Process for surface treatment of copper product
Abstract
Abstract A process for surface-treating copper products, for example, a copper foil to be used for a copper-clad laminate, the resulting surface-treated copper product having a superior bond strength to a base material, resistant to etching solution, acids, etc., is provided, which process comprises electrically depositing a binary alloy consisting of 95 to 20% by weight of zinc and 5 to 80% by weight of nickel, on the surface of a copper product to form a coating layer, followed by laminating the resulting copper product onto a base material under heating and pressure, said binary alloy being converted during the lamination into a ternary alloy of zinc, nickel and copper constituting a boundary layer having a superior bond strength between the copper product and the base material.
Inventors
- 👤 Kuniki Ueno
- 👤 Naotomi Takahashi
Bibliographic Details
Claims Analysis
Total Claims: 8References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-02 | 1990-08-04 | 1991-02-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-02 | 1994-08-04 | 1995-02-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-02 | 1998-08-04 | 1999-02-03 | $7700.00 | Window Closed / Lapsed |