US4376154A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper foil for a printed circuit and a method for the production thereof
Assignee: Furukawa Circuit Foil Co Ltd
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Filing: 1980-10-22
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Granted: 1983-03-08
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Expires: 2000-10-22
Abstract
Abstract A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.
Inventors
- 👤 Hiroshi Nakatsugawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:32
CPC Classifications
C; C25; C25D; C25D5/00; C25D5/627; B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; C25D3/00; C25D3/02; C25D3/56; C25D3/565; C25D5/10; H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; H05K3/38; H05K3/382; H05K3/384; B32B2311/00; B32B2311/16; B32B2311/20; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12708; Y10T428/12715; Y10T428/12771; Y10T428/12785; Y10T428/12792; Y10T428/12861; Y10T428/12903
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
52 words
Copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises a copper layer, a layer consisting essentially of tin coated on said bonding surface of said copper layer and a layer consisting essentially of vanadium-containing zinc coated on said tin layer.
Claim 2
Dependent Claim
52 words
Copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises a copper layer, a layer consisting essentially of tin coated on said bonding surface of said copper layer and a layer consisting essentially of vanadium-containing zinc coated on said tin layer.
Claim 3
Dependent Claim
33 words
The copper foil for a printed circuit as claimed in claim 1, wherein the vanadium content in the vanadium-containing zinc layer is 0.05 to 10% by weight based on the amount of zinc.
Claim 4
Dependent Claim
33 words
The copper foil for a printed circuit as claimed in claim 2, wherein the vanadium content in the vanadium-containing zinc layer is 0.02 to 6% by weight based on the amount of zinc.
Claim 5
Dependent Claim
24 words
The copper foil for a printed circuit as claimed in claim 1, wherein said vanadium-containing zinc layer has a chromate layer on its surface.
Claim 6
Dependent Claim
33 words
The copper foil for a printed circuit as claimed in claim 4, wherein the vanadium content in the vanadium-containing zinc layer is 0.05 to 10% by weight based on the amount of zinc.
Claim 7
Dependent Claim
33 words
The copper foil for a printed circuit as claimed in claim 5, wherein the vanadium content in the vanadium-containing zinc layer is 0.02 to 6% by weight based on the amount of zinc.
Claim 8
Dependent Claim
40 words
The copper foil for a printed circuit as claimed in any one of claims 1 to 5, wherein said tin layer has a thickness of 0.002 to 0.02μ and said vanadium-containing zinc layer has a thickness of 0.002 to 0.5μ.
Claim 9
Dependent Claim
35 words
The copper foil for a printed circuit as claimed in claim 7, wherein said tin layer has a thickness of 0.005 to 0.015μ and said vanadium-containing zinc layer has a thickness of 0.01 to 0.3μ.
Claim 10
Dependent Claim
61 words
The copper foil for a printed circuit as claimed in any one of claims 1 to 5, wherein a tin layer having a thickness of 0.001 to 0.015μ coats the other surface of said copper layer and a vanadium-containing zinc layer having a thickness of 0.0005 to 0.0015μ is coated on the tin layer which is coated on said other surface.
Claim 11
Dependent Claim
54 words
The copper foil for a printed circuit as claimed in claim 9, wherein said tin layer coated on the other surface of said copper layer has a thickness of about 0.006μ and said vanadium-containing zinc layer coated on the tin layer which is coated on said other surface has a thickness of about 0.001μ.
Claim 12
Independent Claim
52 words
A method for producing copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises coating a tin layer on at least one side of a copper layer by electroplating and coating a vanadium-containing zinc layer on said tin layer by electroplating.
Claim 13
Independent Claim
52 words
A method for producing copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises coating a tin layer on at least one side of a copper layer by electroplating and coating a vanadium-containing zinc layer on said tin layer by electroplating.
Claim 14
Dependent Claim
32 words
The method as claimed in claim 11, wherein the step of forming a tin layer by electroplating is carried out with use of an alkaline stannate solution as the tin plating solution.
Claim 15
Dependent Claim
33 words
The method as claimed in claim 11, wherein the step of forming a vanadium-containing zinc layer is carried out with use of a zinc plating solution in which a vanadium compound is dissolved.
Claim 16
Dependent Claim
20 words
The method as claimed in claim 13, wherein the zinc plating solution is an alkaline solution of a zinc salt.
Claim 17
Independent Claim
40 words
The method as claimed in any one of claims 11 to 14, wherein the step of forming a vanadium-containing zinc layer is followed by a step of treating the surface of said vanadium-containing zinc layer with a chromic acid-containing solution.
Claim 18
Dependent Claim
19 words
The method as claimed in claim 15, wherein said chromic acid-containing solution is an alkaline solution of chromic acid.
Claim 19
Dependent Claim
32 words
The copper foil for a printed circuit as claimed in claim 8, wherein said vanadium-containing zinc layer has been given a chromate treatment by contacting said vanadium-containing zinc layer with chromic acid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-03-07 | 1986-09-06 | 1987-03-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-03-07 | 1990-09-06 | 1991-03-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-03-07 | 1994-09-06 | 1995-03-08 | $7700.00 | Window Closed / Lapsed |