Patent US4675243A successfully refreshed from Google Patents.
US4675243A
Expired / Lapsed
US
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Ceramic package for semiconductor devices
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1986-05-12
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Granted: 1987-06-23
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Expires: 2006-05-12
Abstract
Abstract A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.
Inventors
- 👤 Hiroaki Obinata
- 👤 Kunihiko Imai
- 👤 Masayuki Sunohara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 04:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H05K3/245; H10W70/67; H10W70/68; H10W70/682; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/1284; Y10T428/12861; Y10T428/12889; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
81 words
A ceramic package for enclosing semiconductor devices on a semiconductor die, said ceramic package comprising: a ceramic base; and a die-bonding area, formed on said ceramic base, for mounting thereon the semiconductor die, said die-bonding area comprising: an electrically conducting metallized layer formed on said ceramic base; an underlayer, formed from one of cobalt and a cobalt alloy substantially excluding nickel, plated on said electrically conducting metallized layer; and a gold-plated layer formed on at least a part of said underlayer.
Claim 2
Dependent Claim
81 words
A ceramic package for enclosing semiconductor devices on a semiconductor die, said ceramic package comprising: a ceramic base; and a die-bonding area, formed on said ceramic base, for mounting thereon the semiconductor die, said die-bonding area comprising: an electrically conducting metallized layer formed on said ceramic base; an underlayer, formed from one of cobalt and a cobalt alloy substantially excluding nickel, plated on said electrically conducting metallized layer; and a gold-plated layer formed on at least a part of said underlayer.
Claim 3
Dependent Claim
22 words
A ceramic package as set forth in claim 1, wherein said ceramic package is sealed using glass having a low melting point.
Claim 4
Dependent Claim
16 words
A ceramic package as set forth in claim 1, wherein said underlayer consisits essentially of cobalt.
Claim 5
Dependent Claim
23 words
A ceramic package as set forth in claim 1, wherein said underlayer is formed from an alloy consisting essentially of cobalt and boron.
Claim 6
Dependent Claim
87 words
A ceramic package, operatively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said ceramic package comprising: a ceramic base; and a plurality of outerlead portions, formed on said ceramic base, operatively connectable to the external device, each of the outerlead portions comprising: one of an electrically conducting metal and metallized portion on said ceramic base; and a plated layer, formed from one of cobalt and a cobalt alloy substantially excluding nickel, formed on said one of electrically conducting metal and metallized portion.
Claim 7
Dependent Claim
87 words
A ceramic package, operatively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said ceramic package comprising: a ceramic base; and a plurality of outerlead portions, formed on said ceramic base, operatively connectable to the external device, each of the outerlead portions comprising: one of an electrically conducting metal and metallized portion on said ceramic base; and a plated layer, formed from one of cobalt and a cobalt alloy substantially excluding nickel, formed on said one of electrically conducting metal and metallized portion.
Claim 8
Dependent Claim
22 words
A ceramic package as set forth in claim 5, further comprising gold-plated layers formed on the plated layers of said outerlead portions.
Claim 9
Dependent Claim
17 words
A ceramic package as set forth in claim 3, wherein sid plated layer consists essentially of cobalt.
Claim 10
Dependent Claim
24 words
A ceramic package as set forth in claim 3, wherein said plated layer is formed from an alloy consisting essentially of cobalt and boron.
Claim 11
Dependent Claim
150 words
A chip carrier type ceramic package, opertively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said package comprising: a ceramic base having a periphery; a gold-plated die-bonding area, formed on said ceramic base, for mounting thereon the semiconductor die, having an underlayer formed from one of cobalt and a cobalt alloy substantially excluding nickel; a gold-plated wire-bonding area formed on said ceramic base, having an underlayer formed from one of cobalt and the cobalt alloy substantially excluding nickel; and a plurality of gold-plated outerlead grooves, formed on the periphery of said ceramic base and operatively connectable to the external device, each of said outerlead grooves comprising: an electrically conducting metallized layer formed on said ceramic base; an underlayer, formed from one of cobalt and the cobalt alloy substantially excluding nickel, formed on said electrically conducting metallized layer; and a gold layer formed on said underlayer.
