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US4632806A Expired / Lapsed US ⏱️ 0.0 years remaining

Copper alloy having high resistance to oxidation for use in leads on semiconductor devices

Assignee: Fujitsu Ltd
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Filing: 1984-12-17
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Granted: 1986-12-30
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Expires: 2004-12-17
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Abstract

Abstract A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

Inventors

  • 👤 Masaki Morikawa
  • 👤 Hideaki Yoshida
  • 👤 Kunio Kishida

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 22:04
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/04; B; B32; B32B; B32B15/00; B32B15/01; C22C9/05; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/929; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12903

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 43 words
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices, which consists essentially of 7-15% Mn, 10-25.5% Zn, 0.2-10% Ni, 0.1-3% Al, 0.2-3% of Sn, the percentage being by weight, with the balance being Cu and incidental impurities.
Claim 2
Dependent Claim 43 words
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices, which consists essentially of 7-15% Mn, 10-25.5% Zn, 0.2-10% Ni, 0.1-3% Al, 0.2-3% of Sn, the percentage being by weight, with the balance being Cu and incidental impurities.
Claim 3
Dependent Claim 41 words
The copper alloy having high resistance to oxidation for use in leads on semiconductor devices of claim 1 which also contains at least one of Fe and Co, the total of said Sn, fe and Co being from 0.2 to 3%.

References Cited (Backward Citations)

SU310765A1 Cited
JPS55141540A Cited
US4242132A Cited
JPS5754239A Cited
US4525434A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-12-29 1990-06-30 1990-12-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-12-29 1994-06-30 1994-12-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-12-29 1998-06-30 1998-12-30 $7700.00 Window Closed / Lapsed

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