US4548644A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless copper deposition solution
Assignee: Resonac Corp
•
Filing: 1983-09-23
•
Granted: 1985-10-22
•
Expires: 2003-09-23
Abstract
Abstract An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and α,α'-dipyridyl can give a deposited film with high elongation.
Inventors
- 👤 Akishi Nakaso
- 👤 Kiyoshi Yamanoi
- 👤 Toshiro Okamura
- 👤 Yoshiyuki Tsuru
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:00
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
99 words
An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether of the formula: R.sub.1 O--CH.sub.2 CH.sub.2 O).sub.n R.sub.2 wherein R 1 and R 2 are independently hydrogen, an alkyl group having 1 to 4 carbon atoms or an alkenyl group having 1 to 4 carbon atoms but R 1 and R 2 cannot be hydrogen at the same time; and n is 2 or more, and (c) at least one member selected from the group consisting of an inorganic cyanide and α,α'-dipyridyl.
Claim 2
Dependent Claim
99 words
An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether of the formula: R.sub.1 O--CH.sub.2 CH.sub.2 O).sub.n R.sub.2 wherein R 1 and R 2 are independently hydrogen, an alkyl group having 1 to 4 carbon atoms or an alkenyl group having 1 to 4 carbon atoms but R 1 and R 2 cannot be hydrogen at the same time; and n is 2 or more, and (c) at least one member selected from the group consisting of an inorganic cyanide and α,α'-dipyridyl.
Claim 3
Dependent Claim
17 words
An electroless copper deposition solution according to claim 1, wherein the component (c) is an inorganic cyanide.
Claim 4
Dependent Claim
37 words
An electroless copper deposition solution according to claim 2, wherein the inorganic cyanide is contained in an amount of 5 to 100 mg/l. and the polyoxyethylene ether is contained in an amount of 0.1 gl. or more.
Claim 5
Dependent Claim
41 words
An electroless copper deposition solution according to claim 3, wherein the inorganic cyanide is at least one member selected from the group consisting of sodium cyanide, potassium cyanide, sodium ferrocyanide, potassium ferrocyanide, sodium ferricyanide, potassium ferricyanide, potassium nickelcyanide and sodium nitroprusside.
Claim 6
Dependent Claim
15 words
An electroless copper deposition solution according to claim 1, wherein the component (c) is α,α'-dipyridyl.
Claim 7
Dependent Claim
35 words
An electroless copper deposition solution according to claim 5, wherein α,α'-dipyridyl is contained in an amunt of 5 to 300 mg/l and the polyoxyethylene ether is contained in an amount of 0.1 g/l or more.
Claim 8
Dependent Claim
22 words
An electroless copper deposition solution according to claim 1, wherein the component (c) is a mixture of an inorganic cyanide and α,α'-dipyridyl.
Claim 9
Dependent Claim
48 words
An electroless copper deposition solution according to claim 7, wherein the inorganic cyanide is contained in an amount of 0.05 to 5 mg/l, α,α'-dipyridyl is contained in an amount of 5 to 300 ml/l and the polyoxyethylene ether is contained in an amount of 0.1 g/l or more.
Claim 10
Dependent Claim
21 words
An electroless copper deposition solution according to claim 1, wherein the polyoxyethylene ether is a polyoxyethylene monoether or a polyoxyethylene diether.
Claim 11
Dependent Claim
15 words
An electroless copper deposition solution according to claim 1, wherein n is 2 to 200.
Claim 12
Dependent Claim
24 words
An electroless copper deposition solution according to claim 1, wherein the polyoxyethylene ether is contained in an amount of 0.5 g/l to 5 g/l.
Claim 13
Dependent Claim
19 words
An electroless copper deposition solution according to claim 1, wherein said solution has a pH of 11.5 to 13.0.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-21 | 1989-04-22 | 1989-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-21 | 1993-04-22 | 1993-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-21 | 1997-04-22 | 1997-10-22 | $7700.00 | Window Closed / Lapsed |