US4643793A
Expired / Lapsed
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Process for treating metal surface
Assignee: Resonac Corp
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Filing: 1985-07-01
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Granted: 1987-02-17
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Expires: 2005-07-01
Abstract
Abstract A process for treating a surface of a metal such as copper with a liquid composition comprising (I) copper ions, a complexing agent, a reducing agent, a pH adjusting agent, water, and (II) a nitrogen-containing organic compound such as heterocyclic compound or containing --N═ and --NH 2 and/or --OH groups in its molecule can give multilayer printed wiring boards having excellent adhesive strength and line definition of inner layer copper conductors with long shelf life.
Inventors
- 👤 Akishi Nakaso
- 👤 Youichi Kaneko
- 👤 Toshiro Okamura
- 👤 Kiyoshi Yamanoi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:48
CPC Classifications
C; C23; C23C; C23C22/00; C23C22/05; C23C22/06; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/46; H05K3/4611; Y; Y10; Y10S; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
114 words
A process for treating a surface of a metal which comprises: treating a metal surface with a liquid composition comprising (I) copper ions, a complexing agent for copper ions, a reducing agent for copper ions, a pH adjusting agent, water and (II) at least one nitrogen-containing organic compound selected from the group consisting of 2,4,6-tris(2-pyridyl)-s-triazine, α,α',α"-tripyridyl, 1,10-phenanthroline, 4,7-diphenyl-1, 10-phenanthroline, 4,7-dimethyl-1,10-phenanthroline, 4,7-diphenyl-1,10-phenanthroline disulfonic acid disodium salt, 3-(2-pyridyl)-5,6-diphenyl-1,2,4-triazine, α,α'-dipyridyl, Phthalocyanine Green, 8-azaguanine, xanthopterin, 5-amino-indazole, 2-aminoperimidine.hydrochloride, 2-amino-perimidine.hydrobromide, benzoguanamine, acriflavine.hydrochloride, 5-amino-1H-tetrazole, 6-amino-2-phenyl-4-quinolinol, 2-amino-6,8-dihydroxypurine, 2-aminopyrimidine, 6-hydroxy-2,4,5-triaminopyrimidine.sulfate, 2,4-diamino-6-hydroxypyrimidine, 2-amino-4-hydroxy-6-methylpyrimidine, 4,6-dihydroxypyrimidine, nitroguanidine, 1-hydroxy-1H-benzotriazole.monohydrate, 2-hydroxybenzimidazole and 2-amino-3-hydroxypyridine, forming an electroless copper deposition layer having an average absorption rate of 0.5 or more, and bonding a resin to the electroless copper deposition layer.
Claim 2
Dependent Claim
114 words
A process for treating a surface of a metal which comprises: treating a metal surface with a liquid composition comprising (I) copper ions, a complexing agent for copper ions, a reducing agent for copper ions, a pH adjusting agent, water and (II) at least one nitrogen-containing organic compound selected from the group consisting of 2,4,6-tris(2-pyridyl)-s-triazine, α,α',α"-tripyridyl, 1,10-phenanthroline, 4,7-diphenyl-1, 10-phenanthroline, 4,7-dimethyl-1,10-phenanthroline, 4,7-diphenyl-1,10-phenanthroline disulfonic acid disodium salt, 3-(2-pyridyl)-5,6-diphenyl-1,2,4-triazine, α,α'-dipyridyl, Phthalocyanine Green, 8-azaguanine, xanthopterin, 5-amino-indazole, 2-aminoperimidine.hydrochloride, 2-amino-perimidine.hydrobromide, benzoguanamine, acriflavine.hydrochloride, 5-amino-1H-tetrazole, 6-amino-2-phenyl-4-quinolinol, 2-amino-6,8-dihydroxypurine, 2-aminopyrimidine, 6-hydroxy-2,4,5-triaminopyrimidine.sulfate, 2,4-diamino-6-hydroxypyrimidine, 2-amino-4-hydroxy-6-methylpyrimidine, 4,6-dihydroxypyrimidine, nitroguanidine, 1-hydroxy-1H-benzotriazole.monohydrate, 2-hydroxybenzimidazole and 2-amino-3-hydroxypyridine, forming an electroless copper deposition layer having an average absorption rate of 0.5 or more, and bonding a resin to the electroless copper deposition layer.
Claim 3
Dependent Claim
21 words
A process according to claim 1, wherein the electroless copper deposition layer has an average absorption rate of 0.7 or more.
Claim 4
Dependent Claim
29 words
A process according to claim 1, wherein the nitrogen-containing organic compound is at least one member selected from the group consisting of xanthopterin, 2-aminoperimidine.hydrochloride, 2-aminoperimidine.hydrobromide, 6-hydroxy-2,4,5-triaminopyrimidine.sulfate, 2,4-diamino-6-hydroxypyrimiidine, and nitroguanidine.
Claim 5
Dependent Claim
17 words
A process according to claim 1, wherein the metal surface is formed by a film of copper.
Claim 6
Dependent Claim
22 words
A process according to claim 1, wherein the metal surface is formed by a film of stainless steel, nickel, iron or aluminum.
Claim 7
Dependent Claim
23 words
A process according to claim 1, wherein the amount of the nitrogen-containing organic compound is in the range of 1 to 500 mg/liter.
Claim 8
Dependent Claim
38 words
A process accordin- to claim 1, wherein the nitrogen-containing heterocyclic compound is at least one member selected from the group consisting of 2,4,6-tris(2-pyridyl)-s-triazine, α,α',α"-tripyridyl, 1,10-penanthroline, 4,7-diphenyl-1,10-phenanthroline, 4,7-dimethyl-1,10-phenanthroline, 4,7-diphenyl-1,10-phenanthroline disulfonic acid disodium salt, 3-(2-pyridyl)-5,6-diphenyl-1,2,4-triazone, α,α'-dipyridyl, Phthalocyanine Green and 2,4-dimethylimidazoline.
Claim 9
Dependent Claim
42 words
A process according to claim 1, wherein the organic compound is at least one member selected from the group consisting of 8-azaguanine, xanthopterin, 5-aminoindzole, 2-aminoperimidine.hydrochloride, 2-aminoperimidine.hydrobromide, benzoguanamine, acriflavine. hydrochloride, 5-amino-1H-tetrazole, 6-amino-2-phenyl-4-quinolinol, 2-amino-6,8-dihydroxypurine, 2-aminopyrimidine, 6-hydroxy-2,4,5-triaminopyrimidine.sulfate, 2,4-diamino-6-hydroxypyrimidine, 2-amino-4-hydroxy-6-methylpyrimidine, 4,6-dihydroxypyrimidine, nitroguanidine, 1-hydroxy-1H-benzotriazole.monohydrate, 2-hydroxybenzimidazole and 2-amino-3-hydroxypyridine.
Claim 10
Dependent Claim
47 words
A process according to claim 1, which further comprises treating the electroless copper deposition layer with at least one member selected from the group consisting of ammonia water, an aqueous solution containing a reducing agent and an acid solution prior to bonding a resin to said layer.
Claim 11
Dependent Claim
35 words
A process according to claim 1, which further comprises bonding more resin layers to the electroless copper deposition layer to give a laminate of at least one metal layer and at least two resin layers.
References Cited (Backward Citations)
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