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US4647954A Expired / Lapsed US ⏱️ 0.0 years remaining

Low temperature tunneling transistor

Assignee: International Business Machines Corp
•
Filing: 1984-09-27
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Granted: 1987-03-03
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Expires: 2004-09-27
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Abstract

Abstract The transistor comprises two electrodes, source (12) and drain (13), with a semiconductor tunnel channel (11) arranged therebetween. A gate (14) for applying control signals is coupled to the channel. The semiconductor, at low temperatures, behaves like an insulator with a low barrier (some meV) through which charge carriers can tunnel under the influence of an applied drain voltage. The tunnel current can be controlled by a gate voltage V G which modifies the barrier height between source and drain thereby changing the tunnel probability.

Inventors

  • 👤 Volker Graf
  • 👤 Pierre L. Gueret
  • 👤 Carl A. Mueller

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 13:31
CPC Classifications
H; H10; H10N; H10N60/00; H10N60/10; H10N60/128; H10D; H10D62/00; H10D62/80; H10D62/81; H10D62/815; H10D62/8171; Y; Y10; Y10S; Y10S505/00; Y10S505/825; Y10S505/856; Y10S505/857; Y10S505/86

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 232 words
A tunneling transistor for use at an operating temperature in an environment in the range of liquid helium temperature to liquid nitrogen temperature, comprising: (a) doped semiconductor barrier means (11) having, at operating temperature, the composite of doping and of dimensions such that tunnel current dominates the current of thermionically excited carriers, and the difference in energy between the Fermi-level and either the conduction band minimum or the valence band maximum of the semiconductor is on the order of MeV; (b) a source electrode (12), connected to said semiconductor barrier means (11) at a first position; (c) a drain electrode (13), laterally located at a second position at a finite distance, on the order of 100 nm, from said source electrode (12), across which finite distance tunnel currents may flow in said semiconductor barrier material (11); (d) at least one gate electrode (14), operably juxtaposed to said semiconductor barrier material (11), positioned at a third position between said first and second positions for controlling tunneling current in said barrier material (11) by means of signals in the mV range; whereby a low height energy barrier permits control of the tunneling current between said source electrode (12) and said drain electrode (13) by means of signals in the mV range applied to said gate electrode (14); and (e) means for applying to said gate terminal (14) a control signal in the mV range.
Claim 2
Dependent Claim 232 words
A tunneling transistor for use at an operating temperature in an environment in the range of liquid helium temperature to liquid nitrogen temperature, comprising: (a) doped semiconductor barrier means (11) having, at operating temperature, the composite of doping and of dimensions such that tunnel current dominates the current of thermionically excited carriers, and the difference in energy between the Fermi-level and either the conduction band minimum or the valence band maximum of the semiconductor is on the order of MeV; (b) a source electrode (12), connected to said semiconductor barrier means (11) at a first position; (c) a drain electrode (13), laterally located at a second position at a finite distance, on the order of 100 nm, from said source electrode (12), across which finite distance tunnel currents may flow in said semiconductor barrier material (11); (d) at least one gate electrode (14), operably juxtaposed to said semiconductor barrier material (11), positioned at a third position between said first and second positions for controlling tunneling current in said barrier material (11) by means of signals in the mV range; whereby a low height energy barrier permits control of the tunneling current between said source electrode (12) and said drain electrode (13) by means of signals in the mV range applied to said gate electrode (14); and (e) means for applying to said gate terminal (14) a control signal in the mV range.
Claim 3
Dependent Claim 18 words
A tunneling transistor according to claim 10, wherein said doped semiconductor barrier means (11) is a mixed crystal.
Claim 4
Dependent Claim 67 words
A tunneling transistor according to claim 1, for use at an operating temperature in the superconductivity range of temperatures near the temperature of liquid helium, wherein said electrodes consist of one or more thin layers of superconductive material adjacent one or more thin layers of ohmic metallic material of the class which exhibits proximity effect superconductivity in the presence of a covering a layer of superconducting material.
Claim 5
Dependent Claim 42 words
A tunneling transistor according to claim 1, wehrein said doped semiconductor barrier (11) means material is CdS and wherein a layer of Al is deposited at said source electrode (12) and drain electrode (13) areas of said doped semiconductor barrier means (11).
Claim 6
Dependent Claim 19 words
A tunneling transistor according to claim 1, wherein said source electrode (12) consists of superconducting material at operating temperature.
Claim 7
Dependent Claim 31 words
A tunneling transistor according to claim 1 wherein said source electrode (12), said drain electrode (13) and said gate electrode (14) consist of ohmic materials from the group Al, Au, Ag.
Claim 8
Dependent Claim 35 words
A tunneling transistor according to claim 5, wherein the difference in energy between conduction band Fermi-level of the semiconductor barrier means (11) metal is in the range of the energy gap of the superconductor electrode.
Claim 9
Dependent Claim 17 words
A tunneling transistor according to claim 1, wherein said doped semiconductor barrier means (11) material is n-doped.
Claim 10
Dependent Claim 16 words
A tunneling transistor according to claim 1, wherein said doped semiconductor barrier (11) material is p-doped.
Claim 11
Dependent Claim 24 words
A tunneling transistor according to claim 1, wherein said doped semiconductor barrier (11) material has a band gap on the order of 5-10 meV.
Claim 12
Dependent Claim 20 words
A tunneling transistor according to claim 1, wherein said doped semiconductor barrier means (11) is a nipi superlattice structure (52).
Claim 13
Dependent Claim 24 words
A tunneling transistor according to claim 1, wherein said gate electrode (14) is electrically isolated (30, 31, 32) from said doped semiconductor barrier (11).
Claim 14
Dependent Claim 19 words
A tunneling transistor according to claim 10, wherein said doped semiconductor barrier (11) material is an alloy of elements.
Claim 15
Dependent Claim 19 words
A tunneling transistor according to claim 11, wherein said nipi superlattice structure (52) is formed in a GaAs crystal.
Claim 16
Dependent Claim 52 words
A tunneling transistor according to claim 1, wherein said doped semiconductor barrier (11) material is InAs and wherein a layer of a material from the group Al, Au, and Ag is deposited in the area of said source electrode (12) and said drain electrode (13) areas of said semiconductor barrier means (11).
Claim 17
Dependent Claim 37 words
A tunneling transistor according to claim 11, wherein said ohmic contacts between said source and drain electrodes and the nipi structure are obtained by depositing a thin film of AuGe between said electrodes and the nipi surfaces.
Claim 18
Dependent Claim 24 words
A tunneling transistor according to claim 12, wherein said gate electrode (14) is isolated from said semiconductor (11) by a thin oxide layer (30).
Claim 19
Dependent Claim 34 words
A tunneling transistor according to claim 12, wherein said gate (14) is isolated from said semiconductor barrier (11) by a Schottky barrier (31) formed in said semiconductor barrier layer (11) adjacent said gate (14).
Claim 20
Dependent Claim 45 words
A tunneling transistor according to claim 12, wherein said gate (14) is isolated from said semiconductor barrier (11) in that a semiconductor layer (32) of material having a band gap significantly greater than 10 meV is formed at said semiconductor surface underneath said gate (14).

References Cited (Backward Citations)

US3500137A Cited
US3882533A Cited
US4157555A Cited
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US4220959A Cited
US4334158A Cited
JPS57176781A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-03-02 1990-09-01 1991-03-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-03-02 1994-09-01 1995-03-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-03-02 1998-09-01 1999-03-03 $7700.00 Window Closed / Lapsed

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