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US4622082A Expired / Lapsed US ⏱️ 0.0 years remaining

Conditioned semiconductor substrates

Assignee: SunEdison Inc
•
Filing: 1984-06-25
•
Granted: 1986-11-11
•
Expires: 2004-06-25
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Abstract

Abstract N+ type semiconductor substrates containing oxygen are thermally treated to enhance internal gettering capabilities by heating at 1050 DEG to 1200 DEG C., then at 500 DEG to 900 DEG C. and finally at 950 DEG to 1250 DEG C.

Inventors

  • 👤 William Dyson
  • 👤 Jon A. Rossi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 14:35
CPC Classifications
H; H10; H10P; H10P36/00; H10P36/20; Y; Y10; Y10S; Y10S148/00; Y10S148/06

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 70 words
A process for thermally conditioning oxygen containing n+ type semiconductor materials to enhance their internal gettering characteristics comprising heating said material at a temperature of 1050° to 1200° C. in an oxidizing atmosphere for a sufficient period of time to denude the surface region of oxygen and then at a temeprature of 500° to 900° C. in a reducing atmosphere for a sufficient period of time to nucleate the oxygen.
Claim 2
Dependent Claim 70 words
A process for thermally conditioning oxygen containing n+ type semiconductor materials to enhance their internal gettering characteristics comprising heating said material at a temperature of 1050° to 1200° C. in an oxidizing atmosphere for a sufficient period of time to denude the surface region of oxygen and then at a temeprature of 500° to 900° C. in a reducing atmosphere for a sufficient period of time to nucleate the oxygen.
Claim 3
Dependent Claim 16 words
The process of claim 1 wherein said semiconductor material has a polysilicon layer on the backside.
Claim 4
Dependent Claim 17 words
The process of claim 2 wherein said polysilicon layer has a thickness of 0.05 to 2.0 microns.
Claim 5
Dependent Claim 13 words
The process of claim 1 wherein said semiconductor material is n+ type silicon.
Claim 6
Dependent Claim 10 words
The process of claim 4 wherein said silicon contains antimony.
Claim 7
Dependent Claim 14 words
The process of claim 5 wherein said silicon contains 10 to 40 ppma oxygen.
Claim 8
Dependent Claim 32 words
The process of claim 1 further comprising heating said material at a temperature of 900° to 1150° C. in an inert atmosphere for a sufficient period of time to precipitate the oxygen.
Claim 9
Dependent Claim 39 words
The process of claim 1 wherein said sufficient period of time to denude the surface region of oxygen is 15 minutes to 6 hours and said sufficient period of time to nucleate the oxygen is at least 30 minutes.
Claim 10
Dependent Claim 20 words
The process of claim 7 wherein said sufficient period of time to precipitate the oxygen is up to 12 hours.
Claim 11
Dependent Claim 11 words
The process of claim 7 wherein said inert atmosphere is nitrogen.

References Cited (Backward Citations)

US4053335A Cited
EP0030457A2 Cited
US4376657A Cited
GB2080780A Cited
EP0066461A2 Cited
JPS57211737A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-11-10 1990-05-12 1990-11-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-11-10 1994-05-12 1994-11-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-11-10 1998-05-12 1998-11-11 $7700.00 Window Closed / Lapsed

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