Patent US4927684A successfully refreshed from Google Patents.
US4456508A
Expired / Lapsed
US
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Treatment of copper foil
Assignee: ELECTROFOILS TECHNOLOGY Ltd
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Filing: 1982-02-25
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Granted: 1984-06-26
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Expires: 2002-02-25
Abstract
Abstract A method of treating copper foil for use in the production of printed circuit boards includes the step of depositing onto the copper foil a layer containing nodular or dendritic zinc in such a manner as to increase the bond strength of the foil with a base material compared with untreated foil.
Inventors
- 👤 John Torday
- 👤 Michael E. Bush
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:26
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/627; B; B32; B32B; B32B15/00; B32B15/04; B32B15/043; B32B15/20; B32B37/00; B32B37/14; B32B37/24; C25D5/10; C25D5/60; C25D5/605; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/384; B32B2037/243; B32B2255/00; B32B2255/06; B32B2255/20; B32B2255/205; B32B2307/00; B32B2307/20; B32B2307/204; B32B2310/00; B32B2310/021; B32B2311/00; B32B2311/12; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12472
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
39 words
A method of treating a copper foil characterized by the step of electrodepositing onto the foil at least one nodular or dendritic layer containing zinc whereby the bond strength of the foil with an associated base material is improved.
Claim 2
Independent Claim
39 words
A method of treating a copper foil characterized by the step of electrodepositing onto the foil at least one nodular or dendritic layer containing zinc whereby the bond strength of the foil with an associated base material is improved.
Claim 3
Dependent Claim
18 words
A method of treating copper foil according to claim 1 wherein said nodular or dendritic layer is zinc.
Claim 4
Dependent Claim
42 words
A method of treating copper foil according to claim 2 including the steps of electrodepositing a nodular or dendritic layer of zinc directly onto a matt surface of the foil and thereafter encapsulating said layer with one or more layers of metal.
Claim 5
Dependent Claim
42 words
A method of treating copper foil according to claim 3 in which the metal of said encapsulating layer is one or more from the group of copper, arsenic, bismuth, brass, bronze, nickel, cobalt or zinc, or alloys or co-deposits of said metals.
Claim 6
Dependent Claim
34 words
A method of treating copper foil according to either claim 3 or claim 4 and further including the step of applying over the primary, or the outermost encapsulating layer of further layer containing zinc.
Claim 7
Dependent Claim
21 words
A method of treating copper foil according to claim 5 in which said further layer containing zinc is nodular or dendritic.
Claim 8
Dependent Claim
25 words
A method of treating copper foil according to claim 6 in which the further nodular or dendritic layer is an alloy of zinc and nickel.
Claim 9
Dependent Claim
30 words
A method of treating copper foil according to claim 7 in which the amount of nickel in the alloy of said further layer falls within the range 3 to 15%.
Claim 10
Dependent Claim
76 words
A method of treating copper foil according to claim 8 and comprising the steps of electrodepositing onto a matt surface of the copper foil a first nodular or dendritic layer of zinc, electrodepositing a protective layer of cyanide copper over said first nodular or dendritic layer, electrodepositing an encapsulating layer of pyrophosphate copper over said protective layer of cyanide copper and electrodepositing a further nodular or dendritic layer of zinc nickel alloy over said encapsulating layer.
Claim 11
Dependent Claim
28 words
A method of treating copper foil according to claim 5 and further including the step of electrodepositing a diffusion-inhibiting layer of metal underlying said further layer containing zinc.
Claim 12
Dependent Claim
17 words
A method of treating copper foil according to claim 10 in which the diffusion-inhibiting layer contains arsenic.
Claim 13
Dependent Claim
22 words
A method of treating copper foil according to claim 11 in which the diffusion-inhibiting layer comprises an alloy of copper with arsenic.
Claim 14
Dependent Claim
78 words
A method of treating copper foil according to claim 12 and further comprising the steps of electrodepositing onto a matt surface of the copper foil a first nodular of dendritic layer of zinc, electrodepositing a protective layer of cyanide copper over said first nodular or dendritic layer, electrodepositing a diffusion-inhibiting layer of copper arsenic alloy over said protective layer of cyanide copper and electrodepositing a further nodular or dendritic layer of zinc nickel alloy over said diffusion-inhibiting layer.
Claim 15
Dependent Claim
65 words
A method of treating copper foil according to claim 6 and comprising the steps of electrodepositing onto a matt surface of the copper foil a first nodular or dendritic layer of zinc, electrodepositing a protective layer of cyanide copper over said first nodular or dendritic layer of zinc, and electrodepositing a further nodular or dendritic layer of zinc over said protective layer of cyanide copper.
Claim 16
Dependent Claim
10 words
Copper foil treated according to the method of claim 1.
Claim 17
Dependent Claim
20 words
A laminate comprising a dielectric substrate to which is bonded copper foil treated according to the method of claim 1.
Claim 18
Dependent Claim
30 words
A method of treating copper foil according to claim 12 in which the electrodeposition of copper arsenic alloy is conducted at a current density of 1 to 10 amps/sq. dm.
Claim 19
Dependent Claim
36 words
A method of treating copper foil according to claim 9 in which the electrodeposition of said further nodular or dendritic layer zinc metal alloy is conducted at a current density of 2 to 8 amsp/sq. dm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-06-26 | 1987-12-26 | 1988-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-06-26 | 1991-12-26 | 1992-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-06-26 | 1995-12-26 | 1996-06-26 | $7700.00 | Window Closed / Lapsed |