Claim 12
Dependent Claim
150 words
A chip carrier type ceramic package, opertively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said package comprising: a ceramic base having a periphery; a gold-plated die-bonding area, formed on said ceramic base, for mounting thereon the semiconductor die, having an underlayer formed from one of cobalt and a cobalt alloy substantially excluding nickel; a gold-plated wire-bonding area formed on said ceramic base, having an underlayer formed from one of cobalt and the cobalt alloy substantially excluding nickel; and a plurality of gold-plated outerlead grooves, formed on the periphery of said ceramic base and operatively connectable to the external device, each of said outerlead grooves comprising: an electrically conducting metallized layer formed on said ceramic base; an underlayer, formed from one of cobalt and the cobalt alloy substantially excluding nickel, formed on said electrically conducting metallized layer; and a gold layer formed on said underlayer.
Claim 13
Dependent Claim
24 words
A chip carrier type ceramic package as set forth in claim 5, wherein the underlayer in said gold-plated die-bonding area consists essentially of cobalt.
Claim 14
Dependent Claim
31 words
A chip carrier type ceramic package as set forth in claim 5, wherein the underlayer in said gold-plated die-bonding area is formed from an alloy consisting essentially of cobalt and boron.
Claim 15
Dependent Claim
150 words
A pin grid array type ceramic package, operatively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said package comprising: a ceramic base having faces; a gold-plated die-bonding area, formed on said ceramic base for mounting thereon the semiconductor die, said die-bonding area having an underlayer comprising one of cobalt and a cobalt alloy substantially excluding nickel; a gold-plated wire-bonding area, formed on said ceramic base, having an underlayer comprising one of cobalt and the cobalt alloy substantially excluding nickel; and a plurality of outerlead pins, arranged in a grid on one of the faces of said ceramic base, operatively connectable to the external device, each of said outerlead pins comprising: an electrically conducting metal on one of the faces of said ceramic base; and a plated layer, formed from one of cobalt and the cobalt alloy substantially excluding nickel, formed on said electrically conducting metal.
Claim 16
Dependent Claim
150 words
A pin grid array type ceramic package, operatively connectable to an external device, for enclosing semiconductor devices on a semiconductor die, said package comprising: a ceramic base having faces; a gold-plated die-bonding area, formed on said ceramic base for mounting thereon the semiconductor die, said die-bonding area having an underlayer comprising one of cobalt and a cobalt alloy substantially excluding nickel; a gold-plated wire-bonding area, formed on said ceramic base, having an underlayer comprising one of cobalt and the cobalt alloy substantially excluding nickel; and a plurality of outerlead pins, arranged in a grid on one of the faces of said ceramic base, operatively connectable to the external device, each of said outerlead pins comprising: an electrically conducting metal on one of the faces of said ceramic base; and a plated layer, formed from one of cobalt and the cobalt alloy substantially excluding nickel, formed on said electrically conducting metal.
Claim 17
Dependent Claim
25 words
A pin grid array type ceramic package as set forth in claim 12, further comprising gold-plated layers formed on the layers of said outerlead pins.
Claim 18
Dependent Claim
25 words
A chip carrier type ceramic package as set forth in claim 9, wherein said ceramic package is sealed using glass having a low melting point.
Claim 19
Dependent Claim
36 words
A chip carrier type ceramic package as set forth in claim 9, wherein gold is simultaneously plated on the underlayer of said gold-plated die-bonding area and on the underlayer of each of said gold-plated outerlead grooves.
Claim 20
Dependent Claim
25 words
A pin grid array type ceramic package as set forth in claim 6, wherein the underlayer in the gold-plated die-bonding area consists essentially of cobalt.
Claim 21
Dependent Claim
32 words
A pin grid array type ceramic package as set forth in claim 6, wherein the underlayer in said gold-plated die-bonding area is formed from an alloy consisting essentially of cobalt and boron.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-22 | 1990-12-22 | 1991-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-22 | 1994-12-22 | 1995-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-22 | 1998-12-22 | 1999-06-23 | $7700.00 | Window Closed / Lapsed |