Abstract A layer of HgCdTe (15) epitaxially grown onto a crystalline support (10), e.g., of sapphire of GaAs. A CdTe substrate (5) is epitaxially grown to a thickness of between 1 micron and 5 microns on the support (10). A HgTe source (3) is spaced from the CdTe substrate (5) a distance of between 0.1 mm and 10 mm. The substrate (5) and source (3) are heated together in a thermally insulating, reusable ampoule (17) within a growth temperature range of between 500° C. and 625° C. for a growth step having a duration of between 5 minutes and 4 hours. Then an interdiffusion step is performed, in which the source (3) and substrate (5) are cooled within a temperature range of between 400° C. and 500° C. for a time of between 1 hour and 16 hours. In a first growth step embodiment, the source (3) and substrate (5) are isothermal. In a second growth step embodiment, the source (3) and substrate (5) are non-isothermal. Means are disclosed for preventing contamination of the reactants during HgTe (3) synthesis, and for polishing the HgCdTe layer (15).
A method for epitaxially growing a layer of HgCdTe onto a crystalline support, comprising the steps of: epitaxially growing a CdTe substrate to a thickness of between 1 micron and 5 microns onto the support; spacing a HgTe source between 0.1 mm and 10 mm apart from the CdTe; performing a growth step in which the HgTe and CdTe are heated within a growth temperature range of between 500° C. and 625° C. for a growth time of between 5 minutes and 4 hours; and performing an interdiffusion step in which the HgTe and CdTe are cooled within an interdiffusion temperature range of between 400° C. and 500° C. for an interdiffusion time of between 1 hour and 16 hours.
Claim 2
Independent Claim
120 words
A method for epitaxially growing a layer of HgCdTe onto a crystalline support, comprising the steps of: epitaxially growing a CdTe substrate to a thickness of between 1 micron and 5 microns onto the support; spacing a HgTe source between 0.1 mm and 10 mm apart from the CdTe; performing a growth step in which the HgTe and CdTe are heated within a growth temperature range of between 500° C. and 625° C. for a growth time of between 5 minutes and 4 hours; and performing an interdiffusion step in which the HgTe and CdTe are cooled within an interdiffusion temperature range of between 400° C. and 500° C. for an interdiffusion time of between 1 hour and 16 hours.
Claim 3
Dependent Claim
20 words
The method of claim 1 wherein the spacing between the HgTe source and the CdTe substrate is approximately 2 mm.
Claim 4
Dependent Claim
22 words
The method of claim 1 wherein the support is fabricated of a material from the class of materials comprising sapphire and GaAs.
Claim 5
Dependent Claim
26 words
The method of claim 1 wherein, during the growth step, the temperature is substantially constant and substantially the same for both the source and the substrate.
Claim 6
Dependent Claim
22 words
The method of claim 1 wherein, during the growth step, the substrate is hotter than the source for at least 5 minutes.
Claim 7
Dependent Claim
28 words
The method of claim 1 wherein, during the interdiffusion step, the temperature is substantially constant and substantially the same for the source and for the substrate, if any.