are made from silicon oxide.
Claim 12
Dependent Claim
19 words
A production process according to claim 1, wherein stage d) conists of depositing an amorphous or polycrystalline silicon film.
Claim 13
Dependent Claim
80 words
A production process according to claim 1, wherein, before stage (f), a layer of another insulating material is deposited on the silicon film canceling out the relief of the silicon film, followed by the simultaneous etching of said insulating material layer and the silicon film at identical etching speeds for the insulant and the silicon, until the insulating material layer and the relief parts of the silicon film are completely eliminated, in order to flatten the surface of said film.