Patent US4649338A successfully refreshed from Google Patents.
US4649338A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fine line circuitry probes and method of manufacture
Assignee: Hughes Missile Systems Co
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Filing: 1982-06-21
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Granted: 1987-03-10
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Expires: 2002-06-21
Abstract
Abstract Probes for testing circuitry comprising plural oriented; circular cross-section; microcircuit probes positioned in a dielectric base and having connections on the opposite side of base to attach probe circuitry. A method of manufacture of such probes includes assembling a laminate of a dielectric base, and an aluminum mandrel, drilling holes in the laminate at positions corresponding to the eventual probe positions, electroless plating the entire package, passivating the electroless plated coating, plating the entire assemblage until the holes are substantially filled with plating, separating and shearing off the layers of plating from the laminate, applying a photoresist and developing it one the aluminum side corresponding to the holes for the probes, and on the opposite side corresponding to the desired circuitry, removing the material on the aluminum side to expose the aluminum, dissolving the aluminum to expose the probes, and soldering and reflowing the solder on the probes.
Inventors
- 👤 William P. Dugan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 10:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4092; G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06711; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K3/42
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
164 words
A probe device for testing microcircuits comprising: a base circuit board; a plurality of individual conductive metal, hollow cylindrical, thick-walled probe contact elements mounted in an array adjacent a central portion of said circuit board, said elements protruding a predetermined distance beyond one face of said board and passing through corresponding individual holes in said board to a corresponding array of individual circuit paths on the opposite face of the board terminating in a like plurality of terminals mounted peripherally about the array of probe contact elements adjacent the peripheral edges of said board, both the probe contact elements and the circuit paths being integrally formed on said board; each individual probe contact element being affixed in the circuit board by plating the metal of the probe element within its corresponding hole; and a coating of solder melted onto the probe contact elements and extending circumferentially about the protruding portion of each probe contact element to lock the probe contact element in the board.
Claim 2
Dependent Claim
164 words
A probe device for testing microcircuits comprising: a base circuit board; a plurality of individual conductive metal, hollow cylindrical, thick-walled probe contact elements mounted in an array adjacent a central portion of said circuit board, said elements protruding a predetermined distance beyond one face of said board and passing through corresponding individual holes in said board to a corresponding array of individual circuit paths on the opposite face of the board terminating in a like plurality of terminals mounted peripherally about the array of probe contact elements adjacent the peripheral edges of said board, both the probe contact elements and the circuit paths being integrally formed on said board; each individual probe contact element being affixed in the circuit board by plating the metal of the probe element within its corresponding hole; and a coating of solder melted onto the probe contact elements and extending circumferentially about the protruding portion of each probe contact element to lock the probe contact element in the board.
Claim 3
Dependent Claim
14 words
The probe device of claim 1 wherein said arrayed probe contact elements are copper.
Claim 4
Dependent Claim
19 words
The probe device of claim 1 wherein the probe contact elements in said array are ring-shaped in cross section.
Claim 5
Dependent Claim
21 words
The probe of claim 1 wherein the probe contact elements in said array are from 0.008 to 0.016 inches in diameter.
Claim 6
Dependent Claim
23 words
The device of claim 4 wherein the paths of said circuit are comparable in dimension to the diameter of the probe contact elements.
Claim 7
Dependent Claim
22 words
The device of claim 5 wherein the paths of said circuit are slightly wider than the diameter of the probe contact elements.
Claim 8
Dependent Claim
24 words
The device of claim 6 wherein the probe contact elements are joined by plating and by an overlayer of solder to associated circuit paths.
Claim 9
Dependent Claim
20 words
The device of claim 1 wherein the array of probe contact elements is plug-plated in the holes of the board.
Claim 10
Dependent Claim
17 words
The device of claim 1 wherein the circuit is a printed circuit integrally formed on the board.
Claim 11
Dependent Claim
18 words
The device of claim 1 wherein each probe contact element includes a central bore substantially filled by solder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-03-09 | 1990-09-08 | 1991-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-03-09 | 1994-09-08 | 1995-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-03-09 | 1998-09-08 | 1999-03-10 | $7700.00 | Window Closed / Lapsed |