Patent US4640718A successfully refreshed from Google Patents.
US4640718A
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Process for accelerating Pd/Sn seeds for electroless copper plating
Assignee: International Business Machines Corp
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Filing: 1985-10-29
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Granted: 1987-02-03
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Expires: 2005-10-29
Abstract
Abstract Pd/Sn seeds for use in electroless copper plating are accelerated by treating them with an alkali metal hydroxide at a pH of about 11.3 and at a temperature above 50° C.
Inventors
- 👤 Patrick R. Alnot
- 👤 Daniel J. Auerbach
- 👤 Christopher R. Brundle
- 👤 Dolores C. Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 13:32
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
55 words
A process for accelerating Pd/Sn seeds to be used for electroless copper plating, said process comprising treating said seeds with an aqueous solution of alkali metal hydroxide at a pH of about 11.3 and at a temperature of above 50° C., thereby selectively removing Sn from the surface of the seeds and leaving the Pd.
Claim 2
Dependent Claim
55 words
A process for accelerating Pd/Sn seeds to be used for electroless copper plating, said process comprising treating said seeds with an aqueous solution of alkali metal hydroxide at a pH of about 11.3 and at a temperature of above 50° C., thereby selectively removing Sn from the surface of the seeds and leaving the Pd.
Claim 3
Dependent Claim
15 words
A process as claimed in claim 1, wherein the aqueous metal hydroxide is sodium hydroxide.
Claim 4
Dependent Claim
17 words
A process as claimed in claim 1, wherein the sodium hydroxide is at a concentration of 0.005%.
Claim 5
Dependent Claim
13 words
A process as claimed in claim 1, wherein the temperature is 73° C.
Claim 6
Dependent Claim
16 words
A process as claimed in claim 1, wherein the seeds are on an epoxy resin substrate.
References Cited (Backward Citations)
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Cited
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US4187198A
Cited
US4085066A
Cited
US4201825A
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US4600699A
Cited
JPS59155602A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-02-02 | 1990-08-04 | 1991-02-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-02-02 | 1994-08-04 | 1995-02-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-02-02 | 1998-08-04 | 1999-02-03 | $7700.00 | Window Closed / Lapsed |